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STS9NF30L

STMicroelectronics

STS9NF30L by STMicroelectronics

STS9NF30L by STMicroelectronics is a N-CHANNEL FET with 30V DS Breakdown Voltage, 36A IDM, and 0.035 ohm RDS. Ideal for SWITCHING applications, it operates in ENHANCEMENT MODE at up to 150 °C. This 8-terminal transistor features GULL WING terminals and a SMALL OUTLINE package style.

Median Price

$0.981

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Electronics Inc.

Canada . 68 parts In-Stock

1+ parts

$1.540

100+ parts

$1.150

1k+ parts

$1.000

10k+ parts

-

68

$1.540

$1.150

$1.000

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 12,080 parts In-Stock

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12,080

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R&J Components

USA . 12,000 parts In-Stock

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12,000

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Bristol Electronics

USA . 8,150 parts In-Stock

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-

100+ parts

$0.422

1k+ parts

$0.315

10k+ parts

$0.292

8,150

-

$0.422

$0.315

$0.292

Microfarads

USA . 7,857 parts In-Stock

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7,857

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Vyrian

USA . 5,883 parts In-Stock

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5,883

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Anansix

USA . 2,486 parts In-Stock

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2,486

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ACDS - Activité Composants Distribution Service

France . 856 parts In-Stock

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856

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Digiode

USA . 355 parts In-Stock

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355

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 691 parts In-Stock

1+ parts

$1.756

100+ parts

-

1k+ parts

$1.581

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691

$1.756

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$1.581

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MKK Technologies

India . 190 parts In-Stock

1+ parts

$3.303

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190

$3.303

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DigiPath Technology Company

USA . 190 parts In-Stock

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$3.303

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190

$3.303

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AZTECH Wire

Italy . 633 parts In-Stock

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$11.510

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633

$11.510

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Kepictronics

USA . 87,500 parts In-Stock

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87,500

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Perfect Parts

USA . 38,082 parts In-Stock

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38,082

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GreenTree Electronics

Israel . 27,500 parts In-Stock

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27,500

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QUARKTWIN TECHNOLOGY LTD

USA . 12,394 parts In-Stock

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12,394

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Authorized Procurement Solutions

USA . 12,000 parts In-Stock

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12,000

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Cyclops Electronics Ltd (Excess)

UK . 3,156 parts In-Stock

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3,156

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Corphita

USA . 1,607 parts In-Stock

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1,607

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Parana Technologies

USA . 1,576 parts In-Stock

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$2.100

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1,576

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$2.100

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Alle Elektronik GmbH

Germany . 1,400 parts In-Stock

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1,400

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Overview

Discover the STS9NF30L by STMicroelectronics, a top-quality N-channel Power FET perfect for switching applications. With a maximum DS breakdown voltage of 30V and a maximum pulsed drain current of 36A, this transistor offers exceptional performance and reliability. Its small outline package body and gull wing terminals make it easy to integrate into your designs. Trust in STMicroelectronics' reputation for excellence in semiconductor technology and unlock the power of the STS9NF30L for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides good insulation and heat dissipation, making the product durable and reliable.

Polarity or Channel Type: N-CHANNEL

N-channel FETs offer better performance and are widely used in switching applications, making this product suitable for efficient power management.

Transistor Application: SWITCHING

Designed for switching applications, this FET provides fast switching speeds and low power dissipation, making it ideal for efficient power control.

Surface Mount: YES

Being surface mountable allows for easy and cost-effective assembly onto circuit boards, making this product convenient for mass production.

Maximum Drain Current (ID): 9 A

With a high maximum drain current capacity, this FET can handle heavy loads without overheating, ensuring reliable performance in various applications.

Maximum Power Dissipation (Abs): 2.5 W

The low power dissipation of 2.5 W helps in reducing energy loss and heat generation, contributing to the overall efficiency of the system.

Maximum Drain-Source On Resistance: 0.035 ohm

The low drain-source on resistance of 0.035 ohm minimizes power loss and improves efficiency, making this FET suitable for high-performance applications.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature of 150 °C, this FET can withstand elevated temperatures, ensuring reliable operation in demanding environments.

Technical Specifications

Power Field Effect Transistors (FET) STS9NF30L attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

9 A

Maximum Drain Current (ID):

9 A

Maximum Drain-Source On Resistance:

.035 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

36 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STS9NF30L Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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