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STT5NF30L

STMicroelectronics

STT5NF30L by STMicroelectronics

STT5NF30L by STMicroelectronics is an N-channel FET designed for efficient switching applications. It features a max drain current of 4 A, a breakdown voltage of 30 V, and operates at up to 150 °C. Its compact surface mount design ensures versatility in various electronic circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 1,498 parts In-Stock

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1,498

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Vyrian

USA . 1,114 parts In-Stock

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1,114

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Digiode

USA . 934 parts In-Stock

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934

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 181 parts In-Stock

1+ parts

$1.168

100+ parts

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1k+ parts

$1.052

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181

$1.168

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$1.052

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MKK Technologies

India . 1,525 parts In-Stock

1+ parts

$2.197

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1,525

$2.197

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DigiPath Technology Company

USA . 1,525 parts In-Stock

1+ parts

$2.197

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1,525

$2.197

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Kepictronics

USA . 3,500 parts In-Stock

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3,500

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Parana Technologies

USA . 2,028 parts In-Stock

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100+ parts

$1.397

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2,028

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$1.397

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Corphita

USA . 378 parts In-Stock

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378

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Overview

Experience unmatched performance with the STT5NF30L from STMicroelectronics, a trusted leader in semiconductor innovation. This N-channel FET delivers exceptional switching capabilities and is designed for versatility across various applications, including power management and signal processing. With its compact design and built-in diode, it ensures efficient operation while enhancing system reliability. Elevate your projects with a product that embodies quality, durability, and advanced technology!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection against environmental factors, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically offer lower on-resistance and higher performance than their P-channel counterparts, making them efficient for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode facilitates faster switching and protects against reverse polarity, enhancing reliability in circuit designs.

Transistor Application: SWITCHING

Designed specifically for switching applications, it ensures efficient control over the flow of current, making it ideal for power management.

Surface Mount: YES

Surface mount technology allows for efficient use of space on PCBs and enables automated assembly, reducing manufacturing costs.

Minimum DS Breakdown Voltage: 30 V

A minimum breakdown voltage of 30 V provides robust performance and increases the reliability of the device in various voltage conditions.

Package Shape: RECTANGULAR

The rectangular shape is optimized for space-saving configurations on printed circuit boards (PCBs), facilitating easier integration.

Terminal Form: GULL WING

Gull wing terminals provide excellent soldering surface area, allowing for strong mechanical connections and improved reliability.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for efficient switching, providing better performance in applications requiring fast response times.

Maximum Drain Current (Abs) (ID): 4 A

A maximum drain current of 4 A makes this FET suitable for high-performance applications while ensuring it can handle substantial loads.

No. of Terminals: 6

With 6 terminals, the transistor allows for versatile circuit configurations while maintaining a compact design.

Maximum Power Dissipation (Abs): 1.6 W

A power dissipation rating of 1.6 W indicates good thermal handling capabilities, reducing the risk of overheating during operation.

Package Style (Meter): SMALL OUTLINE

The small outline package style reduces space requirements on the PCB, enabling more compact designs and enhancing circuit density.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology provides high input impedance and low power consumption, making this FET efficient for a variety of applications.

Maximum Operating Temperature: 150 °C

An operating temperature of up to 150 °C ensures reliability and performance in high-temperature environments.

Transistor Element Material: SILICON

Silicon is a widely used material in FETs due to its excellent electrical properties and thermal stability, ensuring reliable operation.

Maximum Drain-Source On Resistance: 0.06 ohm

A low on-resistance of 0.06 ohm minimizes power loss and heat generation, enhancing the efficiency of switching applications.

Terminal Position: DUAL

Dual terminal position enhances layout flexibility and facilitates easier routing on PCB designs.

Technical Specifications

Small Signal Field Effect Transistors (FET) STT5NF30L attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

4 A

Maximum Drain Current (ID):

4 A

Maximum Drain-Source On Resistance:

.06 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G6

No. of Elements:

1

No. of Terminals:

6

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STT5NF30L Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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