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STSJ80N4LL

STMicroelectronics

STSJ80N4LL by STMicroelectronics

STSJ80N4LL by STMicroelectronics is an N-channel FET ideal for switching applications. It features a max drain current of 80 A, a breakdown voltage of 40 V, and operates at up to 150 °C. Its compact SO8 package ensures efficient surface mount integration.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,487 parts In-Stock

1+ parts

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3,487

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Vyrian

USA . 3,254 parts In-Stock

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3,254

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Anansix

USA . 175 parts In-Stock

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175

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 366 parts In-Stock

1+ parts

$0.562

100+ parts

-

1k+ parts

$0.506

10k+ parts

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366

$0.562

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$0.506

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MKK Technologies

India . 2,106 parts In-Stock

1+ parts

$1.057

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2,106

$1.057

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DigiPath Technology Company

USA . 2,106 parts In-Stock

1+ parts

$1.057

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2,106

$1.057

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Corphita

USA . 1,857 parts In-Stock

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1,857

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Parana Technologies

USA . 535 parts In-Stock

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$0.672

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535

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$0.672

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Overview

Elevate your designs with the STSJ80N4LL from STMicroelectronics, a powerhouse N-channel FET that delivers exceptional performance and reliability. Crafted by a leader in semiconductor technology, this transistor excels in switching applications, ensuring efficient power management for your projects. With its compact design and robust capabilities, it empowers engineers to create innovative solutions while maximizing efficiency and minimizing energy loss—perfect for modern electronics. Experience quality and value with STMicroelectronics!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package provides durability and protection against environmental factors, ensuring reliable performance.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are known for their efficiency and higher electron mobility, making them suitable for high-speed applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode offers intrinsic protection against reverse voltage, enhancing robustness in circuit designs.

Transistor Application: SWITCHING

Optimized for switching applications, this FET ensures fast response times, making it ideal for power management.

Surface Mount: YES

Surface mount technology allows for compact designs and automated assembly, reducing overall production costs.

Minimum DS Breakdown Voltage: 40 V

A minimum breakdown voltage of 40 V ensures this FET can handle demanding voltage levels, contributing to system reliability.

Package Shape: RECTANGULAR

Rectangular packaging facilitates efficient layouts on PCBs, maximizing space and enhancing thermal performance.

Terminal Form: GULL WING

Gull-wing terminals provide excellent soldering reliability and are compatible with automated assembly processes.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for better control and efficiency in power applications, contributing to energy savings.

Maximum Pulsed Drain Current (IDM): 72 A

The high pulsed drain current rating implies robust performance in power-intensive applications, ensuring reliable operation.

Maximum Drain Current (Abs) (ID): 80 A

The ability to handle an absolute maximum drain current of 80 A makes this FET suitable for high-current applications.

No. of Terminals: 8

The 8-terminal arrangement allows for versatile connections in circuit designs and simplifies integration into existing systems.

Maximum Power Dissipation (Abs): 70 W

A high power dissipation capability of 70 W indicates the FET's ability to manage heat effectively, aiding in long-term reliability.

Package Style (Meter): SMALL OUTLINE

The small outline package ensures a compact footprint, making it suitable for space-constrained applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology enhances performance with higher switching speeds and reduced power loss, ideal for modern electronic applications.

Maximum Operating Temperature: 150 °C

Operating at high temperatures of up to 150 °C ensures this FET performs well in harsh environments, increasing design flexibility.

Transistor Element Material: SILICON

Silicon as the element material contributes to stable electrical characteristics and is suitable for a wide range of applications.

Terminal Finish: MATTE TIN

Matte tin finish provides excellent solderability and prevents tin whisker growth, enhancing product longevity and reliability.

Maximum Drain Current (ID): 18 A

The 18 A drain current rating ensures this FET can effectively manage load requirements in typical applications.

Maximum Drain-Source On Resistance: 0.007 ohm

Low on-resistance improves efficiency by minimizing power loss during operation, resulting in better thermal performance.

Terminal Position: DUAL

Dual terminal positioning offers flexibility in circuit design and ease of routing in PCB layouts, enhancing overall design efficiency.

Technical Specifications

Power Field Effect Transistors (FET) STSJ80N4LL attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

LOW THRESHOLD

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

80 A

Maximum Drain Current (ID):

18 A

Maximum Drain-Source On Resistance:

.007 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

72 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STSJ80N4LL Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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