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TS612IDDT

STMicroelectronics

TS612IDDT by STMicroelectronics

TS612IDDT by STMicroelectronics is a dual operational amplifier ideal for industrial applications. It features a max input offset voltage of 10 mV, a common mode reject ratio of 108 dB, and operates within -40 °C to 85 °C. Its compact SO package ensures efficient surface mounting.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,901 parts In-Stock

1+ parts

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100+ parts

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4,901

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Vyrian

USA . 4,799 parts In-Stock

1+ parts

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4,799

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Anansix

USA . 625 parts In-Stock

1+ parts

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625

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 817 parts In-Stock

1+ parts

$4.216

100+ parts

-

1k+ parts

$3.795

10k+ parts

-

817

$4.216

-

$3.795

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MKK Technologies

India . 376 parts In-Stock

1+ parts

$7.929

100+ parts

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376

$7.929

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DigiPath Technology Company

USA . 376 parts In-Stock

1+ parts

$7.929

100+ parts

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376

$7.929

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Corphita

USA . 1,887 parts In-Stock

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1,887

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Parana Technologies

USA . 1,235 parts In-Stock

1+ parts

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100+ parts

$5.041

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1,235

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$5.041

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Overview

Elevate your designs with the TS612IDDT from STMicroelectronics, a leading name in semiconductor innovation. This dual operational amplifier promises unmatched precision and reliability with an impressive common mode rejection ratio at its core. Ideal for diverse applications, from industrial automation to audio processing, it enhances performance while minimizing noise. Count on STMicroelectronics’ legacy of quality to deliver exceptional value, ensuring your projects achieve their fullest potential!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy ensures robustness and reliability in various environments.

Maximum Input Offset Voltage: 10000 uV

This low input offset voltage enhances precision in signal amplification, making it suitable for high-accuracy applications.

Maximum Average Bias Current (IIB): 30 uA

The low bias current reduces power consumption and improves battery life in portable devices.

Surface Mount: YES

Being surface mount compatible allows for easier integration into compact and high-density circuit designs.

No. of Functions: 2

Having multiple functions in a single package increases design flexibility and reduces component count.

Package Shape: RECTANGULAR

The rectangular shape facilitates efficient layout in PCB designs, optimizing board space.

Nominal Common Mode Reject Ratio: 108 dB

A high CMRR ensures effective rejection of common-mode signals, improving signal integrity.

Nominal Supply Voltage / Vsup (V): 6

The nominal supply voltage provides compatibility with a wide range of power supply solutions.

No. of Terminals: 20

With 20 terminals, this component offers multiple connectivity options for enhanced circuit design.

Package Style (Meter): SMALL OUTLINE

The small outline package minimizes space usage on PCBs, making it ideal for compact applications.

Maximum Supply Voltage Limit: 7 V

The high supply voltage limit allows for versatility in various power applications.

Maximum Operating Temperature: 85 °C

The wide operating temperature range ensures reliable performance in challenging environmental conditions.

Minimum Operating Temperature: -40 °C

This specification makes the op-amp suitable for industrial applications in extreme weather.

Terminal Position: DUAL

Dual terminal positioning simplifies connections and enhances layout flexibility.

Maximum Seated Height: 2.65 mm

A low seated height is advantageous for low-profile designs, supporting compact applications.

Width: 7.5 mm

The width of 7.5 mm strikes a balance between size and terminal connectivity options.

Length: 12.8 mm

The length allows for additional terminals for enhanced functionality in a compact footprint.

Temperature Grade: INDUSTRIAL

Being rated for industrial use indicates robustness for demanding applications, ensuring longevity.

Maximum Negative Supply Voltage Limit: -7 V

This allows for flexible dual-supply configurations, expanding usability in various circuits.

Nominal Negative Supply Voltage (Vsup): -6 V

The nominal negative supply voltage allows for symmetric power supply configuration, enhancing versatility.

Nominal Unity Gain Bandwidth: 130000 kHz

A high unity gain bandwidth facilitates accurate and high-speed signal processing in demanding applications.

Nominal Slow Rate: 40 V/us

The high slew rate ensures fast response to input signals, making it ideal for high-frequency applications.

Terminal Pitch: 1.27 mm

A standard terminal pitch simplifies integration into existing designs, ensuring compatibility with PCB layouts.

Technical Specifications

Operational Amplifiers (Op Amps) TS612IDDT attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from STMicroelectronics

Amplifier Characteristics

Amplifier Type:

Total Functions:

2

Sub-Category:

Operational Amplifiers

Performance Specifications

Nominal Unity Gain Bandwidth:

130 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

108 dB

Input Offset Voltage Limit:

10000 uV

Nominal Slew Rate:

40 V/us

Peak Bias Current:

30 uA

Operational Characteristics

Nominal Supply Voltage:

6 V

Maximum Supply Voltage:

7 V

Maximum Negative Supply Voltage:

-6 V

Minimum Negative Supply Voltage:

-7 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Physical Characteristics

Length:

0.504 in (12.8 mm)

Width:

0.295 in (7.5 mm)

Maximum Seated Height:

0.104 in (2.65 mm)

Total Terminals:

20

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G20

Packaging and Shipping

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Trade Compliance

TS612IDDT Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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