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TEA6422D

STMicroelectronics

TEA6422D by STMicroelectronics

TEA6422D by STMicroelectronics is a versatile audio/video switch with 12 channels, operating at a nominal voltage of 9V. It features a compact rectangular package (7.5mm x 17.9mm) and operates within temperatures from 0 °C to 70°C. Ideal for multimedia applications, it ensures reliable performance with separate outputs.

Median Price

$2.306

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 548 parts In-Stock

1+ parts

$1.861

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548

$1.861

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Chip1Stop

Japan . 548 parts In-Stock

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$2.750

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548

$2.750

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Verical

USA . 548 parts In-Stock

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548

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Distributors (In-Stock)

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Digiode

USA . 2,583 parts In-Stock

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$1.768

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2,583

$1.768

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Vyrian

USA . 5,866 parts In-Stock

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5,866

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Anansix

USA . 2,230 parts In-Stock

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 2,000 parts In-Stock

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Inventory MP

USA . 504 parts In-Stock

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504

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Bristol Electronics

USA . 504 parts In-Stock

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504

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ComSIT Distribution GmbH

Germany . 224 parts In-Stock

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224

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ComSIT USA

USA . 224 parts In-Stock

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224

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R&J Components

USA . 56 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 56 parts In-Stock

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56

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Distributors (Availability)

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Corphita

USA . 182 parts In-Stock

1+ parts

$1.675

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182

$1.675

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Component Stockers USA

USA . 1,469 parts In-Stock

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$2.150

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$2.150

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1,469

$2.150

$2.150

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IDEA Electronic Components Group

UK . 1,728 parts In-Stock

1+ parts

$5.617

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$5.055

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1,728

$5.617

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$5.055

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Microchip USA

USA . 368 parts In-Stock

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$6.453

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368

$6.453

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MKK Technologies

India . 1,371 parts In-Stock

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$10.562

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1,371

$10.562

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DigiPath Technology Company

USA . 1,371 parts In-Stock

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$10.562

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1,371

$10.562

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AZTECH Wire

Italy . 122 parts In-Stock

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$10.660

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122

$10.660

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Kepictronics

USA . 5,200 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,832 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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GreenTree Electronics

Israel . 1,750 parts In-Stock

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1,750

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Parana Technologies

USA . 1,166 parts In-Stock

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$6.716

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$6.716

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Assy Fe

Spain . 3 parts In-Stock

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Overview

Unlock the potential of your audio and video applications with the TEA6422D from STMicroelectronics. Renowned for excellence, STMicroelectronics delivers a top-tier multiplexer that ensures superior signal integrity and reliable performance in any environment. With its compact design and robust features, this versatile switch enhances connectivity while maintaining energy efficiency. Elevate your projects with cutting-edge technology that promises quality and innovation—experience the ST difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection against environmental factors, making the product reliable for long-term use.

Surface Mount: YES

Surface mount capability allows for a compact design and efficient use of space on PCBs, making it suitable for modern electronics.

Package Shape: RECTANGULAR

The rectangular shape aids in efficient layout and organization on the PCB, facilitating easier integration into various designs.

Nominal Supply Voltage (Vsup): 9 V

A nominal supply voltage of 9 V is compatible with a wide range of applications, ensuring flexibility in design and power management.

Power Supplies (V): 9

Supports consistent performance across various applications, simplifying design requirements for engineers.

No. of Terminals: 28

The 28 terminals provide ample connectivity options, allowing for versatile applications in audio and video switching.

Package Style (Meter): SMALL OUTLINE

The small outline package style optimizes space on PCBs, making it ideal for compact devices.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, the product remains reliable even in moderately high-temperature environments.

Minimum Operating Temperature: 0 °C

A minimum operating temperature of 0 °C allows for versatile applications in various climatic conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The high-quality terminal finish enhances solderability and provides resistance to corrosion, ensuring long-lasting performance.

Terminal Position: DUAL

Dual terminal positioning allows for easy integration and connectivity options in circuit designs.

Output (V): SEPARATE OUTPUT

Separate outputs enhance functionality, making the device suitable for complex audio and video applications.

Maximum Seated Height: 2.65 mm

The low seated height ensures compatibility with compact designs, minimizing overall device thickness.

Width: 7.5 mm

A narrow width allows for higher density designs on PCBs, facilitating smaller product footprints.

Other IC type: AUDIO/VIDEO SWITCH

Specifically designed for audio/video switching applications, this IC is tailored to meet the demands of multimedia systems.

Maximum Time At Peak Reflow Temperature: 30 s

A maximum time of 30 seconds at peak reflow temperature ensures compatibility with standard soldering processes.

Peak Reflow Temperature: 250 °C

The capability to withstand a peak reflow temperature of 250 °C allows for broad compatibility with various solder processes.

Length: 17.9 mm

The compact length is ideal for modern electronic devices, allowing for efficient PCB designs.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures that the product is suitable for everyday applications, balancing performance and cost.

No. of Channels: 12

Having 12 channels allows for multiple inputs and outputs, enhancing the versatility of the device for audio and video applications.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and enhance electrical performance, making assembly quick and reliable.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm is a standard size that promotes compatibility with various PCB designs and layouts.

Moisture Sensitivity Level (MSL): 3

An MSL rating of 3 indicates safe handling and storage conditions, ensuring long-term reliability.

Technical Specifications

Multiplexers & Switches TEA6422D attributes and parameters. Explore more Multiplexers & Switches devices from STMicroelectronics

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

17.9 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

12

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output (V):

SEPARATE OUTPUT

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

250

Power Supplies (V):

9

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Multiplexer or Switches

Nominal Supply Voltage (Vsup):

9 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

7.5 mm

Trade Compliance

TEA6422D Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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