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TS419-4IST

STMicroelectronics

TS419-4IST by STMicroelectronics

TS419-4IST by STMicroelectronics is a compact audio amplifier with a nominal output power of 0.367 W and a gain of 12 dB. It operates in temperatures from -40 °C to 85°C, making it suitable for industrial applications. Its small outline design ensures easy surface mounting in various devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 1,953 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,953

-

-

-

-

Digiode

USA . 765 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

765

-

-

-

-

Vyrian

USA . 370 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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370

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,154 parts In-Stock

1+ parts

$1.440

100+ parts

-

1k+ parts

$1.296

10k+ parts

-

1,154

$1.440

-

$1.296

-

MKK Technologies

India . 438 parts In-Stock

1+ parts

$2.707

100+ parts

-

1k+ parts

-

10k+ parts

-

438

$2.707

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-

-

DigiPath Technology Company

USA . 438 parts In-Stock

1+ parts

$2.707

100+ parts

-

1k+ parts

-

10k+ parts

-

438

$2.707

-

-

-

Corphita

USA . 1,670 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,670

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-

-

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Parana Technologies

USA . 308 parts In-Stock

1+ parts

-

100+ parts

$1.722

1k+ parts

-

10k+ parts

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308

-

$1.722

-

-

Overview

Elevate your audio experience with the TS419-4IST from STMicroelectronics, a trusted leader in innovative technology. This compact, high-quality audio amplifier delivers exceptional sound clarity while fitting seamlessly into space-constrained designs. With its robust industrial-grade performance, it thrives in diverse applications—from consumer electronics to automotive systems—ensuring reliable operation even in extreme conditions. Choose the TS419-4IST for superior audio solutions that enhance value and elevate your product’s performance!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials enhances durability and resistance against environmental factors, making it suitable for a variety of applications.

Surface Mount: YES

Surface mount technology minimizes the space required on a PCB, allowing for compact designs ideal for modern electronics.

Package Shape: SQUARE

A square package shape contributes to uniform thermal performance and simplifies layout in multi-chip modules.

General IC Type: AUDIO AMPLIFIER

Designed specifically as an audio amplifier, this IC delivers high-quality sound reproduction, making it perfect for audio applications.

No. of Terminals: 8

Having 8 terminals enables versatile connectivity options for integration into various circuit designs.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

This compact style supports space-constrained applications, ideal for portable and embedded systems.

Maximum Operating Temperature: 85 °C

Operating at up to 85 °C ensures reliability in applications exposed to higher temperature environments.

Minimum Operating Temperature: -40 °C

The capability to operate at -40 °C makes it suitable for industrial and outdoor applications where extreme temperatures are encountered.

Terminal Position: DUAL

Dual terminal positions facilitate easier mounting and provide flexible design options for circuit layouts.

Nominal Output Power: 0.367 W

A nominal output power of 0.367 W is sufficient for driving small speakers and headsets, making it ideal for portable audio solutions.

Maximum Seated Height: 1.1 mm

The low seated height allows for short board profiles, aiding in the design of ultra-slim devices.

Width: 3 mm

A width of 3 mm ensures it fits into tight spaces, essential for miniaturized applications.

Minimum Supply Voltage (Vsup): 2 V

Operating at a minimum supply voltage of 2 V enhances battery life in portable devices and ensures compatibility with various power sources.

Length: 3 mm

A length of 3 mm contributes to its compact design, perfect for small audio systems and space-sensitive projects.

Temperature Grade: INDUSTRIAL

An industrial temperature grade ensures reliability and operational stability in harsh conditions typical of industrial environments.

Nominal Bandwidth: 0.02 kHz

A nominal bandwidth of 0.02 kHz allows for deep bass response, improving the overall audio experience.

Terminal Form: GULL WING

Gull wing terminals facilitate automated PCB assembly and ensure secure connections, enhancing manufacturing efficiency.

Terminal Pitch: 0.65 mm

With a terminal pitch of 0.65 mm, this amplifier can be used in dense circuit layouts without taking up too much space.

Gain: 12 dB

A gain of 12 dB provides amplified output without significant distortion, making it suitable for high-fidelity audio applications.

Maximum Supply Voltage (Vsup): 5.5 V

Supporting a maximum supply voltage of 5.5 V allows for flexibility in power supply choices, catering to various system requirements.

Technical Specifications

Audio & Video Amplifiers TS419-4IST attributes and parameters. Explore more Audio & Video Amplifiers devices from STMicroelectronics

Specs

Nominal Bandwidth:

.02 kHz

General IC Type:

Gain:

12 dB

JESD-30 Code:

S-PDSO-G8

Length:

3 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Power:

.367 W

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

3 mm

Trade Compliance

TS419-4IST General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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