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TEA6422

STMicroelectronics

TEA6422 by STMicroelectronics

TEA6422 by STMicroelectronics is a versatile audio/video switch with 12 channels and operates at a nominal voltage of 9V. It features a compact rectangular package (22.86mm x 7.62mm) and supports temperatures from 0 °C to 70°C. Ideal for multiplexing applications, it ensures reliable performance in commercial settings.

Median Price

$5.152

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 346 parts In-Stock

1+ parts

$5.152

100+ parts

$2.404

1k+ parts

$2.112

10k+ parts

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346

$5.152

$2.404

$2.112

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Vyrian

USA . 7,464 parts In-Stock

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Digiode

USA . 4,458 parts In-Stock

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4,458

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Anansix

USA . 2,689 parts In-Stock

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2,689

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LIBRA Elektronik GmbH

Germany . 2,202 parts In-Stock

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2,202

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Q Components

USA . 356 parts In-Stock

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356

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A2Z Electronics, Inc.

USA . 346 parts In-Stock

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346

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ACDS - Activité Composants Distribution Service

France . 330 parts In-Stock

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330

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Dan-Mar Components

USA . 330 parts In-Stock

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330

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Halfin

Belgium . 260 parts In-Stock

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260

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Cyclops Electronics Ltd

UK . 50 parts In-Stock

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50

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LittleDiode

UK . 22 parts In-Stock

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22

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Zilex Electronics Inc.

Canada . 20 parts In-Stock

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20

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Fibra_Brandt Electronic GMBH

Germany . 16 parts In-Stock

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Donberg Electronics Ltd

Ireland . 2 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 297 parts In-Stock

1+ parts

$6.453

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297

$6.453

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AZTECH Wire

Italy . 233 parts In-Stock

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$17.080

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233

$17.080

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IDEA Electronic Components Group

UK . 1,847 parts In-Stock

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$18.209

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$16.388

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1,847

$18.209

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$16.388

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MKK Technologies

India . 1,072 parts In-Stock

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$34.240

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1,072

$34.240

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DigiPath Technology Company

USA . 1,072 parts In-Stock

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$34.240

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1,072

$34.240

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A-Z Elektronik GmbH

Germany . 5,705 parts In-Stock

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5,705

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GreenTree Electronics

Israel . 3,200 parts In-Stock

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Corphita

USA . 1,819 parts In-Stock

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Parana Technologies

USA . 1,651 parts In-Stock

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$21.771

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$21.771

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Assy Fe

Spain . 1,542 parts In-Stock

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Kepictronics

USA . 566 parts In-Stock

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566

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Overview

Elevate your audio and video projects with the TEA6422 from STMicroelectronics, a leader in innovative semiconductor solutions. This versatile multiplexer delivers exceptional quality and reliability, ensuring seamless signal routing in various applications. With its robust design and high-performance capabilities, the TEA6422 empowers engineers to create superior consumer electronics, enhancing user experiences while streamlining integration. Choose STMicroelectronics for unmatched performance and peace of mind in every connection!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy in the package body provides durability and protection against environmental factors, making it a reliable choice for various applications.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient use of PCB space, facilitating easier integration into designs.

Nominal Supply Voltage (Vsup): 9 V

A nominal supply voltage of 9 V offers good compatibility with a variety of audio/video systems, ensuring optimal performance.

Power Supplies (V): 9

Utilizing a single voltage supply simplifies design and reduces component count in audio/video applications.

No. of Terminals: 24

Having 24 terminals allows for multiple connections, enhancing flexibility and functionality in circuit designs.

Package Style (Meter): IN-LINE, SHRINK PITCH

The in-line package style with a shrink pitch supports space-constrained applications and is compatible with automated assembly processes.

Maximum Operating Temperature: 70 °C

A maximum operating temperature of 70 °C ensures reliable performance in a range of environments, making it suitable for consumer electronics.

Minimum Operating Temperature: 0 °C

With a minimum operating temperature of 0 °C, this product is capable of functioning in cold environments, ensuring versatility.

Terminal Finish: MATTE TIN

The matte tin terminal finish enhances solderability and provides resistance to corrosion, ensuring longevity of the connections.

Terminal Position: DUAL

Dual terminal position design promotes ease of use and installation, making it user-friendly for engineers.

Output (V): SEPARATE OUTPUT

Separate output capability allows for more customized signal routing in audio/video applications, providing enhanced performance.

Maximum Seated Height: 5.08 mm

A compact maximum seated height of 5.08 mm helps save board space and allows for more compact designs.

Width: 7.62 mm

With a width of 7.62 mm, this component can fit into tighter layouts, increasing design flexibility.

Other IC type: AUDIO/VIDEO SWITCH

Designed specifically for audio/video applications, this component is optimized for providing high-quality signal switching.

Length: 22.86 mm

A length of 22.86 mm offers a balanced footprint, making it suitable for various PCB layouts.

Temperature Grade: COMMERCIAL

Commercial temperature grade indicates robustness for general use, reassuring reliability in typical operating conditions.

No. of Channels: 12

Having 12 channels allows for complex signal routing, making it ideal for multi-channel audio/video applications.

Terminal Form: THROUGH-HOLE

Through-hole terminal form provides mechanical stability and ease of soldering, which is beneficial for durability and serviceability.

Terminal Pitch: 1.778 mm

A terminal pitch of 1.778 mm allows for denser packaging without compromising ease of installation, making it a practical choice for complex boards.

Technical Specifications

Multiplexers & Switches TEA6422 attributes and parameters. Explore more Multiplexers & Switches devices from STMicroelectronics

Specs

Other IC type:

JESD-30 Code:

R-PDIP-T24

JESD-609 Code:

e3

Length:

22.86 mm

No. of Channels:

12

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output (V):

SEPARATE OUTPUT

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SDIP24,.3

Package Shape:

Package Style (Meter):

IN-LINE, SHRINK PITCH

Power Supplies (V):

9

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Multiplexer or Switches

Nominal Supply Voltage (Vsup):

9 V

Surface Mount:

NO

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

1.778 mm

Terminal Position:

DUAL

Width (mm):

7.62 mm

Trade Compliance

TEA6422 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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