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TEA6430

STMicroelectronics

TEA6430 by STMicroelectronics

TEA6430 by STMicroelectronics is a BICMOS audio/video switch with 10 channels, operating at a nominal voltage of 8V. It features a compact rectangular package (22.86mm x 7.62mm) and operates b/w 0 °C to 70°C. Ideal for multiplexing applications in consumer electronics.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,577 parts In-Stock

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2,577

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Vyrian

USA . 2,146 parts In-Stock

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2,146

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Digiode

USA . 491 parts In-Stock

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491

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,186 parts In-Stock

1+ parts

$19.889

100+ parts

-

1k+ parts

$17.900

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1,186

$19.889

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$17.900

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MKK Technologies

India . 296 parts In-Stock

1+ parts

$37.399

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296

$37.399

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DigiPath Technology Company

USA . 296 parts In-Stock

1+ parts

$37.399

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296

$37.399

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Corphita

USA . 4,922 parts In-Stock

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4,922

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Parana Technologies

USA . 2,309 parts In-Stock

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$23.780

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2,309

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$23.780

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Kepictronics

USA . 2,120 parts In-Stock

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2,120

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Glotronic Ltd.

UK . 702 parts In-Stock

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702

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Assy Fe

Spain . 20 parts In-Stock

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Overview

Elevate your audio and video applications with the TEA6430 from STMicroelectronics, a leader in innovative solutions! This versatile multiplexer delivers exceptional quality and reliability, ensuring seamless performance in demanding environments. With its robust design and 10-channel capability, it simplifies complex signal routing while enhancing overall system efficiency. Experience unmatched value and trust in STMicroelectronics for cutting-edge technology that drives your projects forward!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and protection against environmental factors, making the product reliable for long-term usage.

Package Shape: RECTANGULAR

A rectangular shape allows for efficient circuit board layout and optimal use of space in electronic designs.

Nominal Supply Voltage (Vsup): 8 V

An 8V nominal supply voltage is versatile, catering to a range of applications while maintaining efficiency.

Power Supplies (V): 8

Compatible with standard 8V power supplies, ensuring easy integration into existing systems.

No. of Terminals: 24

With 24 terminals, this device provides extensive connectivity options, suitable for complex applications.

Package Style (Meter): IN-LINE, SHRINK PITCH

The in-line, shrink pitch style enhances the compactness of the design, making it suitable for space-constrained applications.

Maximum Operating Temperature: 70 °C

A maximum operating temperature of 70 °C indicates good thermal performance, making it suitable for various environments.

Minimum Operating Temperature: 0 °C

Starting from 0 °C ensures the device functions well in low-temperature applications, expanding its usability.

Terminal Finish: TIN LEAD

The tin-lead finish provides reliable soldering and enhances the longevity of the connections.

Terminal Position: DUAL

Dual terminal positions allow for flexible mounting options, making it easier to incorporate into different designs.

Output (V): SEPARATE OUTPUT

Separate outputs allow for greater control and versatility in audio/video applications.

Maximum Seated Height: 5.08 mm

With a low seated height, this product can fit into compact spaces without compromising functionality.

Width (mm): 7.62 mm

A narrow width streamlines design, making it more adaptable to various circuit configurations.

Other IC type: AUDIO/VIDEO SWITCH

Designed for audio/video switching, it is specially tailored for high-quality multimedia applications.

Length: 22.86 mm

A manageable length keeps the design compact while ensuring sufficient channel density.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures reliability in everyday environments, suitable for a wide range of applications.

No. of Channels: 10

With 10 channels, this device can handle multiple signals simultaneously, enhancing its utility in complex setups.

Technology: BICMOS

BICMOS technology combines the benefits of both Bipolar and CMOS, resulting in low power consumption and high speed.

Terminal Form: THROUGH-HOLE

Through-hole terminals offer strong mechanical support and are ideal for prototyping and assembly.

Terminal Pitch: 1.778 mm

A terminal pitch of 1.778 mm provides optimal spacing for ease of soldering and connection.

Technical Specifications

Multiplexers & Switches TEA6430 attributes and parameters. Explore more Multiplexers & Switches devices from STMicroelectronics

Specs

Other IC type:

JESD-30 Code:

R-PDIP-T24

JESD-609 Code:

e0

Length:

22.86 mm

No. of Channels:

10

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output (V):

SEPARATE OUTPUT

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SDIP24,.3

Package Shape:

Package Style (Meter):

IN-LINE, SHRINK PITCH

Power Supplies (V):

8

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Multiplexer or Switches

Nominal Supply Voltage (Vsup):

8 V

Surface Mount:

NO

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

1.778 mm

Terminal Position:

DUAL

Width (mm):

7.62 mm

Trade Compliance

TEA6430 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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