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TS617ID

STMicroelectronics

TS617ID by STMicroelectronics

TS617ID by STMicroelectronics is a dual operational amplifier with a max input offset voltage of 12 mV and operates within -40 °C to 85 °C. It supports supply voltages from ±2.5V to ±14V, making it ideal for industrial applications. Its wideband architecture ensures high-speed performance at 1000 V/µs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,456 parts In-Stock

1+ parts

-

100+ parts

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3,456

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Vyrian

USA . 2,895 parts In-Stock

1+ parts

-

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2,895

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Anansix

USA . 1,224 parts In-Stock

1+ parts

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1,224

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,000 parts In-Stock

1+ parts

$5.590

100+ parts

-

1k+ parts

$5.031

10k+ parts

-

2,000

$5.590

-

$5.031

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Microchip USA

USA . 155 parts In-Stock

1+ parts

$8.133

100+ parts

-

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155

$8.133

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MKK Technologies

India . 1,656 parts In-Stock

1+ parts

$10.511

100+ parts

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1,656

$10.511

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DigiPath Technology Company

USA . 1,656 parts In-Stock

1+ parts

$10.511

100+ parts

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10k+ parts

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1,656

$10.511

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Vigor

Singapore . 2,703 parts In-Stock

1+ parts

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2,703

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Corphita

USA . 2,063 parts In-Stock

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2,063

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Parana Technologies

USA . 1,367 parts In-Stock

1+ parts

-

100+ parts

$6.684

1k+ parts

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10k+ parts

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1,367

-

$6.684

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Overview

Unlock precision and reliability with the TS617ID operational amplifier from STMicroelectronics. Renowned for its exceptional quality, STMicroelectronics delivers cutting-edge solutions perfect for a range of applications, from industrial control to audio processing. Experience enhanced performance with superior common mode rejection and versatile power supply options, ensuring your designs meet the highest standards while maximizing efficiency and durability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable plastic/epoxy body material ensures robust performance and longevity even in demanding environmental conditions.

Maximum Input Offset Voltage: 12000 uV

With a maximum input offset voltage of 12000 uV, this op-amp guarantees accurate signal amplification suitable for precision applications.

Surface Mount: YES

The surface mount design allows for compact placement on PCBs, making it ideal for space-constrained applications.

No. of Functions: 2

Having two functions increases the versatility of the op-amp in various circuit designs, allowing for a reduction in component count.

Package Shape: RECTANGULAR

The rectangular package shape contributes to efficient space utilization and is commonly compatible with standard mounting processes.

Nominal Common Mode Reject Ratio: 50 dB

A common mode reject ratio of 50 dB ensures that common noise is minimized, providing cleaner signal processing.

Nominal Supply Voltage / Vsup (V): 6

The nominal supply voltage of 6V balances performance and power consumption, making it suitable for a wide range of applications.

Power Supplies (V): +-2.5/+-6/+5/+12

Flexible power supply options provide adaptability across different design requirements, enhancing the usability of the op-amp.

No. of Terminals: 14

With 14 terminals, this op-amp facilitates numerous connections for various circuit configurations, enhancing design flexibility.

Package Style (Meter): SMALL OUTLINE

The small outline package style is highly space-efficient, making it ideal for compact electronic devices.

Maximum Supply Voltage Limit: 14 V

A maximum supply voltage of 14V provides headroom for operation in demanding environments, supporting more robust circuit designs.

Maximum Operating Temperature: 85 °C

An operating temperature limit of 85 °C ensures reliable performance in moderate thermal conditions, suitable for industrial applications.

Frequency Compensation: YES

Inbuilt frequency compensation enhances stability across various frequencies, ensuring reliable operation in feedback systems.

Minimum Operating Temperature: -40 °C

The ability to operate down to -40 °C enhances reliability in harsh, cold environments, making it suitable for industrial applications.

Terminal Finish: NICKEL PALLADIUM GOLD

High-quality terminal finishes ensure excellent solderability and connection reliability, promoting longer-term performance.

Terminal Position: DUAL

Dual terminal positions provide flexibility in layout design and connectivity options on PCBs.

Maximum Seated Height: 1.75 mm

A low seated height of 1.75 mm is beneficial for high-density PCB designs, minimizing vertical space requirements.

Width: 3.9 mm

A compact width of 3.9 mm allows this op-amp to fit into narrow spaces, suitable for miniaturized electronics.

Maximum Time At Peak Reflow Temperature (s): 40

A maximum reflow time of 40 seconds is conducive to efficient assembly processes without compromising component integrity.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C indicates robustness against thermal stress during assembly, which is crucial for high-reliability applications.

Length: 8.65 mm

The short length of 8.65 mm contributes to its space efficiency, making it suitable for cramped PCB layouts.

Power: YES

The capability to power external components enhances design versatility, allowing the op-amp to serve in varying applications.

Temperature Grade: INDUSTRIAL

Designed for industrial-grade applications, this op-amp promises durability and reliability under rigorous conditions.

Maximum Negative Supply Voltage Limit: -14 V

A maximum negative supply voltage limit of -14V grants broader application possibilities in signal processing and analog circuits.

Technology: BIPOLAR

Bipolar technology produces higher performance for analog applications, ensuring better linearity and frequency response.

Terminal Form: GULL WING

Gull-wing terminals assist in improved mounting and stability on PCB, contributing to reliable electrical connections.

Amplifier Type: OPERATIONAL AMPLIFIER

As an operational amplifier, this component is versatile for a variety of analog signal processing tasks, from simple amplification to complex filtering.

Maximum Supply Current: 32 mA

With a maximum supply current of 32 mA, the op-amp can efficiently drive loads, making it suitable for practical applications.

Nominal Negative Supply Voltage (Vsup): -6 V

A nominal negative supply voltage of -6V allows for effective signal processing of bipolar signals.

Architecture: VOLTAGE-FEEDBACK

Voltage-feedback architecture is well-suited for various linear applications, providing high gain and stability.

Nominal Slow Rate: 1000 V/us

A high nominal slew rate of 1000 V/us ensures the op-amp can handle fast signal changes, vital for high-speed applications.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch allows for good dense spacing on PCB, ensuring compatibility with various layouts.

Wideband: YES

Being wideband, this op-amp can handle a range of frequencies, making it well-suited for RF and high-speed applications.

Technical Specifications

Operational Amplifiers (Op Amps) TS617ID attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from STMicroelectronics

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

BIPOLAR

Power Supply:

±2.5/±6/+5/+12 V

Total Functions:

2

Sub-Category:

Operational Amplifiers

Powered:

Yes

Frequency Compensation:

Yes

Low-Bias:

No

Low-Offset:

No

Micropower:

No

Wideband:

Yes

Programmable Power:

No

Performance Specifications

Nominal Common Mode Rejection Ratio (CMRR ):

50 dB

Input Offset Voltage Limit:

12000 uV

Nominal Slew Rate:

1000 V/us

Operational Characteristics

Nominal Supply Voltage:

6 V

Maximum Supply Voltage:

14 V

Maximum Negative Supply Voltage:

-6 V

Minimum Negative Supply Voltage:

-14 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Reflow Peak Time Limit:

40 s

Maximum Supply Current:

32 mA

Physical Characteristics

Length:

0.341 in (8.65 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

14

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel Palladium Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Packaging and Shipping

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

SOP14,.25

Trade Compliance

TS617ID Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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