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STUW81300-1T

STMicroelectronics

STUW81300-1T by STMicroelectronics

STUW81300-1T by STMicroelectronics is a BICMOS PLL with a 3.3V nominal supply, ideal for industrial applications. It features a compact 6mm x 6mm chip carrier package and operates b/w -40 °C to 85 °C. With 36 terminals and no lead design, it ensures efficient performance in tight spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,086 parts In-Stock

1+ parts

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3,086

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Anansix

USA . 1,936 parts In-Stock

1+ parts

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1,936

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Digiode

USA . 560 parts In-Stock

1+ parts

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560

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,103 parts In-Stock

1+ parts

$4.859

100+ parts

-

1k+ parts

$4.373

10k+ parts

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1,103

$4.859

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$4.373

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MKK Technologies

India . 1,755 parts In-Stock

1+ parts

$9.138

100+ parts

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1,755

$9.138

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DigiPath Technology Company

USA . 1,755 parts In-Stock

1+ parts

$9.138

100+ parts

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1,755

$9.138

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Parana Technologies

USA . 1,989 parts In-Stock

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$5.810

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1,989

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$5.810

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Corphita

USA . 1,694 parts In-Stock

1+ parts

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1,694

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Overview

Elevate your designs with the STUW81300-1T from STMicroelectronics, a robust Phase Locked Loop ideal for various industrial applications. Renowned for its commitment to quality and innovation, STMicroelectronics delivers unparalleled reliability and performance. This compact, surface-mounted solution excels in environments ranging from -40 °C to 85 °C, ensuring seamless operation under tough conditions. Experience enhanced precision and stability, empowering your projects with cutting-edge technology that drives success.

Feature Benefit Bullets

Surface Mount: YES

The surface mount design allows for compact PCB layout, making it suitable for space-constrained applications.

Package Shape: SQUARE

A square package provides uniform dimensioning, which simplifies PCB design and assembly processes.

Nominal Supply Voltage (Vsup): 3.3 V

Operating at a nominal supply voltage of 3.3 V enhances compatibility with standard digital logic levels.

No. of Terminals: 36

With 36 terminals, it offers versatile connectivity options, enabling complex circuit integration.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The very thin profile and heat sink design improve thermal management and enhance device reliability.

Maximum Operating Temperature: 85 °C

Designed to operate up to 85 °C, it is suitable for industrial applications requiring higher temperature tolerances.

Minimum Operating Temperature: -40 °C

The ability to function at -40 °C makes it ideal for harsh environmental conditions.

Terminal Position: QUAD

Quad terminal positioning aids in the efficient routing of signals on the PCB, reducing interference.

Maximum Seated Height: 1 mm

With a maximum height of 1 mm, it enables a low-profile design for applications with stringent height restrictions.

Width: 6 mm

The compact 6 mm width is advantageous for dense circuit layouts and miniaturized devices.

Other IC type: PHASE LOCKED LOOP

As a phase locked loop IC, it ensures stable frequency synthesis and is critical for communications and signal processing.

Minimum Supply Voltage (Vsup): 3 V

A minimum supply voltage of 3 V provides flexibility in power supply design without compromising performance.

Length: 6 mm

The uniform dimensions of 6 mm x 6 mm facilitate easy integration into various board designs.

Temperature Grade: INDUSTRIAL

An industrial temperature grade signifies robustness, ensuring reliability in demanding environments and extended lifecycle.

Technology: BICMOS

BICMOS technology combines the strengths of both bipolar and CMOS, optimizing performance and power consumption.

Terminal Form: NO LEAD

No-lead terminal form allows for better thermal and electrical performance while simplifying soldering processes.

Terminal Pitch: 0.5 mm

With a 0.5 mm terminal pitch, it supports high-density mounting, making it suitable for advanced electronic designs.

Maximum Supply Voltage (Vsup): 5.4 V

Operating at a maximum supply voltage of 5.4 V expands its compatibility with a range of power supply configurations.

Technical Specifications

Phase Locked Loops (PLL) & Frequency Synthesis Circuits STUW81300-1T attributes and parameters. Explore more Phase Locked Loops (PLL) & Frequency Synthesis Circuits devices from STMicroelectronics

Specs

Other IC type:

JESD-30 Code:

S-XQCC-N36

Length:

6 mm

No. of Functions:

1

No. of Terminals:

36

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC36,.24SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

5.4 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width (mm):

6 mm

Trade Compliance

STUW81300-1T Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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