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TSC102IYDT

STMicroelectronics

TSC102IYDT by STMicroelectronics

TSC102IYDT from STMicroelectronics is a versatile analog circuit designed for automotive applications. It operates within a supply voltage range of 2.8V to 30V and withstands temperatures from -40 °C to 125 °C. This compact 8-terminal device features a small outline package, ideal for space-constrained designs.

Median Price

$2.140

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 2,440 parts In-Stock

1+ parts

$2.140

100+ parts

$1.010

1k+ parts

$0.696

10k+ parts

$0.592

2,440

$2.140

$1.010

$0.696

$0.592

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,904 parts In-Stock

1+ parts

$2.318

100+ parts

-

1k+ parts

-

10k+ parts

-

3,904

$2.318

-

-

-

Vyrian

USA . 3,250 parts In-Stock

1+ parts

$2.440

100+ parts

-

1k+ parts

-

10k+ parts

-

3,250

$2.440

-

-

-

ComSIT Distribution GmbH

Germany . 3,978 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,978

-

-

-

-

Anansix

USA . 1,654 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,654

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 6,340 parts In-Stock

1+ parts

$0.920

100+ parts

-

1k+ parts

-

10k+ parts

-

6,340

$0.920

-

-

-

Corphita

USA . 217 parts In-Stock

1+ parts

$2.196

100+ parts

-

1k+ parts

-

10k+ parts

-

217

$2.196

-

-

-

IDEA Electronic Components Group

UK . 2,363 parts In-Stock

1+ parts

$3.451

100+ parts

-

1k+ parts

$3.106

10k+ parts

-

2,363

$3.451

-

$3.106

-

MKK Technologies

India . 1,661 parts In-Stock

1+ parts

$6.489

100+ parts

-

1k+ parts

-

10k+ parts

-

1,661

$6.489

-

-

-

DigiPath Technology Company

USA . 1,661 parts In-Stock

1+ parts

$6.489

100+ parts

-

1k+ parts

-

10k+ parts

-

1,661

$6.489

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 12,887 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

12,887

-

-

-

-

Microchip USA

USA . 7,122 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,122

-

-

-

-

Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

Perfect Parts

USA . 2,651 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,651

-

-

-

-

A-Z Elektronik GmbH

Germany . 2,517 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,517

-

-

-

-

Parana Technologies

USA . 2 parts In-Stock

1+ parts

-

100+ parts

$4.126

1k+ parts

-

10k+ parts

-

2

-

$4.126

-

-

Overview

Unlock unparalleled precision with the TSC102IYDT from STMicroelectronics, a leader in innovative semiconductor solutions. This robust analog circuit excels in extreme conditions, ensuring reliability across automotive and industrial applications. With its compact design, it seamlessly integrates into your projects, providing exceptional performance while saving space. Trust in STMicroelectronics for quality and innovation that empowers your designs and drives success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides excellent protection against moisture and heat, ensuring reliability in various applications.

Surface Mount: YES

The surface mount capability allows for a compact design and efficient use of circuit board space, making it suitable for modern electronics.

Package Shape: RECTANGULAR

The rectangular package shape optimizes layout on printed circuit boards, facilitating easier integration into existing designs.

Nominal Supply Voltage (Vsup): 5 V

A nominal supply voltage of 5 V is standard for many applications, ensuring compatibility with a wide range of devices.

Power Supplies (V): 5

This product's support for 5 V power supplies makes it versatile and convenient for everyday electronic equipment.

No. of Terminals: 8

With 8 terminals, this chip provides ample connectivity options while maintaining a compact form factor.

Package Style (Meter): SMALL OUTLINE

The small outline package style is ideal for space-constrained applications, perfect for automotive and consumer electronics.

Maximum Operating Temperature: 125 °C

A maximum operating temperature of 125 °C ensures that this component can perform effectively in high-temperature environments, such as automotive applications.

Minimum Operating Temperature: -40 °C

This product's ability to operate at a low temperature of -40 °C expands its usability in extreme environments.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The premium terminal finish enhances conductivity and provides corrosion resistance, ensuring long-term reliability.

Terminal Position: DUAL

The dual terminal position allows for versatile PCB layout options, beneficial for complex designs.

Maximum Seated Height: 1.2 mm

A low seated height of 1.2 mm contributes to a slim profile, which is important in miniaturized applications.

Width (mm): 3 mm

The compact width of 3 mm allows this product to fit into tight spaces without compromising performance.

Other IC type: ANALOG CIRCUIT

As an analog circuit, this product is well-suited for a variety of applications including signal processing and sensor interfacing.

Minimum Supply Voltage (Vsup): 2.8 V

Supporting a minimum supply voltage of 2.8 V enhances flexibility for use in different power environments.

Maximum Time At Peak Reflow Temperature (s): 30

A maximum reflow time of 30 seconds allows for compatible assembly processes without damaging the component.

Peak Reflow Temperature °C: 260

The ability to withstand peak reflow temperatures of up to 260 °C guarantees compatibility with standard soldering processes.

Length: 4.4 mm

At a length of 4.4 mm, the compact dimension aids in efficient board design, reducing the overall size of the assembly.

Temperature Grade: AUTOMOTIVE

Certified for automotive applications, this component is designed to withstand harsh conditions, ensuring durability in vehicles.

Maximum Supply Current (Isup): 0.7 mA

A low maximum supply current of 0.7 mA contributes to energy efficiency, making it suitable for battery-powered devices.

Terminal Form: GULL WING

Gull-wing terminals aid in effective soldering and heat dissipation, which is essential for reliable performance.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm strikes a balance between compactness and ease of soldering, making it user-friendly for assembly.

Maximum Supply Voltage (Vsup): 30 V

With a maximum supply voltage of 30 V, this component can handle a wide range of applications, providing greater design flexibility.

Technical Specifications

Other Function Semiconductors TSC102IYDT attributes and parameters. Explore more Other Function Semiconductors devices from STMicroelectronics

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.4 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Other Analog ICs

Maximum Supply Current (Isup):

.7 mA

Maximum Supply Voltage (Vsup):

30 V

Minimum Supply Voltage (Vsup):

2.8 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3 mm

Trade Compliance

TSC102IYDT Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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