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STPA001H

STMicroelectronics

STPA001H by STMicroelectronics

STPA001H by STMicroelectronics is a Class AB audio amplifier featuring 4 channels and delivering 50 W output power. It operates within a supply voltage range of 6-18 V and boasts low harmonic distortion at just 0.007%. Ideal for high-performance audio applications, it excels in compact designs with its zig-zag terminal layout.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,890 parts In-Stock

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2,890

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Digiode

USA . 1,921 parts In-Stock

1+ parts

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1,921

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Anansix

USA . 128 parts In-Stock

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128

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 609 parts In-Stock

1+ parts

$1.148

100+ parts

-

1k+ parts

$1.033

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609

$1.148

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$1.033

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MKK Technologies

India . 596 parts In-Stock

1+ parts

$2.159

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596

$2.159

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DigiPath Technology Company

USA . 596 parts In-Stock

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$2.159

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596

$2.159

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AZTECH Wire

Italy . 388 parts In-Stock

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$12.230

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388

$12.230

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Microchip USA

USA . 2,974 parts In-Stock

1+ parts

$22.640

100+ parts

$22.320

1k+ parts

$22.160

10k+ parts

$22.000

2,974

$22.640

$22.320

$22.160

$22.000

Corphita

USA . 4,838 parts In-Stock

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4,838

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QUARKTWIN TECHNOLOGY LTD

USA . 4,636 parts In-Stock

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4,636

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Parana Technologies

USA . 376 parts In-Stock

1+ parts

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$1.373

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376

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$1.373

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Overview

Elevate your audio experience with the STPA001H from STMicroelectronics, a pinnacle of quality in Class AB audio amplification. Engineered for excellence, this 4-channel amplifier delivers stunning sound clarity with minimal distortion, perfect for both professional and home applications. Backed by STMicroelectronics' reputation for innovation and reliability, the STPA001H promises unmatched performance, empowering you to create immersive audio environments that resonate with every listener.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable material ensures the amplifier is resilient to environmental factors, enhancing longevity.

No. of Functions: 4

Having multiple functions makes this amplifier versatile for various audio applications, making it suitable for a range of setups.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of space, facilitating easy integration into various systems.

General IC Type: CLASS AB AUDIO AMPLIFIER

Class AB amplifiers are known for their high efficiency and low distortion, providing superior audio quality.

Harmonic Distortion: 0.007 %

This low level of harmonic distortion ensures clean sound reproduction, making it ideal for audiophiles.

No. of Terminals: 25

The ample number of terminals provides flexibility for wiring and integration, accommodating various configurations.

Package Style (Meter): IN-LINE

In-line packaging simplifies mounting and assembly in a variety of applications.

Maximum Operating Temperature: 150 °C

With a high operating temperature, this amplifier can function reliably in demanding environments.

Nominal Output Power: 50 W

50W output power is sufficient for driving a range of speakers, ensuring robust audio performance.

Maximum Seated Height: 4.65 mm

The low height allows for compact designs, making it easy to fit into tight spaces.

Width: 15.7 mm

This narrow width allows for efficient layout and space-saving in circuit designs.

Minimum Supply Voltage (Vsup): 6 V

The low minimum supply voltage increases compatibility with a variety of power sources.

Length: 29.23 mm

This compact length contributes to the overall versatility and adaptability of the amplifier.

No. of Channels: 4

Four channels support multi-channel audio systems, enhancing the user's immersive experience.

Technology: BCD

BCD technology allows for efficient manufacturing, leading to cost-effective and reliable products.

Nominal Bandwidth: 0.02 kHz

This bandwidth allows for both low-frequency and high-frequency sounds to be accurately reproduced.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide strong mechanical stability and are ideal for high-current applications.

Terminal Pitch: 1 mm

The 1 mm pitch allows for high-density circuit layouts, maximizing design flexibility.

Maximum Supply Voltage (Vsup): 18 V

The high maximum supply voltage expands the possibilities for power management in audio systems.

Technical Specifications

Audio & Video Amplifiers STPA001H attributes and parameters. Explore more Audio & Video Amplifiers devices from STMicroelectronics

Specs

Nominal Bandwidth:

.02 kHz

General IC Type:

Harmonic Distortion:

.007 %

JESD-30 Code:

R-PZIP-T25

Length:

29.23 mm

No. of Channels:

4

No. of Functions:

4

No. of Terminals:

25

Maximum Operating Temperature:

150 Cel

Nominal Output Power:

50 W

Package Body Material:

PLASTIC/EPOXY

Package Code:

ZIP

Package Equivalence Code:

ZIP27,.16,.16,40

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

4.65 mm

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

6 V

Surface Mount:

NO

Technology:

BCD

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

ZIG-ZAG

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

15.7 mm

Trade Compliance

STPA001H General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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