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TSH11IDT

STMicroelectronics

TSH11IDT by STMicroelectronics

TSH11IDT by STMicroelectronics is a low-bias operational amplifier ideal for automotive applications. It features a max input offset voltage of 15 mV, a common mode reject ratio of 95 dB, and operates within -40 °C to 125°C. Its compact design ensures efficient performance in various electronic circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,520 parts In-Stock

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3,520

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Digiode

USA . 2,884 parts In-Stock

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2,884

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Anansix

USA . 193 parts In-Stock

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193

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 711 parts In-Stock

1+ parts

$6.474

100+ parts

-

1k+ parts

$5.827

10k+ parts

-

711

$6.474

-

$5.827

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MKK Technologies

India . 213 parts In-Stock

1+ parts

$12.174

100+ parts

-

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213

$12.174

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DigiPath Technology Company

USA . 213 parts In-Stock

1+ parts

$12.174

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213

$12.174

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Corphita

USA . 2,146 parts In-Stock

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2,146

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Parana Technologies

USA . 1,822 parts In-Stock

1+ parts

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$7.741

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1,822

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$7.741

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Overview

Unlock exceptional performance with the TSH11IDT from STMicroelectronics, your go-to operational amplifier for precision applications. Renowned for its reliability and cutting-edge technology, this compact op-amp delivers outstanding common-mode rejection and minimal bias current, ensuring superior signal integrity in automotive and industrial designs. Elevate your projects with unmatched efficiency, durability, and the trusted quality that STMicroelectronics is known for!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material offers durability and reliability for automotive applications.

Maximum Input Offset Voltage: 15000 uV

This low input offset voltage ensures high precision in signal amplification, making it suitable for precision applications.

Maximum Average Bias Current (IIB): 0.0003 uA

The very low average bias current helps maintain accuracy and improves the performance in battery-powered applications.

Surface Mount: YES

The surface mount design allows for compact PCB layouts, which are essential in automotive and consumer electronics.

Package Shape: RECTANGULAR

The rectangular package shape optimizes space on printed circuit boards, facilitating easier integration into devices.

Nominal Common Mode Reject Ratio: 95 dB

A high common mode rejection ratio indicates excellent ability to reject noise, ensuring cleaner signals in noisy environments.

Nominal Supply Voltage / Vsup (V): 5

This nominal supply voltage is standard in many applications, ensuring compatibility with a wide range of systems.

Power Supplies (V): +-3/+-5

Flexibility in power supply options allows for versatility in various circuit designs and operational environments.

No. of Terminals: 8

The 8-terminal configuration provides ample connection options for various applications while maintaining compact size.

Package Style (Meter): SMALL OUTLINE

The small outline package style makes it suitable for space-constrained applications, optimizing board real estate.

Maximum Supply Voltage Limit: 7 V

This limitation ensures safe operation within specified ranges, adding to the reliability of the amplifier.

Maximum Operating Temperature: 125 °C

An operating temperature of 125 °C makes this Op Amp suitable for demanding automotive and industrial environments.

Maximum Bias Current (IIB) @25°C: 0.0003 uA

Low bias current at 25 °C reinforces accuracy and performance, especially critical in precision signal applications.

Frequency Compensation: YES

Integrated frequency compensation allows for stable performance across various frequencies, improving reliability.

Minimum Voltage Gain: 200

A minimum gain of 200 indicates strong amplification capabilities, ideal for applications requiring significant signal boosting.

Minimum Operating Temperature: -40 °C

The wide operating range starting at -40 °C ensures functionality in extreme conditions, vital for automotive use.

Terminal Finish: NICKEL PALLADIUM GOLD

The premium terminal finish enhances solderability and corrosion resistance, extending the lifetime of the component.

Terminal Position: DUAL

Dual terminal position supports a flexible layout for integration into various PCB configurations.

Maximum Seated Height: 1.75 mm

Low height allows for space-efficient designs, accommodating compact electronic devices.

Width: 3.9 mm

Compact width supports versatility in design without sacrificing performance or reliability.

Length: 4.9 mm

The short length allows for efficient use of PCB space, essential in modern electronics.

Temperature Grade: AUTOMOTIVE

Automotive-grade components ensure robustness and compliance with standards required for vehicle applications.

Low-Bias: YES

Low-bias characteristics increase accuracy and precision, particularly important in sensitive measurement applications.

Maximum Negative Supply Voltage Limit: -7 V

A negative supply limit of -7 V enables compatibility with dual-supply circuits, enhancing design flexibility.

Nominal Negative Supply Voltage (Vsup): -5 V

This nominal negative voltage enables ease of integration into circuits that require bipolar operations.

Nominal Unity Gain Bandwidth: 120000 kHz

A high unity gain bandwidth provides capability for fast signal processing, suitable for high-speed applications.

Technology: BIPOLAR

Bipolar technology typically provides higher speed and better performance in analog applications over CMOS.

Terminal Form: GULL WING

The gull-wing terminal form enhances mechanical stability and ensures reliable soldering connections.

Amplifier Type: OPERATIONAL AMPLIFIER

Operational amplifiers are versatile components suitable for a broad range of applications, including signal conditioning.

Maximum Supply Current: 40 mA

A supply current of 40 mA allows for adequate performance without excessive power consumption, ideal for portable designs.

Nominal Slow Rate: 150 V/us

A nominal slew rate of 150 V/us ensures minimal distortion and improved fidelity in fast-changing signals.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch supports compatibility with various PCB layouts and assembly processes.

Wideband: YES

Wideband capability enhances the versatility of the Op Amp in high-frequency applications, extending its usability.

Technical Specifications

Operational Amplifiers (Op Amps) TSH11IDT attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from STMicroelectronics

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

BIPOLAR

Power Supply:

±3/±5 V

Total Functions:

1

Sub-Category:

Operational Amplifiers

Frequency Compensation:

Yes

Low-Bias:

Yes

Low-Offset:

No

Wideband:

Yes

Performance Specifications

Nominal Unity Gain Bandwidth:

120 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

95 dB

Input Offset Voltage Limit:

15000 uV

Minimum Voltage Gain:

200

Nominal Slew Rate:

150 V/us

Peak Bias Current:

300 pA

Maximum Bias Current (IIB) @25 °C:

300 pA

Operational Characteristics

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

7 V

Maximum Negative Supply Voltage:

-5 V

Minimum Negative Supply Voltage:

-7 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Maximum Supply Current:

40 mA

Physical Characteristics

Length:

0.193 in (4.9 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

8

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel Palladium Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

SOP8,.25

Trade Compliance

TSH11IDT Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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