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FAN3100CMPX

Onsemi

FAN3100CMPX by Onsemi

FAN3100CMPX by Onsemi is a MOSFET Gate Driver with 18V max supply voltage, 12V power supplies, and -40 to 125°C operating temperature range. It features transient protection and is ideal for automotive applications requiring source/sink output current flow control.

Median Price

$1.140

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 10,942 parts In-Stock

1+ parts

$1.140

100+ parts

$0.621

1k+ parts

$0.482

10k+ parts

$0.426

10,942

$1.140

$0.621

$0.482

$0.426

Chip1Stop

Japan . 2,550 parts In-Stock

1+ parts

$4.280

100+ parts

$1.340

1k+ parts

$0.934

10k+ parts

-

2,550

$4.280

$1.340

$0.934

-

DigiKey

USA . 2,336 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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2,336

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Rochester

USA . 107 parts In-Stock

1+ parts

-

100+ parts

$0.579

1k+ parts

$0.481

10k+ parts

$0.429

107

-

$0.579

$0.481

$0.429

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,135 parts In-Stock

1+ parts

$0.450

100+ parts

-

1k+ parts

-

10k+ parts

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2,135

$0.450

-

-

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Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$0.543

100+ parts

-

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50

$0.543

-

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Chip Stock

USA . 33,000 parts In-Stock

1+ parts

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33,000

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-

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Vyrian

USA . 5,914 parts In-Stock

1+ parts

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5,914

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Semtec, LLC

USA . 3,926 parts In-Stock

1+ parts

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3,926

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Flip Electronics

USA . 3,000 parts In-Stock

1+ parts

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3,000

-

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ComSIT Distribution GmbH

Germany . 667 parts In-Stock

1+ parts

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667

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 5,866 parts In-Stock

1+ parts

$0.403

100+ parts

$0.393

1k+ parts

$0.391

10k+ parts

-

5,866

$0.403

$0.393

$0.391

-

Ampacity Inc.

Singapore . 5,815 parts In-Stock

1+ parts

$0.403

100+ parts

-

1k+ parts

-

10k+ parts

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5,815

$0.403

-

-

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Corphita

USA . 207 parts In-Stock

1+ parts

$0.427

100+ parts

-

1k+ parts

-

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207

$0.427

-

-

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Corohmni

South Africa . 146 parts In-Stock

1+ parts

$0.474

100+ parts

-

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146

$0.474

-

-

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

$0.543

100+ parts

-

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-

10k+ parts

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2,000

$0.543

-

-

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Argo Parts USA

USA . 1,934 parts In-Stock

1+ parts

$0.543

100+ parts

-

1k+ parts

-

10k+ parts

$0.526

1,934

$0.543

-

-

$0.526

Advanced Electronics

New Zealand . 270 parts In-Stock

1+ parts

$0.553

100+ parts

$0.553

1k+ parts

$0.553

10k+ parts

-

270

$0.553

$0.553

$0.553

-

Aztec Data Supply Inc.

USA . 57 parts In-Stock

1+ parts

$7.184

100+ parts

-

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-

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57

$7.184

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Perfect Parts

USA . 24,223 parts In-Stock

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24,223

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Authorized Procurement Solutions

USA . 20,000 parts In-Stock

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20,000

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Lixinc

USA . 14,167 parts In-Stock

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14,167

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Problanco Electronics

Mexico . 8,126 parts In-Stock

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SupplyDigital Components

Austria . 7,280 parts In-Stock

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7,280

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Microchip USA

USA . 6,265 parts In-Stock

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6,265

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iodParts Technologies Inc.

India . 6,000 parts In-Stock

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Kepictronics

USA . 4,945 parts In-Stock

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4,945

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Kulean Microsystems

USA . 4,263 parts In-Stock

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4,263

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TANS Electronics

Latvia . 3,623 parts In-Stock

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3,623

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Assy Fe

Spain . 2,570 parts In-Stock

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2,570

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Supply Digital

USA . 1,783 parts In-Stock

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1,783

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UHIMA Technologies

Türkiye . 459 parts In-Stock

1+ parts

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459

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Overview

Enhance the performance of your electronic designs with the FAN3100CMPX MOSFET Gate Driver by Onsemi. Crafted with precision and reliability, this square-shaped driver offers built-in transient protections, ensuring seamless operation in a variety of applications. From automotive to industrial settings, this small outline, heat sink compatible driver provides a nominal supply voltage of 12V and a maximum supply voltage of 18V, making it a versatile choice for your projects. Elevate your circuits with the quality and efficiency of Onsemi's FAN3100CMPX.

Feature Benefit Bullets

Surface Mount: YES

Easy and convenient installation on PCBs.

Maximum Supply Voltage: 18 V

Compatible with a wide range of applications.

Package Shape: SQUARE

Compact design for space-saving purposes.

Built-in Protections: TRANSIENT

Ensures reliability and longevity of the device.

Power Supplies (V): 12

Ideal for applications requiring a 12V power supply.

No. of Terminals: 6

Sufficient terminals for versatile connectivity options.

Package Style: SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Efficient thermal management and space optimization.

Minimum Supply Voltage: 4.5 V

Allows for operation at lower voltage levels.

Maximum Operating Temperature: 125 °C

Suitable for high-temperature environments.

Minimum Operating Temperature: -40 °C

Can withstand extreme cold conditions.

Terminal Finish: NICKEL PALLADIUM GOLD SILVER

Provides corrosion resistance and excellent conductivity.

Terminal Position: DUAL

Allows for flexible mounting orientations.

Maximum Seated Height: 1 mm

Low-profile design for compact applications.

Width: 2 mm

Slim form factor for space-constrained setups.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper soldering during assembly.

Peak Reflow Temperature °C: 260

Suitable for lead-free soldering processes.

Length: 2 mm

Compact size for integration into small devices.

Temperature Grade: AUTOMOTIVE

Meets automotive industry standards for reliability.

Technology: MOS

Utilizes efficient MOSFET technology for optimized performance.

Terminal Form: NO LEAD

Lead-free construction for environmental friendliness.

Nominal Supply Voltage: 12 V

Matches standard 12V power supply requirements.

Terminal Pitch: 0.65 mm

Allows for precise and secure connections.

Interface IC Type: BUFFER OR INVERTER BASED MOSFET DRIVER

Versatile interface options for various applications.

Output Current Flow Direction: SOURCE AND SINK

Bi-directional current flow for flexibility in circuit design.

Technical Specifications

MOSFET Gate Drivers FAN3100CMPX attributes and parameters. Explore more MOSFET Gate Drivers devices from Onsemi

Specs

Built-in Protections:

TRANSIENT

JESD-30 Code:

S-XDSO-N6

JESD-609 Code:

e4

Length:

2 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Current Flow Direction:

SOURCE AND SINK

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

SOLCC6,.08,25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

12

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

MOSFET Drivers

Maximum Supply Voltage:

18 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

12 V

Surface Mount:

YES

Technology:

MOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD SILVER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

2 mm

Trade Compliance

FAN3100CMPX Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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