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TSH80IYDT

STMicroelectronics

TSH80IYDT by STMicroelectronics

TSH80IYDT by STMicroelectronics is an industrial-grade operational amplifier in a compact 8-terminal SO package. It features a peak reflow temp of 260 °C and a max seated height of just 1.75 mm, ideal for space-constrained applications like sensors and signal processing. Its nickel palladium gold finish ensures reliable performance in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,522 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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7,522

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-

-

-

Digiode

USA . 2,306 parts In-Stock

1+ parts

-

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-

1k+ parts

-

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2,306

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-

-

-

Greenchips

USA . 2,125 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,125

-

-

-

-

SIE Connect GmbH - GreenChips

Germany . 2,125 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,125

-

-

-

-

Anansix

USA . 1,397 parts In-Stock

1+ parts

-

100+ parts

-

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1,397

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-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 1,134 parts In-Stock

1+ parts

$0.560

100+ parts

-

1k+ parts

-

10k+ parts

-

1,134

$0.560

-

-

-

IDEA Electronic Components Group

UK . 154 parts In-Stock

1+ parts

$1.884

100+ parts

-

1k+ parts

$1.696

10k+ parts

-

154

$1.884

-

$1.696

-

MKK Technologies

India . 916 parts In-Stock

1+ parts

$3.543

100+ parts

-

1k+ parts

-

10k+ parts

-

916

$3.543

-

-

-

DigiPath Technology Company

USA . 916 parts In-Stock

1+ parts

$3.543

100+ parts

-

1k+ parts

-

10k+ parts

-

916

$3.543

-

-

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AZTECH Wire

Italy . 828 parts In-Stock

1+ parts

$21.000

100+ parts

-

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10k+ parts

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828

$21.000

-

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QUARKTWIN TECHNOLOGY LTD

USA . 11,832 parts In-Stock

1+ parts

-

100+ parts

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11,832

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Kepictronics

USA . 5,089 parts In-Stock

1+ parts

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5,089

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Microchip USA

USA . 4,075 parts In-Stock

1+ parts

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4,075

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Corphita

USA . 3,760 parts In-Stock

1+ parts

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3,760

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

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3,000

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Perfect Parts

USA . 2,645 parts In-Stock

1+ parts

-

100+ parts

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2,645

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A-Z Elektronik GmbH

Germany . 1,526 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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1,526

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Parana Technologies

USA . 233 parts In-Stock

1+ parts

-

100+ parts

$2.253

1k+ parts

-

10k+ parts

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233

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$2.253

-

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Overview

Elevate your projects with the TSH80IYDT from STMicroelectronics—where quality meets innovation. This compact operational amplifier is designed for reliability across various applications, from industrial automation to consumer electronics. With STMicroelectronics' renowned expertise, you can trust in superior performance and exceptional durability. Experience unmatched operational efficiency while maximizing design flexibility, empowering you to create cutting-edge solutions with ease.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy body material ensures reliability and longevity, making it suitable for various industrial applications.

Surface Mount: YES

Surface mount capability allows for compact designs, enabling efficient use of PCB space and easier integration into modern electronics.

Package Shape: RECTANGULAR

The rectangular shape provides uniformity in placement and is compatible with standard PCB layouts, simplifying assembly.

No. of Terminals: 8

An 8-terminal configuration supports a range of functions and increases the versatility of the operational amplifier in circuit designs.

Package Style (Meter): SMALL OUTLINE

The small outline package minimizes space requirements and is ideal for high-density circuit board designs.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish enhances the reliability and performance of connections, ensuring consistent electrical conductivity.

Terminal Position: DUAL

Dual terminal positioning allows for symmetrical layout options, facilitating easier integration into existing designs.

Maximum Seated Height: 1.75 mm

A low maximum seated height ensures compatibility with compact electronic designs, maintaining low-profile assembly.

Width: 3.9 mm

The compact width contributes to efficient placement on PCB, making it ideal for space-constrained applications.

Peak Reflow Temperature °C: 260

A high peak reflow temperature capability allows the amplifier to withstand modern soldering processes without degradation.

Length: 4.9 mm

The short length supports high-density layout designs, making it suitable for advanced electronic projects.

Temperature Grade: INDUSTRIAL

Rated for industrial temperature conditions, this op-amp is reliable for use in harsh environments and critical applications.

Terminal Form: GULL WING

Gull wing terminals provide reliable surface mount connections, ensuring stability and ease during soldering.

Amplifier Type: OPERATIONAL AMPLIFIER

As an operational amplifier, it provides versatile performance for various analog signal processing applications.

Packing Method: TR

Tape and reel packing method allows for efficient automatic placement in manufacturing processes, improving production efficiency.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm accommodates a variety of PCB designs and enhances design flexibility.

Technical Specifications

Operational Amplifiers (Op Amps) TSH80IYDT attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from STMicroelectronics

Amplifier Characteristics

Amplifier Type:

Total Functions:

1

Sub-Category:

Operational Amplifiers

Operational Characteristics

Peak Reflow Temperature:

260 °C (500 °F)

Physical Characteristics

Length:

0.193 in (4.9 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

8

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel Palladium Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Trade Compliance

TSH80IYDT Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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