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STSJ18NF3LL

STMicroelectronics

STSJ18NF3LL by STMicroelectronics

STSJ18NF3LL by STMicroelectronics is an N-channel MOSFET ideal for switching applications. It features a max drain current of 18 A, a breakdown voltage of 30 V, and operates at up to 150 °C. Its compact SO8 package ensures efficient surface mount integration.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,473 parts In-Stock

1+ parts

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4,473

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Vyrian

USA . 4,231 parts In-Stock

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4,231

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Anansix

USA . 439 parts In-Stock

1+ parts

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439

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 860 parts In-Stock

1+ parts

$1.232

100+ parts

-

1k+ parts

$1.109

10k+ parts

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860

$1.232

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$1.109

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MKK Technologies

India . 1,787 parts In-Stock

1+ parts

$2.316

100+ parts

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1,787

$2.316

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DigiPath Technology Company

USA . 1,787 parts In-Stock

1+ parts

$2.316

100+ parts

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1,787

$2.316

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Corphita

USA . 3,569 parts In-Stock

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3,569

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Parana Technologies

USA . 2 parts In-Stock

1+ parts

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100+ parts

$1.473

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2

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$1.473

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Overview

Unlock exceptional performance with the STSJ18NF3LL from STMicroelectronics, a leader in semiconductor innovation. This powerful N-channel FET offers unparalleled efficiency and reliability for your switching applications, ensuring superior energy management and thermal performance. With its compact design and robust build, it seamlessly integrates into various systems, making it ideal for automotive, industrial, and consumer electronics. Elevate your projects with STMicroelectronics' commitment to quality and innovation!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable plastic/epoxy material ensures long-lasting performance and resistance to environmental factors, making this product suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel configuration is efficient for high-speed switching applications, contributing to faster performance in power management circuits.

Configuration: SINGLE WITH BUILT-IN DIODE

Incorporating a built-in diode enhances the product's functionality, allowing for better reverse voltage handling and simplifying design requirements.

Transistor Application: SWITCHING

Designed specifically for switching applications, making it ideal for power converters, motor drivers, and other electronic control circuits.

Surface Mount: YES

Surface mount technology allows for compact designs, facilitating easier PCB layouts and improved space efficiency in electronic devices.

Minimum DS Breakdown Voltage: 30 V

With a breakdown voltage of 30 V, this FET provides reliable operation under standard voltage levels, enhancing the safety of the overall system.

Package Shape: RECTANGULAR

The rectangular shape optimizes space on the PCB and provides better thermal performance, ensuring effective heat dissipation during operation.

Terminal Form: GULL WING

Gull wing terminals facilitate easier soldering and provide enhanced mechanical stability, crucial for maintaining reliable connections in electronic assemblies.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for lower drive power requirements, making it efficient for applications that require energy conservation.

Maximum Pulsed Drain Current (IDM): 72 A

High pulsed drain current capability allows the FET to handle peak loads effectively, making it suitable for high-performance applications.

Maximum Drain Current (Abs) (ID): 18 A

An absolute maximum drain current of 18 A ensures robust performance in typical operational conditions while maintaining reliable functionality.

No. of Terminals: 8

Having 8 terminals provides flexibility in circuit design, allowing for multiple connections and configurations to suit various application needs.

Maximum Power Dissipation (Abs): 70 W

High power dissipation capability indicates the device can operate under significant loads without overheating, ensuring long-term reliability.

Package Style (Meter): SMALL OUTLINE

The small outline packaging allows for a compact footprint, ideal for modern electronics requiring miniaturization without sacrificing performance.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology provides high input impedance and low power consumption, enhancing efficiency in various electronic applications.

Maximum Operating Temperature: 150 °C

A maximum operating temperature of 150 °C ensures the FET can withstand demanding conditions, making it suitable for high-temperature environments.

Transistor Element Material: SILICON

Silicon as the semiconductor material provides excellent electrical characteristics, ensuring optimal performance for a wide range of applications.

Terminal Finish: TIN LEAD

The tin-lead finish enhances solderability, ensuring reliable connections and easy assembly in manufacturing processes.

Maximum Drain Current (ID): 18 A

Repeat of the maximum drain current allows for confirmation of design specifications, ensuring the component meets application needs effectively.

Maximum Drain-Source On Resistance: 0.022 ohm

Low on-resistance minimizes power losses and improves efficiency in power supply circuits, contributing to better overall system performance.

Terminal Position: DUAL

Dual terminal positioning provides flexibility in layout and connection options, facilitating easier routing in PCB design.

Technical Specifications

Power Field Effect Transistors (FET) STSJ18NF3LL attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

18 A

Maximum Drain Current (ID):

18 A

Maximum Drain-Source On Resistance:

.022 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

72 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STSJ18NF3LL Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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