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TS612IDD

STMicroelectronics

TS612IDD by STMicroelectronics

TS612IDD by STMicroelectronics is a dual operational amplifier with a max input offset voltage of 10 mV and a common mode reject ratio of 108 dB. It operates within -40 °C to 85 °C, making it ideal for industrial applications. Its compact SO package ensures efficient surface mounting.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,753 parts In-Stock

1+ parts

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4,753

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Digiode

USA . 3,142 parts In-Stock

1+ parts

-

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-

1k+ parts

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3,142

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Anansix

USA . 2,328 parts In-Stock

1+ parts

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2,328

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 221 parts In-Stock

1+ parts

$2.734

100+ parts

-

1k+ parts

$2.461

10k+ parts

-

221

$2.734

-

$2.461

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MKK Technologies

India . 766 parts In-Stock

1+ parts

$5.142

100+ parts

-

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766

$5.142

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DigiPath Technology Company

USA . 766 parts In-Stock

1+ parts

$5.142

100+ parts

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766

$5.142

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Corphita

USA . 2,568 parts In-Stock

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2,568

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Parana Technologies

USA . 1,484 parts In-Stock

1+ parts

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100+ parts

$3.269

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1,484

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$3.269

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Overview

Elevate your design with the TS612IDD from STMicroelectronics—a powerhouse operational amplifier designed for precision and reliability. With superior performance in industrial applications, it ensures exceptional accuracy and low noise levels, making it perfect for critical signal processing tasks. Trust in STMicroelectronics’ legacy of innovation and quality to enhance your projects, while enjoying the advantages of a compact, easy-to-integrate solution that drives efficiency and boosts your product's performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable material ensures reliability and longevity in various applications.

Maximum Input Offset Voltage: 10000 uV

Low input offset voltage enhances accuracy and precision in signal processing.

Maximum Average Bias Current (IIB): 30 uA

Low bias current minimizes signal distortion, making it suitable for sensitive applications.

Surface Mount: YES

Surface mount technology facilitates compact PCB design and automated manufacturing.

No. of Functions: 2

Dual function capability allows for versatility in various circuit designs.

Package Shape: RECTANGULAR

Rectangular package shape improves space utilization on printed circuit boards.

Nominal Common Mode Reject Ratio: 108 dB

High CMRR ensures excellent performance in noisy environments, enhancing signal integrity.

Nominal Supply Voltage / Vsup: 6 V

Optimal supply voltage supports efficient power usage while maintaining performance.

No. of Terminals: 20

Increased terminal count allows for more complex configurations and applications.

Package Style (Meter): SMALL OUTLINE

The small outline design is ideal for space-constrained applications.

Maximum Supply Voltage Limit: 7 V

Supports a wide range of applications without exceeding voltage ratings.

Maximum Operating Temperature: 85 °C

High temperature tolerance ensures reliability in demanding environments.

Minimum Operating Temperature: -40 °C

Operational in extreme cold conditions, making it suitable for industrial applications.

Terminal Position: DUAL

Dual terminal positioning provides flexibility in circuit integration.

Maximum Seated Height: 2.65 mm

Low profile design fits in compact applications while maintaining performance.

Width: 7.5 mm

Compact width enables efficient use of printed circuit board real estate.

Length: 12.8 mm

Short length helps in minimizing the footprint on the PCB for better design.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, ensuring durability and performance under harsh conditions.

Maximum Negative Supply Voltage Limit: -7 V

Wide negative voltage range allows for more versatile applications in analog circuits.

Nominal Negative Supply Voltage (Vsup): -6 V

Suitable for circuits requiring dual supply operations, enhancing functionality.

Nominal Unity Gain Bandwidth: 130000 kHz

High bandwidth supports high-speed applications, ideal for fast signal processing.

Nominal Slow Rate: 40 V/us

This high slew rate improves response time in fast-switching applications.

Terminal Pitch: 1.27 mm

Standard terminal pitch allows for compatible PCB design and ease of soldering.

Technical Specifications

Operational Amplifiers (Op Amps) TS612IDD attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from STMicroelectronics

Amplifier Characteristics

Amplifier Type:

Total Functions:

2

Sub-Category:

Operational Amplifiers

Performance Specifications

Nominal Unity Gain Bandwidth:

130 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

108 dB

Input Offset Voltage Limit:

10000 uV

Nominal Slew Rate:

40 V/us

Peak Bias Current:

30 uA

Operational Characteristics

Nominal Supply Voltage:

6 V

Maximum Supply Voltage:

7 V

Maximum Negative Supply Voltage:

-6 V

Minimum Negative Supply Voltage:

-7 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Physical Characteristics

Length:

0.504 in (12.8 mm)

Width:

0.295 in (7.5 mm)

Maximum Seated Height:

0.104 in (2.65 mm)

Total Terminals:

20

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G20

Packaging and Shipping

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Trade Compliance

TS612IDD Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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