Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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STMicroelectronics TTV27C256N-15C-11 is a 32KX8 EPROM with 150ns access time, 5V supply voltage, and 3-state output. Ideal for automotive applications due to its CMOS technology and through-hole terminal form.
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$4.154
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$2.641
This material ensures high durability and reliability, making the product suitable for harsh environments.
Allows for independent operation and flexibility in accessing and storing data.
Compatibility with standard voltage levels, ensuring easy integration into existing systems.
Sufficient number of terminals for connectivity and data transfer requirements.
Enables multiple devices to be connected to a single bus line, enhancing efficiency and reducing complexity.
Low power consumption and high noise immunity, making the product energy efficient and reliable.
Quick access to data, improving overall system performance and responsiveness.
EPROM TTV27C256N-15C-11 attributes and parameters. Explore more EPROM devices from STMicroelectronics
Maximum Access Time:
Input/Output Type:
JESD-30 Code:
Length:
Memory Density:
Memory IC Type:
Memory Width:
No. of Functions:
No. of Terminals:
No. of Words:
No. of Words Code:
Operating Mode:
Maximum Operating Temperature:
Minimum Operating Temperature:
Organization:
Output Characteristics:
Package Body Material:
Package Code:
Package Equivalence Code:
Package Shape:
Package Style (Meter):
Parallel or Serial:
Programming Voltage (V):
Maximum Seated Height:
Maximum Standby Current:
Maximum Supply Current:
Maximum Supply Voltage (Vsup):
Minimum Supply Voltage (Vsup):
Nominal Supply Voltage / Vsup (V):
Surface Mount:
Technology:
Temperature Grade:
Terminal Form:
Terminal Pitch:
Terminal Position:
Width:
TTV27C256N-15C-11 Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.61
SB
8542.32.00.60
STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.
President, CEO
Jean-Marc Chery
President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience
Lorenzo Grandi
President, Sales & Marketing
Jerome Roux
Castelletto
Fabrication
Fab Initiation
1968
Italy
Wafer Capacity
SGFAB AMK 6
2000
Singapore
29,000
AG200
Agrate Brianza
14,000
RST 8
France
Rousset
35,000
Crolles 1
1993
Crolles
30,000
Crolles 2-ext. mod 5
Crolles 2-ext. mod 2
2022
Crolles 2-ext. mod 3
2023
Crolles 2
2004
28,000
1985
SiC Fab
2006
Sweden
Norrköping
10,000
Fab 3
2005
Tours
2,000
Fab 1 & Fab 2
1978
55,000
Fab 2
1997
Catania
SGFAB-AMK 6E
2003
145,000
SGFAB-AMJ 9
1984
152,000
AG300 (R3)
1980
25,000
1987
34,000
AG300
2024
Crolles 2-ext. mod 1
2020
Fab 1 6-inch fab
2013
11,000
SiC 6-inch line
2021
2,500
200mm GaN
2018
SGFAB-AMK 8
2001
Crolles 2- JV Fab
SGFAB-AMK 6
2016
38,125
SGFAB-AMK 2E
2010
20,000
Silicon Carbide A.B.
SiC wafer/EPI Fab
SiC Device Fab
2025
SZNUP2105LT1G
Onsemi
SZNUP2105LT1G by Onsemi is a Transient Suppression Device with 2 elements in a common anode configuration. It has a max non-repetitive peak reverse power dissipation of 350W and breakdown voltage of 29.1V. Ideal for applications requiring bidirectional polarity protection, such as automotive electronics and industrial equipment due to its AEC-Q101 compliance and high clamping voltage of 44V.
1N4148
Semitron
RECTIFIER DIODE; Surface Mount: NO; JESD-609 Code: e0; Maximum Output Current: .15 A; Maximum Operating Temperature: 200 Cel; Maximum Reverse Recovery Time: .004 us;
LM358N
Fairchild Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
EEAGA1H4R7
Panasonic
Panasonic EEAGA1H4R7 is a 4.7uF, 50V Aluminum Electrolytic Capacitor with 0.1 Tan Delta and 0.003mA Leakage Current. Ideal for applications requiring high ripple current handling in temperatures ranging from -55 to 105°C.
BSS138
Micro Commercial Components
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Package Shape: RECTANGULAR; Terminal Position: DUAL;
DS18B20U
Dallas Semiconductor
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Shape or Style: RECTANGULAR; Minimum Operating Temperature: -55 Cel; Package Equivalence Code: TSSOP8,.19;
SMBJ18CA
Leshan Radio
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM107H
Advanced Micro Devices
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Maximum Bias Current (IIB) @25C: .075 uA;
Hitano Enterprise
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
BAV99
Bkc Semiconductors
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
2N7002
Changzhou Galaxy Century Microelectronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Minimum DS Breakdown Voltage: 60 V; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; No. of Terminals: 3;
2N2222A
Small Signal Bipolar Transistors; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; JESD-609 Code: e0;
World Products
SN65HVD230DR
Texas Instruments
SN65HVD230DR by Texas Instruments is a BICMOS technology interface circuit with 1Mbps data rate, suitable for industrial applications. It operates at 3.3V, has 8 terminals in a small outline package, and can withstand temperatures from -40 to 85°C.
