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STW12NM60N

STMicroelectronics

STW12NM60N by STMicroelectronics

STW12NM60N by STMicroelectronics is an N-channel MOSFET ideal for switching applications, featuring a 600V breakdown voltage and 10A max drain current. It offers a low on-resistance of 0.41Ω and operates at up to 150 °C. This versatile FET is packaged in a flange mount design for easy integration.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,888 parts In-Stock

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7,888

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Digiode

USA . 1,944 parts In-Stock

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1,944

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Anansix

USA . 1,191 parts In-Stock

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1,191

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,543 parts In-Stock

1+ parts

$1.501

100+ parts

-

1k+ parts

$1.350

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1,543

$1.501

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$1.350

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MKK Technologies

India . 2,097 parts In-Stock

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$2.822

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2,097

$2.822

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DigiPath Technology Company

USA . 2,097 parts In-Stock

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$2.822

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2,097

$2.822

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AZTECH Wire

Italy . 296 parts In-Stock

1+ parts

$20.600

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296

$20.600

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Alle Elektronik GmbH

Germany . 3,723 parts In-Stock

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3,723

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Corphita

USA . 2,872 parts In-Stock

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Parana Technologies

USA . 1,068 parts In-Stock

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$1.794

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1,068

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$1.794

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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1,000

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Overview

Unlock the potential of your projects with the STW12NM60N from STMicroelectronics—a leading name in power solutions. This robust N-channel power FET is designed for seamless switching applications, ensuring high efficiency and reliability. With its built-in diode and impressive voltage ratings, it empowers engineers to innovate without compromise. Experience superior performance and durability that enhances your designs and delivers unmatched value. Choose STMicroelectronics for quality you can trust!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to environmental factors, making the product reliable in various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally offer better performance characteristics such as lower on-resistance and higher speed, making them suitable for many high-efficiency applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode aids in protecting the circuit during switching operations, enhancing overall reliability and ease of use.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET excels in efficiently controlling power and signals.

Minimum DS Breakdown Voltage: 600 V

A high breakdown voltage means this FET can withstand significant voltage spikes, making it suitable for demanding applications.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy layout and integration into a variety of circuit designs.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide robust mechanical stability and are ideal for high-power applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for lower power consumption in standby modes, improving overall energy efficiency.

Maximum Pulsed Drain Current (IDM): 40 A

Capability to handle high pulsed currents makes this FET suitable for applications requiring quick, high-energy pulses.

Avalanche Energy Rating (EAS): 200 mJ

A high avalanche energy rating ensures reliability even in transient conditions, preventing damage from unexpected spikes.

Maximum Drain Current (Abs) (ID): 10 A

Handling up to 10A allows this FET to be integrated into high current applications without risk of failure.

No. of Terminals: 3

Three terminals offer a straightforward connection method, simplifying integration into electronic circuits.

Maximum Power Dissipation (Abs): 90 W

A high power dissipation capability means this FET can effectively manage thermal energy, enhancing its performance in demanding applications.

Package Style (Meter): FLANGE MOUNT

Flange mount style facilitates easier installation and stable mounting, ideal for robust and permanent setups.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology delivers high efficiency and low power loss, making it suitable for modern electronic applications.

Maximum Operating Temperature: 150 °C

A high operating temperature tolerance means this FET can function effectively in extreme conditions, enhancing reliability.

Transistor Element Material: SILICON

Silicon is widely used in semiconductor technology due to its excellent electrical properties, making this FET highly efficient.

Terminal Finish: MATTE TIN/TIN SILVER COPPER

A matte finish on the terminals offers improved solderability and reduces oxidation, ensuring good electrical connections.

Maximum Drain Current (ID): 10 A

Handling up to 10A allows this FET to be used in a variety of high-current applications without the risk of thermal failure.

Maximum Drain-Source On Resistance: 0.41 ohm

Low on-resistance minimizes power loss and heat generation during operation, leading to enhanced efficiency.

Terminal Position: SINGLE

Single terminal positioning simplifies circuit design and reduces complexity in layout.

Case Connection: DRAIN

Direct case connection to drain ensures efficient heat dissipation and a simplified design approach.

Technical Specifications

Power Field Effect Transistors (FET) STW12NM60N attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

200 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (Abs) (ID):

10 A

Maximum Drain Current (ID):

10 A

Maximum Drain-Source On Resistance:

.41 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3/e1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

40 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN/TIN SILVER COPPER

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STW12NM60N Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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