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TSH84IPT

STMicroelectronics

TSH84IPT by STMicroelectronics

TSH84IPT by STMicroelectronics is a dual operational amplifier in a compact 14-terminal SOIC package, ideal for industrial applications. It features a max reflow temp of 260 °C and operates at a height of just 1.2 mm. Its nickel/palladium/gold terminals ensure reliable performance.

Median Price

-

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,065 parts In-Stock

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6,065

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A2Z Electronics, Inc.

USA . 2,050 parts In-Stock

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2,050

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Bristol Electronics

USA . 2,050 parts In-Stock

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2,050

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Digiode

USA . 1,905 parts In-Stock

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1,905

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ComSIT Distribution GmbH

Germany . 1,500 parts In-Stock

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1,500

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Anansix

USA . 1,495 parts In-Stock

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1,495

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Dan-Mar Components

USA . 853 parts In-Stock

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853

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Atlantic Semiconductor

USA . 24 parts In-Stock

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IDEA Electronic Components Group

UK . 356 parts In-Stock

1+ parts

$1.126

100+ parts

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$1.013

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356

$1.126

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$1.013

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MKK Technologies

India . 1,250 parts In-Stock

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$2.118

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$2.118

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DigiPath Technology Company

USA . 1,250 parts In-Stock

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$2.118

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$2.118

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Microchip USA

USA . 276 parts In-Stock

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$8.473

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276

$8.473

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AZTECH Wire

Italy . 1,015 parts In-Stock

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$18.530

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$18.530

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Perfect Parts

USA . 7,086 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,466 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Corphita

USA . 2,653 parts In-Stock

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2,653

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Parana Technologies

USA . 2,001 parts In-Stock

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$1.346

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2,001

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$1.346

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Vigor

Singapore . 1,981 parts In-Stock

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1,981

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Overview

Unlock the power of precision with the TSH84IPT by STMicroelectronics, a top-tier operational amplifier designed for superior performance in demanding applications. Renowned for their quality and reliability, STMicroelectronics ensures that each component meets the highest industry standards. With its compact design and advanced features, the TSH84IPT delivers exceptional value, making it ideal for automation, industrial control, and consumer electronics—empowering your projects with unparalleled efficiency and reliability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides a durable and lightweight solution, ensuring reliable performance in various applications.

Surface Mount: YES

Surface mount technology allows for efficient use of board space and enhances manufacturing process efficiency.

Package Shape: RECTANGULAR

The rectangular shape maximizes board layout efficiency, making it easier to integrate into various designs.

No. of Terminals: 14

With 14 terminals, this op amp offers versatility in connections, accommodating a wide range of applications.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile contribute to lower weight and smaller footprints, ideal for compact devices.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

This high-quality terminal finish ensures excellent conductivity and corrosion resistance, enhancing overall reliability.

Terminal Position: DUAL

Dual terminal positioning allows for simplified circuit design and improved layout versatility.

Maximum Seated Height: 1.2 mm

A low maximum seated height helps to reduce the profile of the device, beneficial for space-constrained environments.

Width: 4.4 mm

A compact width facilitates denser circuit packing and enables use in small electronic applications.

Maximum Time At Peak Reflow Temperature (s): 40

A higher tolerance for peak reflow temperature times balances the soldering process, enhancing assembly reliability.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C ensures compatibility with modern reflow soldering techniques and materials.

Length: 5 mm

The small length aids in minimizing overall device size, crucial for portable electronic applications.

Temperature Grade: INDUSTRIAL

Rated for industrial temperature ranges, this op amp is suitable for robust applications in challenging environments.

Terminal Form: GULL WING

Gull wing terminal form enhances solder joint reliability and provides excellent mechanical strength.

Terminal Pitch: 0.65 mm

A smaller terminal pitch allows for a more compact design, making it ideal for high-density applications.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates moderate sensitivity, ensuring proper handling during manufacturing and assembly.

Technical Specifications

Operational Amplifiers (Op Amps) TSH84IPT attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from STMicroelectronics

Amplifier Characteristics

Amplifier Type:

Total Functions:

1

Sub-Category:

Operational Amplifiers

Operational Characteristics

Peak Reflow Temperature:

260 °C (500 °F)

Reflow Peak Time Limit:

40 s

Physical Characteristics

Length:

0.197 in (5 mm)

Width:

0.173 in (4.4 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Total Terminals:

14

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel/Palladium/Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

3

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Packaging and Shipping

Package Code:

Package Shape:

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Trade Compliance

TSH84IPT Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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