LL4148
RECTIFIER DIODE; Surface Mount: YES; Maximum Non Repetitive Peak Forward Current: 2 A; Maximum Reverse Recovery Time: .004 us; No. of Phases: 1; Maximum Operating Temperature: 175 Cel;
Gec Plessey Semiconductors
Microchip Technology
BSS138-7-F
Diodes Incorporated
Diodes Inc. BSS138-7-F is a N-channel FET with 50V DS breakdown voltage, 0.2A max drain current, and 3.5 ohm RDS(on). Ideal for switching applications in small outline packages with matte tin finish, operating up to 150°C peak reflow temp.
LM555CM
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
Silicon Transistor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
TMS27C210A-15JE4
TMS27C210A-15JE4 by Texas Instruments is a 64KX16 EPROM with 3-STATE output, operating at -40 to 85 °C. It has a supply voltage of 4.5-5.5V and max access time of 150ns. Ideal for industrial applications requiring reliable non-volatile memory storage in a compact IN-LINE package.
SMJ27C512-15J
SMJ27C512-15J by Texas Instruments is a 64KX8 EPROM with 150ns access time, operating at 5V. It has MILITARY grade temperature range of -55 to 125 °C and uses CMOS technology. Ideal for applications requiring reliable non-volatile memory storage in harsh environments.
TMS27C210A-200JE4
TMS27C210A-200JE4 by Texas Instruments is a 64KX16 EPROM with 3-STATE output, operating at -40 to 85 °C. It has a supply voltage of 4.75-5.25V and max access time of 200ns. Ideal for industrial applications requiring reliable non-volatile memory storage in a compact IN-LINE package.
EPC2TC32
Altera
CONFIGURATION MEMORY; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: TQFP; Package Shape: SQUARE; Parallel or Serial: SERIAL;
TMS27C64JE
TMS27C64JE by Texas Instruments is an 8KX8 EPROM with 250ns access time, 5V supply voltage, and 3-STATE output. It is ideal for industrial applications requiring reliable non-volatile memory storage in a compact IN-LINE package style.
TMX27C512-25JL
TMX27C512-25JL by Texas Instruments is a 64KX8 EPROM with 250ns access time, operating at 5V. It features a 28-terminal IN-LINE package and supports asynchronous operation. Ideal for commercial applications requiring reliable non-volatile memory storage.
M27C512-12F3
STMicroelectronics
M27C512-12F3 EPROM by STMicroelectronics features 64KX8 organization, 120 ns access time, and 5V nominal voltage. Commonly used in automotive applications, this CMOS technology memory IC has a memory density of 524288 bit and operates in parallel mode with a max standby current of 0.0001 Amp.
TMS276420JP4
TMS276420JP4 by Texas Instruments is an 8KX8 EPROM with 65536 bit memory density. It operates at 5V, has a max access time of 200ns, and uses NMOS technology. Commonly used in applications requiring fast and reliable non-volatile memory storage.
SMJ27C256-17J
The Texas Instruments SMJ27C256-17J is a 32Kx8 EPROM with 170ns access time, operating at 5V. It features a ceramic, metal-sealed co-fired package and operates in asynchronous mode. Ideal for military applications requiring reliable memory storage in harsh environments.
TMS27C512-30JE
TMS27C512-30JE by Texas Instruments is a 64KX8 EPROM with 300 ns access time, operating at 5V. It features a CMOS technology, 3-STATE output characteristics, and INDUSTRIAL temperature grade. Ideal for applications requiring fast memory access in industrial settings.
TMS27LV010A-25JE
TMS27LV010A-25JE by Texas Instruments is a 128KX8 EPROM with 3.3V nominal voltage, operating in industrial temperature range. It features 250 ns access time, 1048576 bit memory density, and 32 terminals in an IN-LINE package style. Ideal for applications requiring fast data retrieval and non-volatile memory storage.
TMS27C240-10JE4
TMS27C240-10JE4 by Texas Instruments is a 256KX16 EPROM with 3-STATE output, operating at 5V. It features a max access time of 100ns and is ideal for industrial applications requiring reliable non-volatile memory storage in a compact IN-LINE package.
TMS27C510-17JE4
TMS27C510-17JE4 by Texas Instruments is a 64KX8 EPROM with 170 ns access time, 3-STATE output, and operates at -40 to 85 °C. It is used in industrial applications for storing data securely with a memory density of 524288 bit.
