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TD310IN

STMicroelectronics

TD310IN by STMicroelectronics

TD310IN by STMicroelectronics is a MOSFET gate driver with 3 functions, operating at supply voltages b/w 4V to 16V. It features a turn-on/off time of 0.4us and supports a nominal output peak current limit of 0.6A. Ideal for automotive applications due to its BICMOS technology and high side driver capability.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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Chip Stock

USA . 42,490 parts In-Stock

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Vyrian

USA . 10,541 parts In-Stock

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10,541

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Anansix

USA . 2,310 parts In-Stock

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2,310

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Digiode

USA . 1,174 parts In-Stock

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1,174

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ComSIT Distribution GmbH

Germany . 350 parts In-Stock

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350

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LIBRA Elektronik GmbH

Germany . 265 parts In-Stock

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265

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Distributors (Availability)

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Component Stockers USA

USA . 20 parts In-Stock

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$3.000

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20

$3.000

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Microchip USA

USA . 339 parts In-Stock

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$3.688

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339

$3.688

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IDEA Electronic Components Group

UK . 1,169 parts In-Stock

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$7.661

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$6.895

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$7.661

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$6.895

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Advanced Electronics

New Zealand . 600 parts In-Stock

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$8.793

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$8.002

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$7.210

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600

$8.793

$8.002

$7.210

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AZTECH Wire

Italy . 209 parts In-Stock

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$13.640

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209

$13.640

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MKK Technologies

India . 109 parts In-Stock

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$14.406

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109

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DigiPath Technology Company

USA . 109 parts In-Stock

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$14.406

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Authorized Procurement Solutions

USA . 1,099,000 parts In-Stock

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Kepictronics

USA . 44,900 parts In-Stock

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Corphita

USA . 3,680 parts In-Stock

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A-Z Elektronik GmbH

Germany . 3,300 parts In-Stock

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Perfect Parts

USA . 2,829 parts In-Stock

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2,829

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Parana Technologies

USA . 393 parts In-Stock

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$9.160

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393

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$9.160

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Overview

Experience superior performance and reliability with the TD310IN MOSFET Gate Driver by STMicroelectronics. Designed with cutting-edge BICMOS technology, this automotive-grade driver offers unmatched precision and efficiency for a wide range of applications. With a maximum supply voltage of 16V, three functions, and a nominal output peak current limit of 0.6A, the TD310IN delivers exceptional value and versatility. Trust in STMicroelectronics' reputation for quality and innovation, and elevate your projects to new heights with the TD310IN.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, ideal for automotive applications.

Maximum Supply Voltage: 16 V

With a maximum supply voltage of 16 V, this MOSFET gate driver can handle higher voltage requirements in various electronic circuits.

No. of Functions: 3

Having 3 functions in one package increases efficiency and saves space on the circuit board.

Power Supplies (V): 15

The power supplies of 15 V ensure reliable performance and compatibility with standard power sources.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125 °C, this MOSFET gate driver can operate in high-temperature environments without overheating.

Temperature Grade: AUTOMOTIVE

The automotive grade temperature rating ensures that the MOSFET gate driver can withstand harsh automotive conditions and environments.

Nominal Output Peak Current Limit: 0.6 A

The high nominal output peak current limit of 0.6 A allows the gate driver to drive high-current loads effectively.

Technical Specifications

MOSFET Gate Drivers TD310IN attributes and parameters. Explore more MOSFET Gate Drivers devices from STMicroelectronics

Specs

High Side Driver:

YES

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e4

No. of Functions:

3

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Peak Current Limit:

.6 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

15

Qualification:

Not Qualified

Maximum Seated Height:

5.1 mm

Sub-Category:

MOSFET Drivers

Maximum Supply Voltage:

16 V

Minimum Supply Voltage:

4 V

Nominal Supply Voltage:

15 V

Surface Mount:

NO

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Turn-off Time:

.4 us

Turn-on Time:

.4 us

Width:

7.62 mm

Trade Compliance

TD310IN Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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