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TPI80-12

STMicroelectronics

TPI80-12 by STMicroelectronics

TPI80-12 by STMicroelectronics is a SILICON SURGE PROTECTOR with 80V Reverse Voltage, 150 °C Max Temp, and 120V Breakdown Voltage. It is ideal for surge protection applications in various electronic devices due to its high holding current and trigger device type.

Median Price

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Lifecycle Status

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4

In-Stock Inventory

1k+

TPI80-12 by STMicroelectronics
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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,739 parts In-Stock

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3,739

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Vyrian

USA . 1,574 parts In-Stock

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1,574

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Anansix

USA . 429 parts In-Stock

1+ parts

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429

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LWI Electronics Inc

India . 52 parts In-Stock

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52

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,279 parts In-Stock

1+ parts

$1.948

100+ parts

-

1k+ parts

$1.753

10k+ parts

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2,279

$1.948

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$1.753

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MKK Technologies

India . 574 parts In-Stock

1+ parts

$3.662

100+ parts

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574

$3.662

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DigiPath Technology Company

USA . 574 parts In-Stock

1+ parts

$3.662

100+ parts

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574

$3.662

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Corphita

USA . 1,438 parts In-Stock

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1,438

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Parana Technologies

USA . 985 parts In-Stock

1+ parts

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$2.329

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985

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$2.329

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Overview

Enhance your electronic devices with the TPI80-12 by STMicroelectronics, a top-tier manufacturer known for its quality products. This Silicon Surge Protector offers unmatched protection against voltage spikes, ensuring the longevity of your equipment. With a high maximum holding current of 150 mA and a maximum breakdown voltage of 120 V, this device is perfect for a wide range of applications. Trust in STMicroelectronics to deliver reliable solutions that prioritize the safety and performance of your electronics.

Feature Benefit Bullets

Repetitive Peak Reverse Voltage: 80 V

This high reverse voltage capability protects the circuit against overvoltage events, ensuring the surge protector can handle repeated instances of voltage spikes without damage.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this surge protector can function effectively in a wide range of environments, making it versatile and reliable for various applications.

Trigger Device Type: SILICON SURGE PROTECTOR

The use of silicon surge protector as the trigger device ensures fast response times to transient voltage surges, offering effective protection for connected devices and equipment.

Terminal Finish: TIN LEAD

The tin lead terminal finish provides good solderability and durability, ensuring secure and reliable connections for the surge protector within the circuit.

Maximum Holding Current: 150 mA

With a high maximum holding current capacity, this surge protector can effectively clamp and divert excess current during surge events, preventing damage to downstream components.

Maximum Breakdown Voltage: 120 V

The maximum breakdown voltage of 120 V ensures that the surge protector activates at an appropriate voltage threshold, providing timely protection against overvoltage conditions.

Technical Specifications

Silicon Surge Protectors TPI80-12 attributes and parameters. Explore more Silicon Surge Protectors devices from STMicroelectronics

Specs

Maximum Breakdown Voltage:

120 V

Maximum Holding Current:

150 mA

JESD-609 Code:

e0

Maximum Operating Temperature:

150 Cel

Repetitive Peak Reverse Voltage:

80 V

Sub-Category:

Silicon Surge Protectors

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Trigger Device Type:

Trade Compliance

TPI80-12 Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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