5962-8961403MYC
STMicroelectronics' 5962-8961403MYC EPROM features 128KX8 organization, operates at -55 to 125 °C, with a supply voltage of 4.5-5.5 V. Ideal for military applications due to MIL-STD-883 screening level and UVPROM memory IC type.
TMS27C020-15JE4
TMS27C020-15JE4 by Texas Instruments is a 256KX8 EPROM with 150 ns access time, 3-STATE output, and operates at -40 to 85 °C. It is used in industrial applications for storing data parallelly with a memory density of 2097152 bit.
M27C1001-20L6TR
M27C1001-20L6TR by STMicroelectronics is an EPROM with 128KX8 organization, 120 ns access time, and 3-STATE output. It operates at a voltage of 5V and is suitable for industrial applications requiring reliable non-volatile memory storage in a compact chip carrier package.
TMS27C010A-20JE
TMS27C010A-20JE by Texas Instruments is a 128KX8 EPROM with 200 ns access time, operating at 5V. It features 3-STATE output and INDUSTRIAL temperature grade. Commonly used in embedded systems for program storage due to its high memory density and parallel interface.
5962-9175205MXX
Texas Instruments' 5962-9175205MXX EPROM operates asynchronously with a supply voltage of 5V. It features 512KX8 organization, 524288 words, and a memory width of 8. Ideal for military applications due to its MIL-Grade technology and wide temperature range from -55°C to 125°C.
TMS27C240-100JL4
TMS27C240-100JL4 by Texas Instruments is a 256KX16 EPROM with 100 ns access time, 3-STATE output, and CMOS technology. It operates at 5V and has a memory density of 4194304 bit. Commonly used in commercial applications requiring fast parallel memory access.
TMS27C512-30JL
TMS27C512-30JL by Texas Instruments is a 64KX8 EPROM with 300 ns access time, operating at 5V. It features 3-STATE output characteristics and uses CMOS technology. Commonly used in commercial applications for parallel data storage due to its 524288 bit memory density.
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TTV27C256N-12C-33
UVPROM; Temperature Grade: COMMERCIAL; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Maximum Operating Temperature: 70 Cel;
TTV27C256N-12C-25
UVPROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Programming Voltage (V): 12.75;
TTV27C256N-15C-13
UVPROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 28; Package Code: WDIP; Package Shape: RECTANGULAR; Package Style (Meter): IN-LINE, WINDOW;
TTV27C256N-15C-4
UVPROM; Temperature Grade: COMMERCIAL; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 5.5 V;
TTV27C256N-12C-24
UVPROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Package Style (Meter): IN-LINE, WINDOW;
TTV27C256N-12C-20
UVPROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Maximum Seated Height: 5.72 mm;
TTV27C256N-12M-11
UVPROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 28; Package Code: WDIP; Package Shape: RECTANGULAR; JESD-30 Code: R-GDIP-T28;
TTV27C256N-12M-10
UVPROM; Temperature Grade: AUTOMOTIVE; No. of Terminals: 28; Package Code: WDIP; Package Shape: RECTANGULAR; Surface Mount: NO;
TTV27C256N-12C-21
UVPROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Maximum Access Time: 120 ns;
TTV27C256N-15C-10
UVPROM; Temperature Grade: COMMERCIAL; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Length: 36.92 mm;
TTV27C256N-12M-8
TTV27C256N-12C-23
UVPROM; Temperature Grade: AUTOMOTIVE; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Parallel or Serial: PARALLEL;
TTV27C256N-15C-12
UVPROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Maximum Access Time: 150 ns;
TTV27C256N-12C-19
UVPROM; Temperature Grade: AUTOMOTIVE; No. of Terminals: 28; Package Code: WDIP; Package Shape: RECTANGULAR; Terminal Position: DUAL;
TTV27C256N-12C-17
UVPROM; Temperature Grade: COMMERCIAL; No. of Terminals: 28; Package Code: WDIP; Package Shape: RECTANGULAR; Terminal Form: THROUGH-HOLE;
TTV27C256N-12C-15
UVPROM; Temperature Grade: COMMERCIAL; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Width: 15.26 mm;
TTV27C256N-12C-18
UVPROM; Temperature Grade: AUTOMOTIVE; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Maximum Access Time: 120 ns;
TTV27C256N-12C-22
UVPROM; Temperature Grade: COMMERCIAL; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Minimum Operating Temperature: 0 Cel;
TTV27C256N-12M-9
Twilight Technology
UVPROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Terminal Position: DUAL;
Supply Digital Components
$106.00
$54.25
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12,000 In-Stock
Total price ≈ $80,197.29
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