Loading...

TSH80IYD

STMicroelectronics

TSH80IYD by STMicroelectronics

TSH80IYD by STMicroelectronics is an industrial-grade operational amplifier in a compact 8-terminal SO package. It features a peak reflow temp of 260 °C, max seated height of 1.75mm, and nickel/palladium/gold terminals. Ideal for precision signal processing applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,878 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,878

-

-

-

-

Digiode

USA . 2,568 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,568

-

-

-

-

Anansix

USA . 2,040 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,040

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 850 parts In-Stock

1+ parts

$5.664

100+ parts

-

1k+ parts

$5.098

10k+ parts

-

850

$5.664

-

$5.098

-

MKK Technologies

India . 2,086 parts In-Stock

1+ parts

$10.652

100+ parts

-

1k+ parts

-

10k+ parts

-

2,086

$10.652

-

-

-

DigiPath Technology Company

USA . 2,086 parts In-Stock

1+ parts

$10.652

100+ parts

-

1k+ parts

-

10k+ parts

-

2,086

$10.652

-

-

-

Corphita

USA . 3,526 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,526

-

-

-

-

Parana Technologies

USA . 339 parts In-Stock

1+ parts

-

100+ parts

$6.773

1k+ parts

-

10k+ parts

-

339

-

$6.773

-

-

Overview

Unlock unparalleled performance with the TSH80IYD from STMicroelectronics, a leader in innovation and quality. This compact operational amplifier excels in stability and precision, making it ideal for industrial applications where reliability is paramount. Designed for seamless integration, it boasts exceptional thermal management and durability, ensuring your projects achieve peak efficiency. Trust STMicroelectronics for unmatched value, empowering your designs with superior technology tailored to elevate your success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable material provides protection against environmental factors, ensuring reliability in various applications.

Surface Mount: YES

The surface mount capability allows for compact PCB designs and automated assembly, making it ideal for high-density applications.

Package Shape: RECTANGULAR

The rectangular shape facilitates efficient space utilization on the PCB while providing ease of handling during assembly.

No. of Terminals: 8

With 8 terminals, this op amp can support a variety of configurations and functionalities, enhancing its versatility.

Package Style (Meter): SMALL OUTLINE

The small outline package style is well-suited for low-profile designs, making it an excellent choice for portable devices.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The premium terminal finish provides excellent solderability and corrosion resistance, ensuring a long-lasting connection.

Terminal Position: DUAL

Dual terminal position allows for effective routing on the PCB, accommodating diverse layout designs.

Maximum Seated Height: 1.75 mm

A low seated height supports slim designs, making the op amp suitable for compact electronic devices.

Width: 3.9 mm

The narrow width enables placement in tight spaces within the PCB layout, boosting design flexibility.

Maximum Time At Peak Reflow Temperature (s): 40

A maximum reflow time of 40 seconds allows for efficient soldering without risking component damage, maintaining product integrity.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C ensures compatibility with most modern soldering processes and materials.

Length: 4.9 mm

A compact length contributes to space efficiency, which is crucial in modern electronic applications.

Temperature Grade: INDUSTRIAL

Designed for industrial temperature ranges, this op amp can operate reliably in demanding environments.

Terminal Form: GULL WING

Gull wing terminals provide excellent mechanical strength and reliable solder joints, enhancing long-term performance.

Amplifier Type: OPERATIONAL AMPLIFIER

Being an operational amplifier, it is versatile for signal amplification in various electronic circuits, making it highly useful.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch is compatible with a wide range of PCB spacing, ensuring easy integration into existing designs.

Technical Specifications

Operational Amplifiers (Op Amps) TSH80IYD attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from STMicroelectronics

Amplifier Characteristics

Amplifier Type:

Total Functions:

1

Sub-Category:

Operational Amplifiers

Operational Characteristics

Peak Reflow Temperature:

260 °C (500 °F)

Reflow Peak Time Limit:

40 s

Physical Characteristics

Length:

0.193 in (4.9 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

8

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel/Palladium/Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Packaging and Shipping

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Trade Compliance

TSH80IYD Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 19