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TSH113IPT

STMicroelectronics

TSH113IPT by STMicroelectronics

TSH113IPT by STMicroelectronics is a versatile operational amplifier featuring a max input offset voltage of 2000 µV, a nominal CMRR of 60 dB, and a min slew rate of 160 V/µs. It operates within -40 °C to 85°C, making it ideal for industrial applications. This compact SMD device supports multiple power supplies and functions efficiently in various electronic circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 7,393 parts In-Stock

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7,393

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Anansix

USA . 1,638 parts In-Stock

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1,638

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Digiode

USA . 559 parts In-Stock

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559

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Microchip USA

USA . 226 parts In-Stock

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$2.382

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226

$2.382

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IDEA Electronic Components Group

UK . 793 parts In-Stock

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$3.619

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-

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$3.257

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793

$3.619

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$3.257

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MKK Technologies

India . 2,263 parts In-Stock

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$6.806

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2,263

$6.806

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DigiPath Technology Company

USA . 2,263 parts In-Stock

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$6.806

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2,263

$6.806

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AZTECH Wire

Italy . 232 parts In-Stock

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$18.710

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232

$18.710

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Component Stockers USA

USA . 227 parts In-Stock

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$99.990

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227

$99.990

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Vigor

Singapore . 1,519 parts In-Stock

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Corphita

USA . 1,286 parts In-Stock

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1,286

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Parana Technologies

USA . 605 parts In-Stock

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$4.327

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605

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Kepictronics

USA . 100 parts In-Stock

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Overview

Unlock unparalleled performance with the TSH113IPT operational amplifier from STMicroelectronics. Designed for precision and reliability, this compact and efficient op-amp excels in a variety of applications, from industrial automation to consumer electronics. Enjoy benefits like low noise, high common mode rejection, and superior temperature resilience, all backed by ST's commitment to quality and innovation. Elevate your projects with a component that truly delivers excellence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy packaging ensures durability and resistance to environmental conditions, making it suitable for various applications.

Maximum Input Offset Voltage: 2000 uV

A low input offset voltage ensures higher accuracy and precision in signal amplification, making this op-amp ideal for sensitive applications.

Surface Mount: YES

Surface mount technology allows for compact designs and improves assembly efficiency in modern electronic devices.

No. of Functions: 3

Multiple functions increase versatility, allowing the op-amp to serve in various roles within a circuit.

Package Shape: RECTANGULAR

The rectangular shape is ideal for efficient PCB layout and component placement.

Nominal Common Mode Reject Ratio: 60 dB

A high common mode rejection ratio minimizes the effect of noise and interference, ensuring signal integrity.

Nominal Supply Voltage / Vsup (V): 2.5

A nominal supply voltage of 2.5 V is suitable for low-power applications, enhancing energy efficiency.

Power Supplies: +-2.5/+-6/+5/+12

Wide range of power supply options accommodates various design specifications and operational requirements.

No. of Terminals: 14

Fourteen terminals facilitate multiple connections and functionalities, improving design flexibility.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile save board space and enable dense circuit designs.

Minimum Slew Rate: 160 V/us

A high slew rate allows the op-amp to respond quickly to fast-changing signals, making it suitable for high-frequency applications.

Maximum Supply Voltage Limit: 7 V

This maximum supply voltage limit ensures compatibility with a range of applications while preventing damage.

Maximum Operating Temperature: 85 °C

Operating effectively at high temperatures makes this op-amp suitable for industrial environments.

Maximum Bias Current (IIB) @25°C: 14 uA

Low bias current helps maintain signal accuracy, making it suitable for high-impedance applications.

Frequency Compensation: YES

Built-in frequency compensation ensures stability in feedback circuits, enhancing reliability in performance.

Minimum Operating Temperature: -40 °C

The extended temperature range allows for operation in harsh conditions, making it suitable for outdoor and industrial use.

Terminal Finish: NICKEL PALLADIUM GOLD

High-quality terminal finish enhances solderability and ensures better electrical connectivity.

Terminal Position: DUAL

Dual terminal positioning provides design flexibility and ease of integration into various circuits.

Maximum Seated Height: 1.2 mm

Low seated height reduces the overall profile of the device, essential for compact designs.

Width: 4.4 mm

A narrow width allows for efficient space management on the PCB.

Maximum Time At Peak Reflow Temperature (s): 40

Limiting peak reflow time minimizes thermal stress on the component during assembly, enhancing reliability.

Peak Reflow Temperature: 260 °C

The high peak reflow temperature capability ensures compatibility with modern soldering processes.

Length: 5 mm

Short length allows for high-density PCB layouts, ideal for miniaturized electronic designs.

Temperature Grade: INDUSTRIAL

Industrial temperature grading ensures reliable performance in challenging environments.

Maximum Negative Supply Voltage Limit: -7 V

A significant negative voltage supply range adds to the flexibility of application in diverse circuit configurations.

Technology: BIPOLAR

Bipolar technology typically provides better performance in terms of speed and signal handling.

Terminal Form: GULL WING

Gull wing terminals facilitate easier soldering and improve reliability in connections.

Amplifier Type: OPERATIONAL AMPLIFIER

Operational amplifiers are versatile components suited for a wide array of applications including filtering, amplification, and signal processing.

Maximum Supply Current: 15 mA

The low supply current helps in minimizing power consumption, suitable for battery-operated devices.

Nominal Negative Supply Voltage (Vsup): -2.5 V

A negative supply voltage of -2.5 V expands the range of signal processing capabilities.

Architecture: CURRENT-FEEDBACK

Current feedback architecture allows for fast response times and better bandwidth performance.

Packing Method: TAPE AND REEL

Tape and reel packaging simplifies automated assembly processes, enhancing production efficiency.

Nominal Slew Rate: 230 V/us

A high nominal slew rate allows for excellent handling of rapid signal changes, ideal for high-speed applications.

Terminal Pitch: 0.65 mm

This terminal pitch ensures compatibility with standard PCB layouts and makes soldering easier.

Moisture Sensitivity Level (MSL): 3

A moisture sensitivity level of 3 indicates appropriate handling precautions, suitable for various manufacturing environments.

Technical Specifications

Operational Amplifiers (Op Amps) TSH113IPT attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from STMicroelectronics

Amplifier Characteristics

Amplifier Type:

Architecture:

Current Feedback

Technology:

BIPOLAR

Power Supply:

±2.5/±6/+5/+12 V

Total Functions:

3

Sub-Category:

Operational Amplifiers

Frequency Compensation:

Yes

Low-Offset:

No

Performance Specifications

Nominal Common Mode Rejection Ratio (CMRR ):

60 dB

Input Offset Voltage Limit:

2000 uV

Minimum Slew Rate:

160 V/us

Nominal Slew Rate:

230 V/us

Maximum Bias Current (IIB) @25 °C:

14 uA

Operational Characteristics

Nominal Supply Voltage:

2.5 V

Maximum Supply Voltage:

7 V

Maximum Negative Supply Voltage:

-2.5 V

Minimum Negative Supply Voltage:

-7 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Reflow Peak Time Limit:

40 s

Maximum Supply Current:

15 mA

Physical Characteristics

Length:

0.197 in (5 mm)

Width:

0.173 in (4.4 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Total Terminals:

14

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel Palladium Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

3

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

Package Shape:

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Equivalence Code:

TSSOP8,.25

Trade Compliance

TSH113IPT Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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