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TSC102IPT

STMicroelectronics

TSC102IPT by STMicroelectronics

TSC102IPT by STMicroelectronics is a compact analog circuit designed for automotive applications, operating b/w -40 °C to 125 °C. It features an 8-terminal gull-wing package, with a nominal voltage of 5V and max supply voltage of 30V. This surface-mount device ensures reliable performance in various environments.

Median Price

$1.460

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 2,675 parts In-Stock

1+ parts

$1.460

100+ parts

$0.857

1k+ parts

$0.749

10k+ parts

$0.696

2,675

$1.460

$0.857

$0.749

$0.696

Avnet

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,000

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,996 parts In-Stock

1+ parts

$1.406

100+ parts

-

1k+ parts

-

10k+ parts

-

3,996

$1.406

-

-

-

Vyrian

USA . 2,237 parts In-Stock

1+ parts

$1.480

100+ parts

-

1k+ parts

-

10k+ parts

-

2,237

$1.480

-

-

-

TME

Poland . 3,998 parts In-Stock

1+ parts

$1.660

100+ parts

$1.270

1k+ parts

-

10k+ parts

-

3,998

$1.660

$1.270

-

-

Chip Stock

USA . 5,460 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,460

-

-

-

-

Anansix

USA . 1,179 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,179

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 3,974 parts In-Stock

1+ parts

$1.330

100+ parts

-

1k+ parts

-

10k+ parts

-

3,974

$1.330

-

-

-

Corphita

USA . 3,712 parts In-Stock

1+ parts

$1.332

100+ parts

-

1k+ parts

-

10k+ parts

-

3,712

$1.332

-

-

-

Microchip USA

USA . 6,312 parts In-Stock

1+ parts

$7.003

100+ parts

-

1k+ parts

-

10k+ parts

-

6,312

$7.003

-

-

-

IDEA Electronic Components Group

UK . 1,534 parts In-Stock

1+ parts

$13.235

100+ parts

-

1k+ parts

$11.912

10k+ parts

-

1,534

$13.235

-

$11.912

-

Advanced Electronics

New Zealand . 600 parts In-Stock

1+ parts

$16.669

100+ parts

$15.169

1k+ parts

$13.669

10k+ parts

-

600

$16.669

$15.169

$13.669

-

MKK Technologies

India . 787 parts In-Stock

1+ parts

$24.888

100+ parts

-

1k+ parts

-

10k+ parts

-

787

$24.888

-

-

-

DigiPath Technology Company

USA . 787 parts In-Stock

1+ parts

$24.888

100+ parts

-

1k+ parts

-

10k+ parts

-

787

$24.888

-

-

-

Authorized Procurement Solutions

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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10,000

-

-

-

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A-Z Elektronik GmbH

Germany . 6,527 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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6,527

-

-

-

-

Perfect Parts

USA . 4,003 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,003

-

-

-

-

Parana Technologies

USA . 790 parts In-Stock

1+ parts

-

100+ parts

$15.825

1k+ parts

-

10k+ parts

-

790

-

$15.825

-

-

iodParts Technologies Inc.

India . 354 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

354

-

-

-

-

GreenTree Electronics

Israel . 50 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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50

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-

-

Overview

Elevate your projects with the TSC102IPT from STMicroelectronics, a trusted leader in semiconductor innovation. Designed for automotive applications, this compact analog circuit delivers reliability across extreme temperatures, ensuring performance when it matters most. With low power consumption and robust packaging, it seamlessly fits into various designs, offering exceptional value that drives efficiency and durability. Choose TSC102IPT—where quality meets innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides durability and protection for the semiconductor, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient assembly processes, making this component ideal for modern electronics.

Package Shape: RECTANGULAR

The rectangular shape is space-efficient, allowing for better layout in circuit boards without wasting valuable board space.

Nominal Supply Voltage (Vsup): 5 V

Operating at a standard nominal voltage of 5V ensures compatibility with a wide range of devices and simplifies design considerations.

Power Supplies (V): 5

Supports straightforward power supply configurations, making it easy to integrate into existing systems.

No. of Terminals: 8

With 8 terminals, this product can handle multiple connections, making it versatile for various functionalities.

Package Style (Meter): SMALL OUTLINE

The small outline package style enhances the product's suitability for compact electronic devices, saving space and weight.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature of 125 °C allows for reliable performance in demanding environments, including automotive applications.

Minimum Operating Temperature: -40 °C

The ability to function in extreme low temperatures (-40 °C) ensures reliability under harsh conditions found in many outdoor or industrial applications.

Terminal Position: DUAL

The dual terminal position aids in better connection options, ensuring flexible circuit design.

Maximum Seated Height: 1.2 mm

A low seated height allows for more compact assembly and helps in maintaining a slim profile for devices.

Width (mm): 3 mm

The narrow width contributes to space-saving designs, making it suitable for compact electronic applications.

Other IC type: ANALOG CIRCUIT

This product being an analog circuit expands its application possibilities in various analog signal processing tasks.

Minimum Supply Voltage (Vsup): 2.8 V

The flexibility in minimum supply voltage ensures compatibility with low-power applications, broadening potential use cases.

Length: 4.4 mm

A compact length makes it suitable for tightly packed designs, such as smartphones and portable devices.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, it meets stringent reliability and performance standards required in vehicles.

Maximum Supply Current (Isup): 0.7 mA

A low maximum supply current indicates energy-efficient operation, making it suitable for battery-powered devices.

Terminal Form: GULL WING

The gull wing terminal form provides excellent solderability and stability, ensuring reliable connections in surface-mount applications.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm enables high-density placement on circuit boards, ideal for compact electronic designs.

Maximum Supply Voltage (Vsup): 30 V

The capability to handle up to 30 V supply voltage expands the range of its applications, including industrial and high-voltage circuits.

Technical Specifications

Other Function Semiconductors TSC102IPT attributes and parameters. Explore more Other Function Semiconductors devices from STMicroelectronics

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G8

Length:

4.4 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Other Analog ICs

Maximum Supply Current (Isup):

.7 mA

Maximum Supply Voltage (Vsup):

30 V

Minimum Supply Voltage (Vsup):

2.8 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

3 mm

Trade Compliance

TSC102IPT Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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