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STW12NK95Z

STMicroelectronics

STW12NK95Z by STMicroelectronics

STW12NK95Z by STMicroelectronics is a powerful N-channel FET designed for switching applications. It features a 950V breakdown voltage, 40A max pulsed drain current, and operates at up to 150 °C. Ideal for high-efficiency power management in various electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,555 parts In-Stock

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5,555

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Digiode

USA . 4,406 parts In-Stock

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4,406

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Anansix

USA . 1,342 parts In-Stock

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1,342

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Pegasus Components GmbH

Germany . 440 parts In-Stock

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440

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Bristol Electronics

USA . 99 parts In-Stock

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99

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,619 parts In-Stock

1+ parts

$1.032

100+ parts

-

1k+ parts

$0.929

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1,619

$1.032

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$0.929

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MKK Technologies

India . 250 parts In-Stock

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$1.941

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250

$1.941

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DigiPath Technology Company

USA . 250 parts In-Stock

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$1.941

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250

$1.941

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AZTECH Wire

Italy . 1,024 parts In-Stock

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$10.200

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$10.200

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Component Stockers USA

USA . 636 parts In-Stock

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$99.990

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636

$99.990

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Perfect Parts

USA . 12,049 parts In-Stock

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12,049

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Kepictronics

USA . 10,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,469 parts In-Stock

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Corphita

USA . 4,376 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,087 parts In-Stock

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Parana Technologies

USA . 897 parts In-Stock

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$1.234

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$1.234

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S.R.D Solutions

India . 500 parts In-Stock

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Overview

Unlock exceptional performance with the STW12NK95Z from STMicroelectronics, a leader in innovative semiconductor solutions. This N-channel power FET excels in switching applications, offering reliability and efficiency for demanding projects. With its robust breakdown voltage and built-in diode, it ensures optimal operation under extreme conditions. Trust in STMicroelectronics’ quality to elevate your designs, benefiting from enhanced durability and superior power management that translates to long-term savings and peace of mind.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable material ensures protection against environmental factors, making the FET reliable in various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are known for their higher electron mobility, resulting in faster switching and efficiency.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode enhances protection and provides extra functionality for circuit designs.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers optimal performance in power control and conversion.

Minimum DS Breakdown Voltage: 950 V

High breakdown voltage makes the FET suitable for high-voltage applications, ensuring reliability.

Package Shape: RECTANGULAR

Rectangular package shape allows for efficient space utilization in circuit designs.

Terminal Form: THROUGH-HOLE

Through-hole design provides strong mechanical support and ease of soldering in PCB applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for low-power standby with quick activation, enhancing efficiency.

Maximum Pulsed Drain Current (IDM): 40 A

High pulsed drain current capability makes this FET suitable for demanding applications that require brief high current bursts.

Avalanche Energy Rating (EAS): 500 mJ

High avalanche energy rating adds robustness, allowing the FET to handle transient spikes without damage.

Maximum Drain Current (Abs) (ID): 10 A

Adequate maximum continuous drain current makes it well-suited for typical power applications.

No. of Terminals: 3

Three terminals simplify connectivity and integration into various circuit configurations.

Maximum Power Dissipation (Abs): 230 W

High power dissipation capability ensures that the FET can manage heat effectively, critical for reliability in heavy loads.

Package Style (Meter): FLANGE MOUNT

Flange mount style allows for secure installation and better thermal management in applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology enhances performance, providing high efficiency and low power consumption.

Maximum Operating Temperature: 150 °C

High operating temperature rating means the FET can function reliably in demanding thermal environments.

Transistor Element Material: SILICON

Silicon is a well-established material for FETs, ensuring durability and consistent performance.

Terminal Finish: TIN

Tin finishing improves solderability and corrosion resistance, enhancing long-term reliability.

Maximum Drain Current (ID): 10 A

Consistent with previous specs, ensures reliable performance in power applications.

Maximum Drain-Source On Resistance: 0.9 ohm

Low on-resistance minimizes power losses during operation, improving the overall efficiency of the circuit.

Terminal Position: SINGLE

Single terminal position simplifies layout and design, making integration easier.

Technical Specifications

Power Field Effect Transistors (FET) STW12NK95Z attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

500 mJ

Minimum DS Breakdown Voltage:

950 V

Maximum Drain Current (Abs) (ID):

10 A

Maximum Drain Current (ID):

10 A

Maximum Drain-Source On Resistance:

.9 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-247AC

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

40 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STW12NK95Z Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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