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TS864IYDT

STMicroelectronics

TS864IYDT by STMicroelectronics

TS864IYDT from STMicroelectronics is a BICMOS comparator featuring a max input offset voltage of 18mV, low bias current of 0.6nA, and operates within -40 °C to 85 °C. Ideal for industrial applications, it supports dual functions in a compact SO package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,223 parts In-Stock

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Anansix

USA . 2,531 parts In-Stock

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2,531

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Digiode

USA . 836 parts In-Stock

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836

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IDEA Electronic Components Group

UK . 212 parts In-Stock

1+ parts

$3.630

100+ parts

-

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$3.267

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212

$3.630

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$3.267

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Microchip USA

USA . 276 parts In-Stock

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$5.961

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276

$5.961

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MKK Technologies

India . 1,914 parts In-Stock

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$6.827

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1,914

$6.827

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DigiPath Technology Company

USA . 1,914 parts In-Stock

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$6.827

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1,914

$6.827

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AZTECH Wire

Italy . 369 parts In-Stock

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$19.880

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369

$19.880

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Vigor

Singapore . 6,570 parts In-Stock

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Parana Technologies

USA . 1,756 parts In-Stock

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$4.341

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$4.341

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Corphita

USA . 1,562 parts In-Stock

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Overview

Unleash the potential of your designs with the TS864IYDT comparator from STMicroelectronics. Renowned for its exceptional quality and reliability, this AEC-Q100 certified component ensures precision performance across various applications, from automotive to industrial systems. With ultra-low bias currents and a compact surface-mount package, it delivers unmatched efficiency and versatility, making it the ideal choice for innovators seeking superior results without compromising on reliability. Elevate your projects with STMicroelectronics—where cutting-edge technology meets excellence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy construction ensures reliable performance and protection in various environments.

Maximum Input Offset Voltage: 18000 uV

A low input offset voltage indicates higher precision and accuracy in signal comparison applications.

Maximum Average Bias Current (IIB): 0.0006 uA

Ultra-low bias current ensures minimal loading effect on the input signal, making it suitable for sensitive applications.

Surface Mount: YES

Surface mount packaging facilitates compact designs and automated assembly processes.

No. of Functions: 4

Having multiple functions offers versatility for a range of comparator needs in a single package.

Screening Level: AEC-Q100

Compliance with AEC-Q100 indicates robustness for automotive applications, ensuring long-term reliability.

Package Shape: RECTANGULAR

The rectangular shape simplifies layout design for printed circuit boards, optimizing space usage.

Nominal Supply Voltage / Vsup (V): 5

The 5V nominal supply voltage is widely compatible with various digital systems, making integration straightforward.

Power Supplies (V): 2.7/10

Compatible with a versatile range of supply voltages allows flexibility in design configurations.

No. of Terminals: 14

14 terminals provide ample connectivity options, facilitating various application integration.

Package Style (Meter): SMALL OUTLINE

The small outline package enhances space efficiency, ideal for compact electronic designs.

Maximum Supply Voltage Limit: 12 V

Allows high-voltage applications while maintaining stable operation within specified limits.

Maximum Operating Temperature: 85 °C

Can operate in high-temperature environments, making it suitable for industrial applications.

Maximum Bias Current (IIB) @25°C: 0.0003 uA

The exceptionally low bias current at room temperature increases accuracy in sensitive device designs.

Output Type: PUSH-PULL

Push-pull output configuration offers strong drive capability for various loads.

Nominal Response Time: 2000 ns

A nominal response time of 2000 ns enables reliable and fast comparisons for high-speed applications.

Minimum Operating Temperature: -40 °C

Wide operational temperature range ensures reliable performance in extreme environments.

Terminal Position: DUAL

Dual terminal position assists in effective circuit designs and layout flexibility.

Maximum Seated Height: 1.75 mm

Low seated height allows for compact assembly and reduces profile height in electronic devices.

Width: 3.9 mm

Narrow width enhances density in circuit layouts for compact and efficient designs.

Length: 8.65 mm

Compact length is suitable for space-constrained applications while maintaining functionality.

Temperature Grade: INDUSTRIAL

The industrial temperature grade indicates reliability for long-term use in challenging industrial settings.

Technology: BICMOS

The BICMOS technology combines the benefits of bipolar and CMOS, providing both high speed and low power dissipation.

Terminal Form: GULL WING

Gull wing terminals offer excellent solder joint reliability, enhancing overall durability.

Amplifier Type: COMPARATOR

Designed specifically as a comparator, ensuring optimized performance for signal comparison tasks.

Maximum Supply Current: 0.064 mA

The low maximum supply current helps in reducing overall power consumption, making it efficient for battery-powered applications.

Terminal Pitch: 1.27 mm

A standard terminal pitch of 1.27 mm enhances compatibility with various circuit boards and assembly processes.

Technical Specifications

Comparators TS864IYDT attributes and parameters. Explore more Comparators devices from STMicroelectronics

Amplifier Characteristics

Amplifier Type:

Technology:

BICMOS

Power Supply:

2.7/10 V

Total Functions:

4

Sub-Category:

Comparators

Output Type:

Push-Pull

Performance Specifications

Maximum Input Offset Voltage:

18 mV

Peak Bias Current:

600 pA

Maximum Bias Current (IIB) @25 °C:

300 pA

Operational Characteristics

Maximum Supply Current:

64 μA

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

12 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Nominal Response Time:

2 µs

Physical Characteristics

Length:

0.341 in (8.65 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

14

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Temperature Grade:

Qualified:

No

Screening Level:

AEC-Q100

Standards

JESD-30 Code:

R-PDSO-G14

Packaging and Shipping

Package Code:

SOP

Package Shape:

Package Type:

Small Outline

Package Equivalence Code:

SOP14,.25

Trade Compliance

TS864IYDT Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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