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TS3704CD

STMicroelectronics

TS3704CD by STMicroelectronics

TS3704CD by STMicroelectronics is a CMOS comparator featuring a max input offset voltage of 6500 µV, low bias current of 0.0006 µA, and operates at a nominal voltage of 3 V. Ideal for precision applications, it supports up to 18 V supply. Its compact design ensures efficient surface mounting in various electronic devices.

Median Price

$0.685

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,613 parts In-Stock

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5,613

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Digiode

USA . 4,715 parts In-Stock

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ComSIT Distribution GmbH

Germany . 2,089 parts In-Stock

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2,089

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Lakeland Logistics Inc

USA . 1,000 parts In-Stock

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1,000

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Bristol Electronics

USA . 1,000 parts In-Stock

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$0.685

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$0.475

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1,000

-

$0.685

$0.475

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Anansix

USA . 408 parts In-Stock

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408

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Prism Electronics

USA . 30 parts In-Stock

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 519 parts In-Stock

1+ parts

$3.126

100+ parts

-

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$2.814

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519

$3.126

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$2.814

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Advanced Electronics

New Zealand . 70 parts In-Stock

1+ parts

$3.981

100+ parts

$3.623

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$3.264

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70

$3.981

$3.623

$3.264

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MKK Technologies

India . 1,219 parts In-Stock

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$5.879

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$5.879

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DigiPath Technology Company

USA . 1,219 parts In-Stock

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$5.879

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$5.879

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Microchip USA

USA . 300 parts In-Stock

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$19.059

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300

$19.059

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AZTECH Wire

Italy . 1,007 parts In-Stock

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$21.940

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$21.940

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Component Stockers USA

USA . 790 parts In-Stock

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$99.990

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$99.990

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Corphita

USA . 2,798 parts In-Stock

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Vigor

Singapore . 2,322 parts In-Stock

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Parana Technologies

USA . 1,682 parts In-Stock

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$3.738

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1,682

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$3.738

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Assy Fe

Spain . 1,000 parts In-Stock

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Kepictronics

USA . 124 parts In-Stock

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Overview

Unlock superior performance with the TS3704CD from STMicroelectronics, a leading name in innovative semiconductor solutions. This compact comparator is designed for precision and reliability in diverse applications, from industrial automation to consumer electronics. With its ultra-low power consumption and exceptional accuracy, it enhances your designs while reducing costs. Elevate your projects with STMicroelectronics’ trusted quality and enjoy seamless integration that drives success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body enhances durability and reduces weight, making it suitable for compact and portable applications.

Maximum Input Offset Voltage: 6500 uV

A low maximum input offset voltage ensures precision in comparators, allowing for better performance in applications requiring accurate signal comparisons.

Maximum Average Bias Current (IIB): 0.0006 uA

The very low average bias current minimizes power consumption, making it ideal for battery-operated or low-power applications.

Surface Mount: YES

Surface mount compatibility allows for efficient manufacturing processes and saves board space, enhancing design flexibility.

No. of Functions: 4

Having four functions in one package increases design flexibility and reduces the need for additional components, simplifying the design.

Package Shape: RECTANGULAR

The rectangular package shape is designed for efficient layout and integration on PCBs, facilitating better space utilization.

Nominal Supply Voltage / Vsup (V): 3

The nominal supply voltage of 3V allows for compatibility with low-voltage applications, making it suitable for modern electronic devices.

Power Supplies (V): 5

Support for a range of power supply voltages (up to 5V) provides versatility, enabling use in various designs.

No. of Terminals: 14

With 14 terminals, this comparator offers ample connectivity options for a variety of configurations and applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style is ideal for space-constrained applications, allowing for easier integration into compact designs.

Maximum Supply Voltage Limit: 18 V

A high maximum supply voltage limit enables the comparator to be used in a wide range of applications, even those with higher voltage requirements.

Maximum Operating Temperature: 70 °C

An operating temperature limit of 70 °C ensures reliable performance in various environments, catering to commercial applications.

Maximum Bias Current (IIB) @ 25C: 0.0006 uA

The low bias current at 25 °C contributes to energy efficiency, particularly important in mobile and other battery-powered devices.

Output Type: PUSH-PULL

Push-pull output provides high drive capability for load driving, ensuring faster signal response and better overall performance.

Nominal Response Time: 1200 ns

A nominal response time of 1200 ns supports high-speed applications, making it suitable for demanding electronic circuits.

Minimum Operating Temperature: 0 °C

A minimum operating temperature of 0 °C allows usage in cooler environments, broadening application possibilities.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish enhances solderability and corrosion resistance, ensuring reliable long-term performance.

Terminal Position: DUAL

Dual terminal positioning supports various layout options, providing flexibility during PCB design and manufacturing.

Maximum Seated Height: 1.75 mm

A low maximum seated height aids in creating slim and compact devices, which is especially important in modern electronic designs.

Width: 3.9 mm

A narrow width enables efficient space usage on PCBs, thereby facilitating compact product design.

Maximum Time At Peak Reflow Temperature: 40 s

The reasonable peak reflow time helps in maintaining component integrity during soldering processes, ensuring reliability.

Peak Reflow Temperature: 260 °C

High peak reflow temperature capability allows compatibility with various soldering techniques, including lead-free processes.

Length: 8.65 mm

A manageable length contributes to compactness, making the component easier to integrate into various board layouts.

Temperature Grade: COMMERCIAL

The commercial temperature grade indicates suitability for standard operating conditions, making it appropriate for a wide range of applications.

Technology: CMOS

CMOS technology ensures low power consumption while providing high-speed performance, ideal for modern electronic circuits.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy handling and assembly, ensuring reliable connections on PCBs.

Amplifier Type: COMPARATOR

Being specifically a comparator implies specialized functionality, making it perfect for applications needing signal level comparisons.

Maximum Supply Current: 0.1 mA

A very low maximum supply current enhances energy efficiency, making it suitable for applications with stringent power constraints.

Terminal Pitch: 1.27 mm

The standard terminal pitch allows for compatibility with common PCB layouts, simplifying the design and manufacturing process.

Technical Specifications

Comparators TS3704CD attributes and parameters. Explore more Comparators devices from STMicroelectronics

Amplifier Characteristics

Amplifier Type:

Technology:

CMOS

Power Supply:

5 V

Total Functions:

4

Sub-Category:

Comparators

Output Type:

Push-Pull

Performance Specifications

Maximum Input Offset Voltage:

6.5 mV

Peak Bias Current:

600 pA

Maximum Bias Current (IIB) @25 °C:

600 pA

Operational Characteristics

Maximum Supply Current:

100 μA

Nominal Supply Voltage:

3 V

Maximum Supply Voltage:

18 V

Lowest Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Reflow Peak Time Limit:

40

Peak Reflow Temperature:

260 °C (500 °F)

Nominal Response Time:

1.2 µs

Physical Characteristics

Length:

0.341 in (8.65 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

14

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel Palladium Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Packaging and Shipping

Package Code:

SOP

Package Shape:

Package Type:

Small Outline

Package Equivalence Code:

SOP14,.25

Trade Compliance

TS3704CD Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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