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TS419IQT

STMicroelectronics

TS419IQT by STMicroelectronics

TS419IQT by STMicroelectronics is a compact audio amplifier designed for industrial applications, featuring a nominal output power of 0.367 W and operating b/w -40 °C to 85°C. It supports supply voltages from 2V to 5.5V with low current consumption of 2.5 mA. Its small outline package ensures efficient heat dissipation in space-constrained designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,514 parts In-Stock

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2,514

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Anansix

USA . 2,410 parts In-Stock

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2,410

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Digiode

USA . 727 parts In-Stock

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727

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IDEA Electronic Components Group

UK . 352 parts In-Stock

1+ parts

$1.819

100+ parts

-

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$1.637

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352

$1.819

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$1.637

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MKK Technologies

India . 1,292 parts In-Stock

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$3.420

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$3.420

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DigiPath Technology Company

USA . 1,292 parts In-Stock

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$3.420

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1,292

$3.420

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AZTECH Wire

Italy . 634 parts In-Stock

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$13.460

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634

$13.460

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Authorized Procurement Solutions

USA . 33,000 parts In-Stock

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33,000

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QUARKTWIN TECHNOLOGY LTD

USA . 20,874 parts In-Stock

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Microchip USA

USA . 5,223 parts In-Stock

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Parana Technologies

USA . 1,739 parts In-Stock

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$2.175

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$2.175

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Corphita

USA . 1,113 parts In-Stock

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Metaverse IC Inc.

Canada . 144 parts In-Stock

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Kepictronics

USA . 94 parts In-Stock

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Overview

Elevate your audio experience with the TS419IQT by STMicroelectronics—your go-to solution for high-quality sound in a compact design. Renowned for their innovation, STMicroelectronics delivers unmatched reliability and performance, making this audio amplifier perfect for diverse applications, from consumer electronics to industrial systems. Enjoy superior sound clarity, energy efficiency, and seamless integration, all while benefiting from the expertise of a trusted leader in the semiconductor industry.

Feature Benefit Bullets

Surface Mount: YES

The surface mount feature allows for easy integration into compact designs, making it ideal for space-constrained applications.

Package Shape: SQUARE

The square package shape supports efficient PCB layout and helps optimize space utilization.

General IC Type: AUDIO AMPLIFIER

Designed specifically as an audio amplifier, it delivers high-quality sound output for audio devices.

Power Supplies (V): 2/5

This versatile power supply range accommodates various applications, enhancing compatibility.

No. of Terminals: 8

With 8 terminals, it supports a wide range of connections, offering flexibility in design.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

The thin profile and small outline are ideal for modern electronics where space is a premium.

Maximum Operating Temperature: 85 °C

Withstanding higher temperatures ensures reliable performance in warm environments.

Minimum Operating Temperature: -40 °C

Operational efficiency in low temperatures makes this amplifier suitable for extreme conditions.

Terminal Position: DUAL

The dual terminal position allows for more flexible circuit designs and easier installation.

Nominal Output Power: 0.367 W

A nominal output power of 0.367 W is sufficient for driving small speakers, making it perfect for portable devices.

Maximum Seated Height: 1 mm

The low seated height ensures the device can fit into ultra-thin electronic designs.

Width: 3 mm

Compact dimensions allow for high-density PCB designs without compromising performance.

Minimum Supply Voltage (Vsup): 2 V

A low minimum supply voltage adds versatility, enabling operation in battery-powered applications.

Peak Reflow Temperature °C: 260

A high peak reflow temperature indicates robustness to soldering processes, ensuring reliability in manufacturing.

Length: 3 mm

Short length aids in miniaturization of electronic devices without sacrificing sound quality.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature classification guarantees performance under harsh conditions.

Nominal Bandwidth: 0.02 kHz

Low bandwidth is suitable for applications requiring minimal frequency response, especially in basic audio tasks.

Terminal Form: NO LEAD

Lead-free design allows for environmentally friendly practices and meets modern manufacturing standards.

Maximum Supply Current: 2.5 mA

A low maximum supply current ensures greater energy efficiency, beneficial for battery-operated devices.

Terminal Pitch: 0.5 mm

The small terminal pitch allows for compact layout designs, enabling denser packing of components.

Maximum Supply Voltage (Vsup): 5.5 V

A high maximum supply voltage allows for more powerful audio outputs, enhancing audio performance accuracy.

Technical Specifications

Audio & Video Amplifiers TS419IQT attributes and parameters. Explore more Audio & Video Amplifiers devices from STMicroelectronics

Specs

Nominal Bandwidth:

.02 kHz

General IC Type:

JESD-30 Code:

S-XDSO-N8

Length:

3 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Power:

.367 W

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

SOLCC8,.11,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

2.5 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

3 mm

Trade Compliance

TS419IQT General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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