Loading...

STQ2NK60ZR-AP

STMicroelectronics

STQ2NK60ZR-AP by STMicroelectronics

STQ2NK60ZR-AP by STMicroelectronics is an N-channel FET designed for switching applications. It features a 600V breakdown voltage, 1.6A max pulsed drain current, and operates at up to 150 °C. Ideal for power management in various electronic devices.

Median Price

$0.031

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 5 parts In-Stock

1+ parts

$0.031

100+ parts

-

1k+ parts

-

10k+ parts

-

5

$0.031

-

-

-

Verical

USA . 614 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

614

-

-

-

-

Chip1Stop

Japan . 5 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,112 parts In-Stock

1+ parts

$0.029

100+ parts

-

1k+ parts

-

10k+ parts

-

3,112

$0.029

-

-

-

Cyclops Electronics Ltd

UK . 10,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10,000

-

-

-

-

Vyrian

USA . 3,429 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,429

-

-

-

-

Anansix

USA . 2,833 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,833

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,750 parts In-Stock

1+ parts

$0.028

100+ parts

-

1k+ parts

-

10k+ parts

-

2,750

$0.028

-

-

-

IDEA Electronic Components Group

UK . 1,173 parts In-Stock

1+ parts

$0.328

100+ parts

-

1k+ parts

$0.295

10k+ parts

-

1,173

$0.328

-

$0.295

-

MKK Technologies

India . 2,121 parts In-Stock

1+ parts

$0.616

100+ parts

-

1k+ parts

-

10k+ parts

-

2,121

$0.616

-

-

-

DigiPath Technology Company

USA . 2,121 parts In-Stock

1+ parts

$0.616

100+ parts

-

1k+ parts

-

10k+ parts

-

2,121

$0.616

-

-

-

AZTECH Wire

Italy . 79 parts In-Stock

1+ parts

$8.910

100+ parts

-

1k+ parts

-

10k+ parts

-

79

$8.910

-

-

-

Perfect Parts

USA . 17,920 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

17,920

-

-

-

-

Authorized Procurement Solutions

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10,000

-

-

-

-

A-Z Elektronik GmbH

Germany . 4,572 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,572

-

-

-

-

Alle Elektronik GmbH

Germany . 4,078 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,078

-

-

-

-

Kepictronics

USA . 3,550 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,550

-

-

-

-

Parana Technologies

USA . 2,346 parts In-Stock

1+ parts

-

100+ parts

$0.392

1k+ parts

-

10k+ parts

-

2,346

-

$0.392

-

-

Cyclops Electronics Ltd (Excess)

UK . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,000

-

-

-

-

S.R.D Solutions

India . 825 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

825

-

-

-

-

Overview

Elevate your projects with the STQ2NK60ZR-AP from STMicroelectronics, a leader in high-quality semiconductor solutions. This N-channel power FET delivers exceptional efficiency and reliability, ideal for demanding switching applications. With its robust design and built-in diode, it ensures superior performance under challenging conditions. Choose STMicroelectronics for innovation and quality that empower your designs, ensuring longevity and optimal functionality in every application.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection for the internal components, ensuring reliable performance in various environments.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are generally more efficient and faster in switching applications, making this product suitable for high-speed circuits.

Configuration: SINGLE WITH BUILT-IN DIODE

The inclusion of a built-in diode simplifies design and reduces component count, enhancing reliability and cost-effectiveness in applications.

Transistor Application: SWITCHING

Optimized for switching applications, this FET is ideal for power management and control within electronic devices.

Minimum DS Breakdown Voltage: 600 V

A high breakdown voltage ensures the transistor can operate in demanding environments, making it robust for various power applications.

Package Shape: ROUND

The round package shape allows for effective heat dissipation, ensuring better thermal management during operation.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide stable mounting and are ideal for applications requiring high mechanical strength.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for higher performance and efficiency compared to depletion-mode devices, making it suitable for advanced electronic applications.

Maximum Pulsed Drain Current (IDM): 1.6 A

The ability to handle a pulsed drain current of 1.6 A is advantageous for transient applications like motor drivers and solenoid control.

Avalanche Energy Rating (EAS): 90 mJ

A relatively high avalanche energy rating indicates increased reliability in applications subject to voltage spikes, protecting the device from damage.

Maximum Drain Current (Abs) (ID): 0.4 A

The absolute maximum drain current rating of 0.4 A allows for versatile use in various low to medium power applications.

No. of Terminals: 3

With 3 terminals, this FET is easy to integrate into various circuit designs while maintaining a compact form factor.

Maximum Power Dissipation (Abs): 3 W

This transistor’s capacity to dissipate up to 3 W makes it suitable for moderate power applications without overheating.

Package Style (Meter): CYLINDRICAL

The cylindrical package style is effective for heat dissipation and provides a stable physical structure in assemblies.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology allows for low gate drive power requirements and high input impedance, making it ideal for interfacing with microcontrollers.

Maximum Operating Temperature: 150 °C

A maximum operating temperature of 150 °C increases reliability in high-temperature environments, ensuring longevity in diverse applications.

Transistor Element Material: SILICON

Silicon as the transistor element material provides excellent electrical properties, contributing to the efficiency and performance of the device.

Terminal Finish: MATTE TIN

Matte tin finish enhances solderability and corrosion resistance, ensuring reliable connections in various electronic assemblies.

Maximum Drain Current (ID): 0.4 A

Reiterating the importance of the maximum drain current, this specification allows for versatility across a range of applications.

Maximum Drain-Source On Resistance: 8 ohm

A lower on-resistance minimizes power loss and improves efficiency, critical for applications demanding energy conservation.

Terminal Position: BOTTOM

Bottom terminal positioning can improve layout efficiency and thermal performance in packed circuit designs.

Technical Specifications

Power Field Effect Transistors (FET) STQ2NK60ZR-AP attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

90 mJ

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (Abs) (ID):

.4 A

Maximum Drain Current (ID):

.4 A

Maximum Drain-Source On Resistance:

8 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-92

JESD-30 Code:

O-PBCY-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

ROUND

Package Style (Meter):

CYLINDRICAL

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

3 W

Maximum Pulsed Drain Current (IDM):

1.6 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

BOTTOM

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STQ2NK60ZR-AP Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 2