Loading...

TSC102IDT

STMicroelectronics

TSC102IDT by STMicroelectronics

TSC102IDT by STMicroelectronics is a versatile analog circuit designed for automotive applications, operating b/w -40 °C to 125 °C. It features an 8-terminal gull-wing package, with a nominal voltage of 5V and max supply voltage of 30V. This compact device ensures reliable performance in demanding environments.

Median Price

$1.430

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 120 parts In-Stock

1+ parts

$1.360

100+ parts

$0.940

1k+ parts

$0.779

10k+ parts

-

120

$1.360

$0.940

$0.779

-

Mouser Electronics

USA . 2,479 parts In-Stock

1+ parts

$2.340

100+ parts

$1.110

1k+ parts

$0.794

10k+ parts

$0.705

2,479

$2.340

$1.110

$0.794

$0.705

Future Electronics

Canada . 2,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.605

2,500

-

-

-

$0.605

EBV Elektronik

Germany . 2,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,500

-

-

-

-

Verical

USA . 120 parts In-Stock

1+ parts

-

100+ parts

$1.500

1k+ parts

-

10k+ parts

-

120

-

$1.500

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,693 parts In-Stock

1+ parts

$0.728

100+ parts

-

1k+ parts

-

10k+ parts

-

2,693

$0.728

-

-

-

Digiode

USA . 1,572 parts In-Stock

1+ parts

$1.463

100+ parts

-

1k+ parts

-

10k+ parts

-

1,572

$1.463

-

-

-

Freddi Giovanni

Italy . 4,900 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,900

-

-

-

-

Anansix

USA . 2,829 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,829

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Stockers USA

USA . 1,110 parts In-Stock

1+ parts

$0.400

100+ parts

$0.340

1k+ parts

-

10k+ parts

-

1,110

$0.400

$0.340

-

-

Vigor

Singapore . 2,157 parts In-Stock

1+ parts

$0.760

100+ parts

-

1k+ parts

-

10k+ parts

-

2,157

$0.760

-

-

-

Corphita

USA . 527 parts In-Stock

1+ parts

$1.386

100+ parts

-

1k+ parts

-

10k+ parts

-

527

$1.386

-

-

-

IDEA Electronic Components Group

UK . 943 parts In-Stock

1+ parts

$4.947

100+ parts

-

1k+ parts

$4.452

10k+ parts

-

943

$4.947

-

$4.452

-

Microchip USA

USA . 4,935 parts In-Stock

1+ parts

$7.003

100+ parts

-

1k+ parts

-

10k+ parts

-

4,935

$7.003

-

-

-

MKK Technologies

India . 1,541 parts In-Stock

1+ parts

$9.302

100+ parts

-

1k+ parts

-

10k+ parts

-

1,541

$9.302

-

-

-

DigiPath Technology Company

USA . 1,541 parts In-Stock

1+ parts

$9.302

100+ parts

-

1k+ parts

-

10k+ parts

-

1,541

$9.302

-

-

-

Authorized Procurement Solutions

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10,000

-

-

-

-

Perfect Parts

USA . 2,384 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,384

-

-

-

-

Parana Technologies

USA . 1,356 parts In-Stock

1+ parts

-

100+ parts

$5.915

1k+ parts

-

10k+ parts

-

1,356

-

$5.915

-

-

Overview

Unlock the potential of your designs with the TSC102IDT from STMicroelectronics—a leader in high-quality semiconductors. This robust analog circuit promises reliability and precision for a wide range of applications, from automotive to industrial systems. With a compact design and impressive temperature resilience, it ensures performance when you need it most. Elevate your projects with a trusted product that combines innovation, efficiency, and exceptional value!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for easy integration into compact designs, saving space on printed circuit boards.

Package Shape: RECTANGULAR

The rectangular shape provides efficient space utilization, making it ideal for tight layouts in electronic systems.

Nominal Supply Voltage (Vsup): 5 V

Operating at a standard voltage of 5V makes it compatible with a variety of digital circuits and general-purpose applications.

Power Supplies (V): 5

This specification confirms versatility in powering various devices and enhances integration flexibility.

No. of Terminals: 8

Having 8 terminals allows for multi-functionality and ease of connection in circuit designs.

Package Style (Meter): SMALL OUTLINE

The small outline package style is optimized for low-profile designs, catering to modern electronic devices' miniaturization trend.

Maximum Operating Temperature: 125 °C

High maximum operating temperature enhances reliability in demanding environments, making it suitable for automotive applications.

Minimum Operating Temperature: -40 °C

A low minimum operating temperature expands application possibilities in harsh environments, ensuring robust performance.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The high-quality terminal finish provides excellent corrosion resistance and enhances solderability, ensuring reliable connections.

Terminal Position: DUAL

The dual terminal position facilitates easy layout design for circuit boards, aiding in efficient assembly processes.

Maximum Seated Height: 1.2 mm

A low seated height ensures compatibility with space-constrained applications and contributes to a sleek device profile.

Width: 3 mm

A compact width allows for flexible PCB design, accommodating high-density applications while maintaining performance.

Other IC type: ANALOG CIRCUIT

The analog circuit designation indicates its capability for signal processing in a range of electronic applications.

Minimum Supply Voltage (Vsup): 2.8 V

A flexible minimum supply voltage allows for low-power applications, enhancing energy efficiency in designs.

Maximum Time At Peak Reflow Temperature (s): 30

The specified reflow time ensures compatibility with existing manufacturing processes while minimizing thermal stress on components.

Peak Reflow Temperature °C: 260

Supporting a high peak reflow temperature ensures resilience during assembly, reducing the risk of damage to the part.

Length: 4.4 mm

A short length contributes to overall space savings in designs, making it a practical choice for croweded PCBs.

Temperature Grade: AUTOMOTIVE

This grade indicates suitability for automotive applications, ensuring reliability under extreme temperature conditions.

Maximum Supply Current (Isup): 0.7 mA

The low maximum supply current optimizes power consumption, making this device excellent for energy-efficient designs.

Terminal Form: GULL WING

The gull wing terminal form allows for easy handling and soldering during assembly, further streamlining the manufacturing process.

Terminal Pitch: 0.65 mm

A narrow terminal pitch enables greater density of connections on compact circuit boards, enhancing design flexibility.

Maximum Supply Voltage (Vsup): 30 V

The high maximum supply voltage expands application possibilities to high-voltage environments while maintaining safe operation.

Technical Specifications

Other Function Semiconductors TSC102IDT attributes and parameters. Explore more Other Function Semiconductors devices from STMicroelectronics

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.4 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Other Analog ICs

Maximum Supply Current (Isup):

.7 mA

Maximum Supply Voltage (Vsup):

30 V

Minimum Supply Voltage (Vsup):

2.8 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3 mm

Trade Compliance

TSC102IDT Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 4