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TSH80ID

STMicroelectronics

TSH80ID by STMicroelectronics

TSH80ID by STMicroelectronics is an industrial-grade operational amplifier in a compact 8-terminal SO package. It features a peak reflow temp of 260 °C, max seated height of 1.75mm, and nickel-palladium-gold finish. Ideal for precision signal processing applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 13,006 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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13,006

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Digiode

USA . 4,206 parts In-Stock

1+ parts

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-

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4,206

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Anansix

USA . 946 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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946

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Speed Components Ltd

Israel . 11 parts In-Stock

1+ parts

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11

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,554 parts In-Stock

1+ parts

$4.827

100+ parts

-

1k+ parts

$4.345

10k+ parts

-

1,554

$4.827

-

$4.345

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Microchip USA

USA . 453 parts In-Stock

1+ parts

$5.390

100+ parts

-

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453

$5.390

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-

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MKK Technologies

India . 305 parts In-Stock

1+ parts

$9.077

100+ parts

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305

$9.077

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-

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DigiPath Technology Company

USA . 305 parts In-Stock

1+ parts

$9.077

100+ parts

-

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10k+ parts

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305

$9.077

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-

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AZTECH Wire

Italy . 252 parts In-Stock

1+ parts

$11.240

100+ parts

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252

$11.240

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Corphita

USA . 3,730 parts In-Stock

1+ parts

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3,730

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Vigor

Singapore . 1,600 parts In-Stock

1+ parts

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1,600

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Parana Technologies

USA . 1,421 parts In-Stock

1+ parts

-

100+ parts

$5.772

1k+ parts

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1,421

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$5.772

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

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1,000

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ChipstoGo Electronic ltd

UK . 98 parts In-Stock

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98

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Overview

Elevate your designs with the TSH80ID from STMicroelectronics, a trusted leader in cutting-edge technology. This high-quality operational amplifier is engineered for reliability, making it ideal for industrial applications where precision matters. Enjoy seamless integration and superior performance, enhancing your projects while saving time and resources. Choose TSH80ID for unmatched value and experience the difference that STMicroelectronics brings to your innovations!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and protection of the internal components, making it suitable for a variety of applications.

Surface Mount: YES

Being surface mount allows for easier and more compact PCB designs, which is crucial for modern electronics.

Package Shape: RECTANGULAR

The rectangular shape provides efficient space utilization on the PCB, enabling better layout flexibility.

No. of Terminals: 8

Having 8 terminals allows for versatile connections, supporting a wide range of circuit configurations.

Package Style (Meter): SMALL OUTLINE

The small outline package helps in reducing the overall size of the PCB, catering to size-sensitive applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The high-quality terminal finish enhances conductivity and resistance to corrosion, ensuring reliable performance over time.

Terminal Position: DUAL

Dual terminal positioning improves ease of soldering and connection on the PCB, enhancing production efficiency.

Maximum Seated Height: 1.75 mm

With a low seated height, this Op Amp can fit into compact designs without compromising performance.

Width: 3.9 mm

A narrow width allows for dense layout on PCBs, making it ideal for space-constrained designs.

Maximum Time At Peak Reflow Temperature (s): 40

A maximum of 40 seconds at peak reflow promotes better solder joint formation and reliability under thermal stress.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C ensures compatibility with automotive and industrial soldering processes.

Length: 4.9 mm

The compact length contributes to a smaller footprint on the PCB, advantageous for high-density applications.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperatures ensures reliability in demanding environments, making it suitable for various applications.

Terminal Form: GULL WING

Gull wing terminals enhance solderability and stability during assembly, promoting efficient mass production.

Amplifier Type: OPERATIONAL AMPLIFIER

As an operational amplifier, this device is versatile for various analog signal processing needs, showcasing broad application potential.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm offers compatibility with numerous PCB layouts and manufacturing processes, enhancing design flexibility.

Technical Specifications

Operational Amplifiers (Op Amps) TSH80ID attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from STMicroelectronics

Amplifier Characteristics

Amplifier Type:

Total Functions:

1

Sub-Category:

Operational Amplifiers

Operational Characteristics

Peak Reflow Temperature:

260 °C (500 °F)

Reflow Peak Time Limit:

40 s

Physical Characteristics

Length:

0.193 in (4.9 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

8

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel Palladium Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Packaging and Shipping

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Trade Compliance

TSH80ID Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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