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TS419-2IST

STMicroelectronics

TS419-2IST by STMicroelectronics

TS419-2IST by STMicroelectronics is a compact audio amplifier with a nominal output power of 0.367 W and operates b/w -40 °C to 85°C. It features an industrial temperature grade, making it suitable for various applications. Its small outline design ensures efficient space utilization in electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,311 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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3,311

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-

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Anansix

USA . 2,548 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,548

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Digiode

USA . 802 parts In-Stock

1+ parts

-

100+ parts

-

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802

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,185 parts In-Stock

1+ parts

$2.130

100+ parts

-

1k+ parts

$1.917

10k+ parts

-

1,185

$2.130

-

$1.917

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MKK Technologies

India . 212 parts In-Stock

1+ parts

$4.005

100+ parts

-

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212

$4.005

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DigiPath Technology Company

USA . 212 parts In-Stock

1+ parts

$4.005

100+ parts

-

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212

$4.005

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Corphita

USA . 1,004 parts In-Stock

1+ parts

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1,004

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Parana Technologies

USA . 138 parts In-Stock

1+ parts

-

100+ parts

$2.546

1k+ parts

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138

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$2.546

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Overview

Transform your audio experience with the TS419-2IST from STMicroelectronics! Renowned for quality and innovation, STMicroelectronics brings you this compact audio amplifier that delivers exceptional performance in a sleek design. Perfect for a variety of applications—from portable devices to industrial systems—its reliability and efficiency ensure crystal-clear sound. With versatile operating conditions and robust construction, elevate your projects today and connect with unparalleled audio clarity!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material offers excellent protection and thermal stability, making this amplifier suitable for various environments.

Surface Mount: YES

Surface mount technology allows for compact design and easy integration into modern circuit boards, enhancing the product's versatility.

Package Shape: SQUARE

The square package shape promotes efficient use of space on the PCB, making it an ideal choice for space-constrained applications.

General IC Type: AUDIO AMPLIFIER

As an audio amplifier, it is optimized for high-quality audio performance, ensuring clear and reliable sound reproduction.

No. of Terminals: 8

With 8 terminals, the amplifier allows for stable and versatile connections in various audio applications.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile design facilitate integration into compact devices, ideal for modern audio and multimedia equipment.

Maximum Operating Temperature: 85 °C

Suitable for industrial applications, this amplifier can operate in high-temperature environments, ensuring reliability and performance.

Minimum Operating Temperature: -40 °C

The ability to function at low temperatures makes this amplifier ideal for harsh environments and outdoor applications.

Terminal Position: DUAL

Dual terminal positioning enhances circuit layout options, allowing for more flexible designs.

Nominal Output Power: 0.367 W

This output power is adequate for driving small speakers or headphone applications, making it versatile for various audio projects.

Maximum Seated Height: 1.1 mm

A low seated height enables easier integration into compact devices where space is at a premium.

Width: 3 mm

The narrow width supports high-density designs, making the product favorable for modern electronics.

Minimum Supply Voltage (Vsup): 2 V

Supports low-voltage operations, which is perfect for battery-powered devices and energy-efficient applications.

Length: 3 mm

Small dimensions ensure compatibility with various compact designs, enhancing overall application flexibility.

Temperature Grade: INDUSTRIAL

Rated for industrial use, it withstands demanding conditions, ensuring long-term reliability and performance.

Nominal Bandwidth: 0.02 kHz

This bandwidth supports low-frequency audio applications, making it suitable for a range of sound systems.

Terminal Form: GULL WING

Gull wing terminals provide reliable connections and ease of soldering, enhancing the product's usability.

Terminal Pitch: 0.65 mm

A fine terminal pitch allows for high-density layouts, making it easier to fit multiple components on a PCB.

Gain: 6 dB

Provides sufficient amplification for most audio applications, ensuring clear sound at acceptable volume levels.

Maximum Supply Voltage (Vsup): 5.5 V

Allows flexibility in power supply choices, accommodating both low and higher voltage systems.

Technical Specifications

Audio & Video Amplifiers TS419-2IST attributes and parameters. Explore more Audio & Video Amplifiers devices from STMicroelectronics

Specs

Nominal Bandwidth:

.02 kHz

General IC Type:

Gain:

6 dB

JESD-30 Code:

S-PDSO-G8

Length:

3 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Power:

.367 W

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

3 mm

Trade Compliance

TS419-2IST General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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