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STSJ3NM50

STMicroelectronics

STSJ3NM50 by STMicroelectronics

STSJ3NM50 by STMicroelectronics is an N-channel MOSFET designed for efficient switching applications. It features a 500V breakdown voltage, 12A pulsed drain current, and operates at up to 150 °C. This compact surface-mount device ensures reliable performance in power management systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 3,439 parts In-Stock

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3,439

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Anansix

USA . 2,691 parts In-Stock

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2,691

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Vyrian

USA . 1,585 parts In-Stock

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1,585

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Bristol Electronics

USA . 100 parts In-Stock

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100

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Atlantic Semiconductor

USA . 100 parts In-Stock

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100

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 2,069 parts In-Stock

1+ parts

$0.712

100+ parts

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$0.641

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2,069

$0.712

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$0.641

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MKK Technologies

India . 914 parts In-Stock

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$1.339

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914

$1.339

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DigiPath Technology Company

USA . 914 parts In-Stock

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$1.339

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914

$1.339

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Corphita

USA . 2,750 parts In-Stock

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2,750

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Parana Technologies

USA . 619 parts In-Stock

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$0.851

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619

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$0.851

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Overview

Unlock the power of efficiency with the STSJ3NM50 from STMicroelectronics, a trusted leader in semiconductor technology. Designed for reliable switching applications, this N-channel FET combines high performance with robust quality, ensuring seamless operation in your devices. Ideal for a range of uses—from industrial equipment to consumer electronics—this component boasts exceptional durability and energy savings, empowering you to optimize your designs while enhancing overall product reliability. Choose STMicroelectronics for innovation that drives success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides good durability and protects the transistor from environmental factors, ensuring reliability in various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are generally more efficient and offer lower on-resistance compared to P-channel FETs, making them suitable for high-speed switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and enhances protection against reverse polarity, thus improving the overall reliability.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET can handle high-speed operations efficiently, making it a great choice for various digital circuits.

Surface Mount: YES

Being surface mount compatible allows for compact designs and easier deployment in automated assembly processes, contributing to better space utilization.

Minimum DS Breakdown Voltage: 500 V

A high breakdown voltage ensures that the transistor can withstand high voltage applications without failure, making it suitable for robust electronic systems.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient space management on PCBs, helping to simplify layout and assembly processes.

Terminal Form: GULL WING

Gull wing terminals provide easy soldering and better mechanical stability, which enhances durability in the final application.

Operating Mode: ENHANCEMENT MODE

Enhancement mode amplifies performance characteristics, allowing for higher efficiency and improved control in switching applications.

Maximum Pulsed Drain Current (IDM): 12 A

The capability to handle high pulsed currents allows the FET to perform well in demanding applications, providing versatility in design.

Maximum Drain Current (Abs) (ID): 0.63 A

Even with the maximum absolute current value, this FET ensures reliable operation within safe limits, making it suitable for various moderate load applications.

No. of Terminals: 8

The eight terminals allow for multiple connection options, enabling diverse usage in various circuit configurations.

Maximum Power Dissipation (Abs): 70 W

A high power dissipation rating means that the FET can operate efficiently in high-power applications without overheating, contributing to longer lifetimes.

Package Style (Meter): SMALL OUTLINE

The small outline package style enhances space efficiency and is ideal for compact electronic designs, allowing for more functionality in less physical space.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology provides excellent high-speed performance and low power consumption, making it appropriate for modern electronic devices.

Maximum Operating Temperature: 150 °C

A high maximum operating temperature ensures reliable performance in high-temperature environments, increasing the range of applicable scenarios.

Transistor Element Material: SILICON

Silicon transistors are widely used due to their balanced performance and high reliability, making them a standard choice in the industry.

Maximum Drain Current (ID): 0.63 A

Again listed for clarity, this ensures that users can refer to it confidently when designing circuits that require specific current handling.

Maximum Drain-Source On Resistance: 3 ohm

A low on-resistance improves efficiency in switching applications by minimizing power losses during operation.

Terminal Position: DUAL

Dual terminal positioning enhances flexibility during circuit design, allowing for more streamlined layouts and connectivity.

Case Connection: DRAIN

Having a drain connection in the case aids in effective heat dissipation, improving performance and reliability under load.

Technical Specifications

Power Field Effect Transistors (FET) STSJ3NM50 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

500 V

Maximum Drain Current (Abs) (ID):

.63 A

Maximum Drain Current (ID):

.63 A

Maximum Drain-Source On Resistance:

3 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G8

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

12 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STSJ3NM50 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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