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TS419

STMicroelectronics

TS419 by STMicroelectronics

STMicroelectronics' TS419 is an audio amplifier IC with 8 terminals, operating from -40 to 85 °C. It has a power supply range of 2-5V and low supply current of 2.5mA, suitable for industrial applications requiring small outline surface-mount packages.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 1,442 parts In-Stock

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1,442

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Digiode

USA . 908 parts In-Stock

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908

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Vyrian

USA . 381 parts In-Stock

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381

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,608 parts In-Stock

1+ parts

$0.594

100+ parts

-

1k+ parts

$0.535

10k+ parts

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1,608

$0.594

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$0.535

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MKK Technologies

India . 752 parts In-Stock

1+ parts

$1.118

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752

$1.118

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DigiPath Technology Company

USA . 752 parts In-Stock

1+ parts

$1.118

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752

$1.118

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Corphita

USA . 4,099 parts In-Stock

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4,099

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Parana Technologies

USA . 1,450 parts In-Stock

1+ parts

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$0.711

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1,450

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$0.711

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Overview

Elevate your audio and video experience with the TS419 by STMicroelectronics. Crafted with precision and quality, this audio amplifier offers exceptional performance and reliability, making it a trusted choice for a wide range of applications. Whether you're enhancing your home entertainment system or upgrading your automotive sound system, the TS419 delivers crystal-clear sound and powerful amplification. Trust in STMicroelectronics' expertise in semiconductor manufacturing to provide you with a product that exceeds expectations. Elevate your audio experience today with the TS419.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the amplifier, ensuring a long lifespan and reliable performance.

Surface Mount: YES

Being surface mountable makes installation easier and more space-efficient in circuit design.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient placement on a PCB, optimizing layout and space utilization.

General IC Type: AUDIO AMPLIFIER

Specifically designed for audio applications, ensuring high-quality sound output and performance.

Power Supplies (V): 2/5

This range of power supplies allows for versatility in different applications and power requirements.

No. of Terminals: 8

Having 8 terminals provides flexibility in connectivity options and allows for various configurations.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB, making it ideal for compact designs.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the amplifier can withstand elevated temperatures without compromising performance.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures the amplifier can operate in a wide range of environmental conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

This terminal finish provides good conductivity and corrosion resistance, ensuring reliable connections.

Terminal Position: DUAL

Having dual terminal positions allows for flexible installation options and ensures compatibility with different circuit layouts.

Temperature Grade: INDUSTRIAL

With an industrial temperature grade, this amplifier is suitable for a wide range of industrial applications and environments.

Technology: BIPOLAR

Bipolar technology offers high voltage gain and low noise, making this amplifier suitable for audio amplification with high fidelity.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical stability and ease of soldering during installation.

Maximum Supply Current: 2.5 mA

The low maximum supply current ensures efficient power consumption and minimizes heat generation.

Terminal Pitch: 1.27 mm

The small terminal pitch allows for close spacing on the PCB, enabling high-density circuit designs.

Technical Specifications

Audio & Video Amplifiers TS419 attributes and parameters. Explore more Audio & Video Amplifiers devices from STMicroelectronics

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

2/5

Qualification:

Not Qualified

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

2.5 mA

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

TS419 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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