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TS862IADT

STMicroelectronics

TS862IADT by STMicroelectronics

TS862IADT by STMicroelectronics is a dual comparator in a small outline package, ideal for industrial applications. It features a max input offset voltage of 10mV, low bias current of 0.6nA, and operates b/w -40 °C to 85°C. With a nominal voltage of 5V, it ensures reliable performance in various environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,912 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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4,912

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Anansix

USA . 2,020 parts In-Stock

1+ parts

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100+ parts

-

1k+ parts

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10k+ parts

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2,020

-

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Vyrian

USA . 995 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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995

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,499 parts In-Stock

1+ parts

$5.074

100+ parts

-

1k+ parts

$4.566

10k+ parts

-

1,499

$5.074

-

$4.566

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MKK Technologies

India . 2,005 parts In-Stock

1+ parts

$9.541

100+ parts

-

1k+ parts

-

10k+ parts

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2,005

$9.541

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DigiPath Technology Company

USA . 2,005 parts In-Stock

1+ parts

$9.541

100+ parts

-

1k+ parts

-

10k+ parts

-

2,005

$9.541

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Corphita

USA . 2,688 parts In-Stock

1+ parts

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2,688

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Parana Technologies

USA . 1,150 parts In-Stock

1+ parts

-

100+ parts

$6.066

1k+ parts

-

10k+ parts

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1,150

-

$6.066

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Overview

Unleash the potential of your designs with the TS862IADT from STMicroelectronics, a leader in innovative semiconductor solutions. This high-performance comparator delivers unmatched precision and reliability, ideal for a vast range of applications—from industrial automation to consumer electronics. With its compact design and robust temperature tolerance, you can trust the TS862IADT to enhance efficiency and performance, ensuring your projects stand out in quality and value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy for the package body ensures reliability and resilience in various environments.

Maximum Input Offset Voltage: 10000 uV

A maximum input offset voltage of 10 mV allows for precise signal comparisons, making it suitable for sensitive applications.

Maximum Average Bias Current (IIB): 0.0006 uA

Extremely low bias current minimizes power consumption and enhances battery life in portable devices.

Surface Mount: YES

Surface mount capability enables easy integration onto PCBs, saving space and reducing manufacturing costs.

No. of Functions: 2

Having two functions in one device increases versatility, allowing for more compact designs and reducing component count.

Package Shape: RECTANGULAR

Rectangular packaging can aid in efficient layout and routing on circuit boards, thus optimizing space utilization.

Nominal Supply Voltage / Vsup (V): 5

The nominal supply voltage of 5V aligns with common digital circuits, enabling straightforward integration and compatibility.

No. of Terminals: 8

Eight terminals provide adequate connectivity for various functionalities, ensuring flexibility in circuit design.

Package Style (Meter): SMALL OUTLINE

Small outline packages are ideal for space-constrained applications, facilitating compact system designs.

Maximum Supply Voltage Limit: 12 V

The capability to handle up to 12V enhances its applicability in different circuit environments and supply ranges.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this comparator is suitable for industrial applications without overheating issues.

Output Type: PUSH-PULL

Push-pull output configuration provides strong drive capability, allowing for better performance in driving loads.

Nominal Response Time: 2000 ns

A nominal response time of 2000 ns ensures that the comparator operates quickly, making it ideal for high-speed applications.

Minimum Operating Temperature: -40 °C

Operating temperatures down to -40 °C ensure reliable performance in extreme conditions, suitable for outdoor and harsh environments.

Terminal Position: DUAL

Dual terminal positioning allows for better mounting flexibility and easier soldering during assembly.

Maximum Seated Height: 1.75 mm

A low seated height of 1.75 mm aids in compact designs, making it easier to fit into smaller enclosures.

Width: 3.9 mm

A compact width of 3.9 mm supports space-efficient PCB layouts, crucial in modern electronics design.

Length: 4.9 mm

The compact length of 4.9 mm contributes to the overall miniaturization of electronic devices.

Temperature Grade: INDUSTRIAL

Rated for industrial temperatures, this product is built to endure demanding applications, ensuring long-term reliability.

Technology: BICMOS

BICMOS technology combines the benefits of bipolar and CMOS devices, improving performance and power efficiency.

Terminal Form: GULL WING

Gull wing terminal form allows for easy inspection and soldering, improving assembly reliability.

Amplifier Type: COMPARATOR

Being a comparator type amplifier, it is specifically designed for comparing voltages, making it ideal for precision applications.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm facilitates design compatibility with standard layouts, simplifying mass production.

Technical Specifications

Comparators TS862IADT attributes and parameters. Explore more Comparators devices from STMicroelectronics

Amplifier Characteristics

Amplifier Type:

Technology:

BICMOS

Total Functions:

2

Sub-Category:

Comparators

Output Type:

Push-Pull

Performance Specifications

Maximum Input Offset Voltage:

10 mV

Peak Bias Current:

600 pA

Operational Characteristics

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

12 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Nominal Response Time:

2 µs

Physical Characteristics

Length:

0.193 in (4.9 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

8

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

Packaging and Shipping

Package Code:

SOP

Package Shape:

Package Type:

Small Outline

Trade Compliance

TS862IADT Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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