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TS862IAN

STMicroelectronics

TS862IAN by STMicroelectronics

TS862IAN by STMicroelectronics is a dual comparator with a max input offset voltage of 10 mV and operates within -40 °C to 85°C. It features a push-pull output type and requires a nominal voltage of 5V. Ideal for industrial applications, it ensures precise signal processing.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,653 parts In-Stock

1+ parts

-

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2,653

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Anansix

USA . 1,403 parts In-Stock

1+ parts

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1,403

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Vyrian

USA . 610 parts In-Stock

1+ parts

-

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610

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 151 parts In-Stock

1+ parts

$4.618

100+ parts

-

1k+ parts

$4.157

10k+ parts

-

151

$4.618

-

$4.157

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MKK Technologies

India . 2,006 parts In-Stock

1+ parts

$8.685

100+ parts

-

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10k+ parts

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2,006

$8.685

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DigiPath Technology Company

USA . 2,006 parts In-Stock

1+ parts

$8.685

100+ parts

-

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2,006

$8.685

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-

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Corphita

USA . 3,486 parts In-Stock

1+ parts

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3,486

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Parana Technologies

USA . 764 parts In-Stock

1+ parts

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100+ parts

$5.522

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764

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$5.522

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Overview

Experience precision and reliability with the TS862IAN from STMicroelectronics, a leader in advanced semiconductor solutions. This dual comparator excels in diverse applications, from industrial automation to consumer electronics, delivering outstanding performance even in extreme conditions. With ultra-low bias current and a robust design, it ensures accuracy and efficiency, empowering your projects with unmatched quality and longevity. Elevate your designs with STMicroelectronics—where innovation meets excellence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material helps in reducing weight while ensuring durability and resistance to environmental factors.

Maximum Input Offset Voltage: 10000 uV

This high input offset voltage specification allows for a wide range of application scenarios, making it suitable for various industrial uses.

Maximum Average Bias Current (IIB): 0.0006 uA

The low average bias current ensures minimal error in signal processing, making it ideal for precision applications.

No. of Functions: 2

Having two functions increases its versatility, allowing users to integrate multiple functionalities in a single component.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient space utilization in circuit design, making it easier to fit into compact layouts.

Nominal Supply Voltage / Vsup (V): 5

A nominal supply voltage of 5V is standard in many applications, facilitating compatibility with various systems and components.

No. of Terminals: 8

With 8 terminals, the product offers robust connection options, making it easier to integrate into different circuit designs.

Package Style (Meter): IN-LINE

The in-line package style is conducive for PCB assembly, allowing for automated manufacturing processes.

Maximum Supply Voltage Limit: 12 V

A maximum supply voltage of 12V provides flexibility for a range of power supply configurations.

Maximum Operating Temperature: 85 °C

Operating safely at up to 85 °C makes it suitable for industrial applications where temperature fluctuations can occur.

Output Type: PUSH-PULL

The push-pull output type allows for efficient power handling and improved drive capabilities for connected loads.

Nominal Response Time: 2000 ns

A response time of 2000 ns ensures timely performance in high-speed applications, enhancing overall system efficiency.

Minimum Operating Temperature: -40 °C

Withstanding temperatures as low as -40 °C ensures reliability in extreme environmental conditions.

Terminal Position: DUAL

Dual terminal positioning facilitates easier integration into circuits, optimizing layout and reducing complexity.

Maximum Seated Height: 5.08 mm

A seated height of 5.08 mm allows for low-profile designs in tight spaces, suited for compact equipment.

Width: 7.62 mm

The 7.62 mm width is ideal for minimizing PCB footprint while maintaining adequate electrical performance.

Temperature Grade: INDUSTRIAL

Industrial temperature grading ensures reliability and performance in harsh environments, making it suitable for commercial applications.

Technology: BICMOS

BICMOS technology combines the strengths of both bipolar and CMOS technologies, providing high performance and low power consumption.

Terminal Form: THROUGH-HOLE

Through-hole terminals offer enhanced mechanical stability and ease of soldering, making them ideal for prototyping and durable applications.

Amplifier Type: COMPARATOR

As a comparator, this product excels in comparing two voltage levels, providing crucial functionality in analog circuits.

Terminal Pitch: 2.54 mm

A terminal pitch of 2.54 mm allows for compatibility with standard PCB layouts and simplifies system integration.

Technical Specifications

Comparators TS862IAN attributes and parameters. Explore more Comparators devices from STMicroelectronics

Amplifier Characteristics

Amplifier Type:

Technology:

BICMOS

Total Functions:

2

Sub-Category:

Comparators

Output Type:

Push-Pull

Performance Specifications

Maximum Input Offset Voltage:

10 mV

Peak Bias Current:

600 pA

Operational Characteristics

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

12 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Nominal Response Time:

2 µs

Physical Characteristics

Width:

0.3 in (7.62 mm)

Maximum Seated Height:

0.2 in (5.08 mm)

Total Terminals:

8

Terminal Pitch:

0.1 in (2.54 mm)

Terminal Position:

Dual

Terminal Form:

Package Body Material:

Plastic/Epoxy

Surface Mount:

No

Manufacturing and Reliability

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDIP-T8

Packaging and Shipping

Package Code:

DIP

Package Shape:

Package Type:

In-Line

Trade Compliance

TS862IAN Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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