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STS3DPFS45

STMicroelectronics

STS3DPFS45 by STMicroelectronics

STS3DPFS45 by STMicroelectronics is a P-channel FET designed for switching applications. It features a max drain current of 3 A, a breakdown voltage of 45 V, and operates at up to 150 °C. Its compact surface mount design ensures efficient performance in various electronic circuits.

Median Price

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Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

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A&K Electronics

USA . 6,404 parts In-Stock

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6,404

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Bristol Electronics

USA . 6,404 parts In-Stock

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6,404

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Digiode

USA . 3,663 parts In-Stock

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3,663

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Rotakorn

Sweden . 2,500 parts In-Stock

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2,500

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LIBRA Elektronik GmbH

Germany . 1,629 parts In-Stock

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1,629

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Anansix

USA . 1,050 parts In-Stock

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Vyrian

USA . 153 parts In-Stock

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,200 parts In-Stock

1+ parts

$0.403

100+ parts

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$0.363

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1,200

$0.403

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$0.363

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MKK Technologies

India . 893 parts In-Stock

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$0.758

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893

$0.758

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DigiPath Technology Company

USA . 893 parts In-Stock

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$0.758

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893

$0.758

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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Parana Technologies

USA . 1,506 parts In-Stock

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$0.482

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1,506

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$0.482

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Corphita

USA . 136 parts In-Stock

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Overview

Elevate your designs with the STS3DPFS45 from STMicroelectronics, a trusted leader in semiconductor solutions. This high-quality P-channel FET is engineered for superior switching performance, making it perfect for a variety of applications. With its compact surface mount design and robust features, customers can achieve enhanced efficiency and reliability in their projects. Choose STMicroelectronics for unmatched innovation and value that drives your success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material ensures durability and reliability, making it suitable for a variety of applications.

Polarity or Channel Type: P-CHANNEL

P-channel transistors are ideal for high-side switching applications, enhancing design versatility.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode provides protection against voltage spikes, increasing the longevity and resilience of the circuit.

Transistor Application: SWITCHING

As a switching transistor, this product is designed for efficient on/off control, ideal for power management applications.

Surface Mount: YES

Surface mount technology allows for compact circuit designs and easier automated assembly, saving space and reducing manufacturing costs.

Minimum DS Breakdown Voltage: 45 V

A minimum breakdown voltage of 45 V offers robustness under high-voltage conditions, making it suitable for demanding applications.

Package Shape: RECTANGULAR

The rectangular package shape is standardized for compatibility with various PCB layouts, simplifying integration into existing designs.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and provide strong mechanical connections, enhancing reliability in PCB assemblies.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for greater control over the device, providing higher efficiency and better performance in applications.

Maximum Drain Current (Abs) (ID): 3 A

A maximum drain current of 3 A enables this transistor to handle significant loads, making it suitable for high-power applications.

No. of Terminals: 8

An 8-terminal design allows for versatile connections and simplifies integration into complex circuits, promoting design flexibility.

Maximum Power Dissipation (Abs): 2 W

With a maximum power dissipation of 2 W, this transistor can effectively manage heat, ensuring reliable operation in various conditions.

Package Style (Meter): SMALL OUTLINE

The small outline package style enables compact designs, making it easier to incorporate into tight spaces in modern electronics.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Using MOS technology enhances switching speed and efficiency, making this FET ideal for high-performance applications.

Maximum Operating Temperature: 150 °C

A maximum operating temperature of 150 °C ensures reliability and performance in a wide range of operating environments.

Transistor Element Material: SILICON

Silicon as a material offers effective performance and reliability, commonly used in a variety of electronic applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish allows for optimal conductivity and corrosion resistance, ensuring durable and reliable connections.

Maximum Drain-Source On Resistance: 0.11 ohm

A low on-resistance of 0.11 ohm minimizes power loss during operation, enhancing the overall efficiency of the circuit.

Terminal Position: DUAL

Dual terminal positioning enables straightforward PCB layout and improves flexibility in circuit design.

Technical Specifications

Small Signal Field Effect Transistors (FET) STS3DPFS45 attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Minimum DS Breakdown Voltage:

45 V

Maximum Drain Current (Abs) (ID):

3 A

Maximum Drain Current (ID):

3 A

Maximum Drain-Source On Resistance:

.11 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

2 W

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STS3DPFS45 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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