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TEA3717DP

STMicroelectronics

TEA3717DP by STMicroelectronics

TEA3717DP by STMicroelectronics is a Motion Control IC with 16 terminals, operating voltage of 5V, and max output current of 1A. Ideal for stepper motor control applications due to its bipolar technology and commercial temperature grade suitability. Package style is in-line with rectangular shape and matte tin terminal finish.

Median Price

$17.150

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

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Forefront Electronics and Design

USA . 8 parts In-Stock

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$17.150

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Vyrian

USA . 8,257 parts In-Stock

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Anansix

USA . 1,442 parts In-Stock

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Digiode

USA . 1,285 parts In-Stock

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Q Components

USA . 436 parts In-Stock

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436

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ECAB

Sweden . 285 parts In-Stock

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Connector Distribution Corp

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Right Parts Inc.

USA . 47 parts In-Stock

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Huijzer Components

Netherlands . 12 parts In-Stock

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GES GmbH

Germany . 10 parts In-Stock

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Classic Components Corporation

USA . 4 parts In-Stock

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Fibra_Brandt Electronic GMBH

Germany . 2 parts In-Stock

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Manotoh

Italy . 1 parts In-Stock

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Distributors (Availability)

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Microchip USA

USA . 211 parts In-Stock

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$1.293

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IDEA Electronic Components Group

UK . 1,335 parts In-Stock

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$8.348

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$7.513

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MKK Technologies

India . 1,230 parts In-Stock

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$15.698

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DigiPath Technology Company

USA . 1,230 parts In-Stock

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$15.698

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AZTECH Wire

Italy . 289 parts In-Stock

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$20.700

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A-Z Elektronik GmbH

Germany . 6,213 parts In-Stock

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Corphita

USA . 2,426 parts In-Stock

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Parana Technologies

USA . 1,994 parts In-Stock

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Kepictronics

USA . 1,489 parts In-Stock

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Assy Fe

Spain . 56 parts In-Stock

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A-Plus Industry Inc.

USA . 2 parts In-Stock

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Overview

Enhance your motion control systems with the TEA3717DP from STMicroelectronics, a leading manufacturer known for top-quality products. This stepper motor controller offers seamless integration and precise control, making it ideal for a wide range of applications. With its advanced technology and reliable performance, customers can trust in the value and benefits that this product brings to their projects. Upgrade your designs today with the TEA3717DP and experience unparalleled efficiency and accuracy like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as package body material makes the product lightweight and durable, ensuring longevity and ease of handling.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient PCB layout and space utilization, making it suitable for compact electronic designs.

Nominal Supply Voltage (Vsup): 5 V

Operating at a nominal supply voltage of 5V makes it compatible with a wide range of industrial and consumer electronics applications.

Power Supplies (V): 5,10/45

Support for multiple power supply options ranging from 5V to 10/45V adds versatility to the product, enabling it to be used in various voltage environments.

No. of Terminals: 16

Having 16 terminals provides necessary connectivity options and flexibility for interfacing with external components in a system.

Package Style (Meter): IN-LINE

The in-line package style allows for easy integration into circuits and assemblies, simplifying the overall design process.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, the product can reliably function in various environmental conditions without overheating.

Minimum Operating Temperature: 0 °C

The ability to operate at a minimum temperature of 0 °C ensures functionality in cold environments, making it suitable for diverse applications.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides excellent solderability and corrosion resistance, enhancing the product's durability and reliability.

Terminal Position: DUAL

Dual terminal positions offer flexibility in connection options and PCB layout, enabling efficient routing of connections in a compact space.

Maximum Seated Height: 5.1 mm

The maximum seated height of 5.1 mm allows for low-profile installation, making the product suitable for space-constrained applications.

Width (mm): 7.62 mm

With a width of 7.62 mm, the product is compact in size, enabling it to be easily integrated into small electronic devices and systems.

Other IC type: STEPPER MOTOR CONTROLLER

Being a stepper motor controller IC type, this product is ideal for precise control of stepper motors in robotics, automation, and CNC applications.

Minimum Supply Voltage (Vsup): 4.75 V

Support for a minimum supply voltage of 4.75V ensures compatibility with lower voltage systems, expanding its range of applications.

Temperature Grade: COMMERCIAL

Designed for commercial temperature grades, the product is suitable for standard operating conditions in commercial electronics.

Maximum Supply Current (Isup): 25 mA

With a maximum supply current of 25mA, the product consumes low power, making it energy-efficient and cost-effective.

Maximum Output Current: 1 A

Capable of delivering a maximum output current of 1A, the product can drive motors and other loads with sufficient power, meeting the requirements of various applications.

Technology: BIPOLAR

Utilizing bipolar technology ensures precise control and accurate performance, making the product reliable for motion control applications.

Terminal Form: THROUGH-HOLE

The through-hole terminal form simplifies assembly and soldering processes, making it convenient for manual or automated production.

Terminal Pitch: 2.54 mm

With a terminal pitch of 2.54 mm, the product offers standard spacing for easy connection and compatibility with common PCB layouts.

Maximum Supply Voltage (Vsup): 5.25 V

Support for a maximum supply voltage of 5.25V ensures safe operation within voltage limits, protecting the product from overvoltage conditions.

Technical Specifications

Motion Control ICs TEA3717DP attributes and parameters. Explore more Motion Control ICs devices from STMicroelectronics

Specs

Other IC type:

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e3

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Maximum Output Current:

1 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5,10/45

Qualification:

Not Qualified

Maximum Seated Height:

5.1 mm

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

25 mA

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width (mm):

7.62 mm

Trade Compliance

TEA3717DP Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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