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TSH114IPT

STMicroelectronics

TSH114IPT by STMicroelectronics

TSH114IPT by STMicroelectronics is a versatile operational amplifier featuring a max input offset voltage of 2000 µV, a nominal CMRR of 60 dB, and a min slew rate of 160 V/µs. Ideal for industrial applications, it operates within -40 °C to 85°C. Its compact design supports surface mounting with 14 terminals.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,864 parts In-Stock

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6,864

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Digiode

USA . 4,529 parts In-Stock

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4,529

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Anansix

USA . 343 parts In-Stock

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343

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 63 parts In-Stock

1+ parts

$2.405

100+ parts

-

1k+ parts

$2.164

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63

$2.405

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$2.164

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MKK Technologies

India . 718 parts In-Stock

1+ parts

$4.522

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-

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718

$4.522

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DigiPath Technology Company

USA . 718 parts In-Stock

1+ parts

$4.522

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718

$4.522

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Microchip USA

USA . 308 parts In-Stock

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$9.400

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308

$9.400

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AZTECH Wire

Italy . 427 parts In-Stock

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$17.570

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427

$17.570

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Component Stockers USA

USA . 781 parts In-Stock

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$99.990

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781

$99.990

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Vigor

Singapore . 7,500 parts In-Stock

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7,500

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A-Z Elektronik GmbH

Germany . 5,604 parts In-Stock

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5,604

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Parana Technologies

USA . 802 parts In-Stock

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$2.875

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802

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$2.875

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Corphita

USA . 202 parts In-Stock

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202

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Overview

Unlock precision and reliability with the TSH114IPT operational amplifier from STMicroelectronics, a leader in innovation. This compact, high-performance device excels in diverse applications, ensuring optimal signal integrity even in demanding environments. With its low offset voltage and impressive common mode rejection, it empowers your designs for unmatched quality. Choose TSH114IPT to elevate your projects—experience enhanced efficiency and value that only STMicroelectronics can offer!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides durability and protection against environmental factors, making it suitable for various applications.

Maximum Input Offset Voltage: 2000 uV

A low input offset voltage ensures higher accuracy and precision in amplification, which is crucial for sensitive applications.

Surface Mount: YES

Surface mount technology allows for compact design and efficient space utilization on circuit boards.

No. of Functions: 4

Having multiple functions in a single package reduces component count and simplifies design, enhancing system performance.

Package Shape: RECTANGULAR

Rectangular packaging fits well in standard PCB layouts, facilitating easier integration into product designs.

Nominal Common Mode Reject Ratio: 60 dB

A high common mode rejection ratio helps to minimize interference from unwanted noise, improving signal integrity.

Nominal Supply Voltage / Vsup (V): 2.5

The nominal supply voltage of 2.5V is low, promoting energy efficiency and reducing power consumption.

Power Supplies (V): +-2.5/+-6/+5/+12

Versatile power supply options allow the op-amp to be used in a wide range of applications with different power requirements.

No. of Terminals: 14

Fourteen terminals provide ample connectivity options for flexible circuit design and integration into various applications.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile facilitate high-density mounting on compact PCBs, ideal for space-restricted designs.

Minimum Slew Rate: 160 V/us

A minimum slew rate of 160 V/us allows the op-amp to quickly respond to input changes, making it suitable for fast signal applications.

Maximum Supply Voltage Limit: 7 V

The supply voltage limit of 7V allows flexibility in design while ensuring reliability under various operating conditions.

Maximum Operating Temperature: 85 °C

This operating temperature threshold ensures stable performance in various industrial environments.

Maximum Bias Current (IIB) @25°C: 14 uA

Low bias current enhances the accuracy and stability of the operational amplifier, particularly in low-power applications.

Frequency Compensation: YES

Built-in frequency compensation allows for stable operation and enhances the linear performance of the amplifier.

Minimum Operating Temperature: -40 °C

An operational temperature range down to -40 °C ensures robustness in extreme environments.

Terminal Finish: MATTE TIN

The matte tin finish offers good solderability and protects against corrosion, ensuring reliable connections.

Terminal Position: DUAL

Dual terminal positioning allows for versatile PCB layout options, which facilitate easier integration into different designs.

Maximum Seated Height: 1.2 mm

The low seated height supports compact designs and enhances overall system miniaturization.

Width: 4.4 mm

A compact width makes it suitable for tight spaces on printed circuit boards.

Maximum Time At Peak Reflow Temperature (s): 30

This specification ensures compatibility with standard reflow soldering processes, simplifying manufacturing.

Peak Reflow Temperature °C: 260

This peak reflow temperature allows for robust soldering without degrading the device, ensuring long-term reliability.

Length: 5 mm

The minimal length contributes to compact design capabilities, fitting into small devices easily.

Temperature Grade: INDUSTRIAL

Industrial temperature grading assures reliability and performance in demanding applications.

Maximum Negative Supply Voltage Limit: -7 V

A sufficient negative supply voltage limit expands application possibilities, especially in bipolar configurations.

Technology: BIPOLAR

Bipolar technology allows for fast response times and high performance, making it suitable for a variety of applications.

Terminal Form: GULL WING

Gull wing terminals provide excellent mechanical strength and ease of soldering in surface mount applications.

Amplifier Type: OPERATIONAL AMPLIFIER

Operational amplifiers are versatile components used in a plethora of applications, such as filters, amplifiers, and signal conditioning.

Maximum Supply Current: 20 mA

A maximum supply current of 20 mA ensures efficient performance for a variety of operational tasks while maintaining low power consumption.

Nominal Negative Supply Voltage (Vsup): -2.5 V

A nominal negative supply voltage of -2.5 V supports bipolar operation, enhancing versatility in circuit design.

Architecture: CURRENT-FEEDBACK

Current-feedback architecture provides extended bandwidth and higher speed, suited for high-frequency applications.

Packing Method: TAPE AND REEL

Tape and reel packaging facilitates automated assembly processes, improving production efficiency.

Nominal Slow Rate: 230 V/us

With a nominal slow rate of 230 V/us, this op-amp can handle moderate-speed applications effectively.

Terminal Pitch: 0.65 mm

The 0.65 mm terminal pitch supports modern PCB design standards, ensuring compatibility with various manufacturing processes.

Technical Specifications

Operational Amplifiers (Op Amps) TSH114IPT attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from STMicroelectronics

Amplifier Characteristics

Amplifier Type:

Architecture:

Current Feedback

Technology:

BIPOLAR

Power Supply:

±2.5/±6/+5/+12 V

Total Functions:

4

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

No

Low-Offset:

No

Micropower:

No

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Common Mode Rejection Ratio (CMRR ):

60 dB

Input Offset Voltage Limit:

2000 uV

Minimum Slew Rate:

160 V/us

Nominal Slew Rate:

230 V/us

Maximum Bias Current (IIB) @25 °C:

14 uA

Operational Characteristics

Nominal Supply Voltage:

2.5 V

Maximum Supply Voltage:

7 V

Maximum Negative Supply Voltage:

-2.5 V

Minimum Negative Supply Voltage:

-7 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Reflow Peak Time Limit:

30 s

Maximum Supply Current:

20 mA

Physical Characteristics

Length:

0.197 in (5 mm)

Width:

0.173 in (4.4 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Total Terminals:

14

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Matte Tin

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e3

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

Package Shape:

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Equivalence Code:

TSSOP14,.25

Trade Compliance

TSH114IPT Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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