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TPI12011P

STMicroelectronics

TPI12011P by STMicroelectronics

TPI12011P by STMicroelectronics is a silicon surge protector designed for robust circuit protection. It features a max breakdown voltage of 180 V, non-repetitive peak on-state current of 5 A, and comes in a compact rectangular package. Ideal for applications requiring reliable surge protection in electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,142 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,142

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-

-

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Digiode

USA . 1,535 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,535

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-

-

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Anansix

USA . 566 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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566

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 960 parts In-Stock

1+ parts

$3.483

100+ parts

-

1k+ parts

$3.135

10k+ parts

-

960

$3.483

-

$3.135

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MKK Technologies

India . 2,120 parts In-Stock

1+ parts

$6.550

100+ parts

-

1k+ parts

-

10k+ parts

-

2,120

$6.550

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-

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DigiPath Technology Company

USA . 2,120 parts In-Stock

1+ parts

$6.550

100+ parts

-

1k+ parts

-

10k+ parts

-

2,120

$6.550

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-

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Corphita

USA . 1,271 parts In-Stock

1+ parts

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100+ parts

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1,271

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-

-

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Parana Technologies

USA . 177 parts In-Stock

1+ parts

-

100+ parts

$4.165

1k+ parts

-

10k+ parts

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177

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$4.165

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Overview

Elevate your designs with the TPI12011P from STMicroelectronics, a premier choice in silicon surge protection. Crafted for reliability and performance, this compact device safeguards sensitive electronics against voltage spikes, ensuring longevity and peace of mind. With ST's renowned quality and innovation, you gain a trusted partner that enhances application resilience across various sectors. Choose TPI12011P for superior protection and unmatched value in your projects!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides excellent mechanical protection and thermal stability, making it durable and reliable in various operating conditions.

Configuration: DELTA CONNECTED, 3 ELEMENTS

The delta-connected configuration enhances protection against transient voltage spikes, ensuring better performance and safety for connected devices.

Non Repetitive Peak On-state Current: 5 A

With a non-repetitive peak on-state current of 5 A, this product can effectively handle short surges, shielding your equipment from potential damage during transient events.

Surface Mount: YES

Being a surface mount device allows for efficient integration into compact PCB designs, ensuring space-saving and improved reliability in electronic assemblies.

Package Shape: RECTANGULAR

The rectangular package shape enables easy placement on circuit boards, facilitating better component arrangement and optimizing space utilization.

Terminal Form: GULL WING

The gull wing terminal form provides enhanced soldering reliability and mechanical strength, ensuring long-lasting connections on printed circuit boards.

No. of Elements: 3

Having three elements offers a robust level of protection against voltage surges, making this product suitable for applications requiring high reliability.

No. of Terminals: 8

With eight terminals, this product allows for versatile connections and configurations, accommodating various circuit designs with ease.

Package Style (Meter): SMALL OUTLINE

The small outline package style is ideal for modern electronics where space is limited, allowing for increased component density without sacrificing performance.

Trigger Device Type: SILICON SURGE PROTECTOR

As a silicon surge protector, it provides superior clamping sensitivity and fast response times, effectively protecting sensitive electronics from voltage spikes.

Terminal Position: DUAL

The dual terminal position facilitates flexible mounting options and simplifies layouts in complex circuit designs, enhancing design efficiency.

Maximum Breakdown Voltage: 180 V

The maximum breakdown voltage of 180 V ensures that this product can withstand high voltage surges, making it suitable for demanding applications requiring robust protection.

Technical Specifications

Silicon Surge Protectors TPI12011P attributes and parameters. Explore more Silicon Surge Protectors devices from STMicroelectronics

Specs

Maximum Breakdown Voltage:

180 V

JESD-30 Code:

R-PDSO-G8

Non Repetitive Peak On-state Current:

5 A

No. of Elements:

3

No. of Terminals:

8

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

Trigger Device Type:

Trade Compliance

TPI12011P Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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