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STPA008-ZST

STMicroelectronics

STPA008-ZST by STMicroelectronics

STPA008-ZST by STMicroelectronics is a compact audio amplifier with 50W output power, ideal for automotive applications. It operates b/w -40 °C to 105 °C and features low harmonic distortion of just 0.01%. This AEC-Q100 certified device supports up to 4 channels in a small outline package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,900 parts In-Stock

1+ parts

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3,900

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Anansix

USA . 1,412 parts In-Stock

1+ parts

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1,412

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Digiode

USA . 1,249 parts In-Stock

1+ parts

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1,249

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,963 parts In-Stock

1+ parts

$2.846

100+ parts

-

1k+ parts

$2.562

10k+ parts

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1,963

$2.846

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$2.562

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MKK Technologies

India . 1,694 parts In-Stock

1+ parts

$5.353

100+ parts

-

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1,694

$5.353

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DigiPath Technology Company

USA . 1,694 parts In-Stock

1+ parts

$5.353

100+ parts

-

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1,694

$5.353

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AZTECH Wire

Italy . 943 parts In-Stock

1+ parts

$18.450

100+ parts

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943

$18.450

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Microchip USA

USA . 1,651 parts In-Stock

1+ parts

$18.521

100+ parts

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1,651

$18.521

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Component Stockers USA

USA . 700 parts In-Stock

1+ parts

$62.480

100+ parts

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700

$62.480

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Corphita

USA . 3,911 parts In-Stock

1+ parts

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3,911

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Parana Technologies

USA . 2,316 parts In-Stock

1+ parts

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100+ parts

$3.403

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2,316

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$3.403

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Overview

Elevate your audio experience with the STPA008-ZST from STMicroelectronics, a top-tier audio amplifier designed for excellence. Built to withstand extreme conditions with AEC-Q100 screening, this compact powerhouse delivers 50W across four channels, ensuring crystal-clear sound in any application—from automotive systems to home theaters. Trust in STMicroelectronics’ reputation for innovation and quality, and enjoy unparalleled performance that transforms your audio environment.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient use of PCB space, enhancing overall product integration.

Screening Level: AEC-Q100

Being AEC-Q100 qualified indicates high reliability and suitability for automotive applications, ensuring performance under strenuous conditions.

Package Shape: RECTANGULAR

The rectangular package shape is optimal for space-saving designs, making it easier to fit into different layouts.

General IC Type: AUDIO AMPLIFIER

As an audio amplifier, it provides high-quality sound amplification, making it a great choice for audio applications.

Harmonic Distortion: 0.01 %

With a low harmonic distortion rate, this amplifier delivers clean and transparent sound, enhancing audio fidelity.

No. of Terminals: 36

The high number of terminals enhances connectivity options and flexibility in circuit design.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG

The small outline with heat sink feature improves heat dissipation, leading to better thermal management during operation.

Maximum Operating Temperature: 105 °C

A maximum operating temperature of 105 °C ensures reliable performance in high-temperature environments.

Minimum Operating Temperature: -40 °C

The ability to operate at -40 °C makes it suitable for use in extreme cold conditions, ensuring versatility.

Terminal Position: DUAL

The dual terminal position aids in simplified PCB layout and connectivity options.

Nominal Output Power: 50 W

With 50 W nominal output power, this amplifier can drive a variety of speakers effectively for optimal sound performance.

Maximum Seated Height: 3.41 mm

A low maximum seated height allows for compact installations, fitting well in space-constrained designs.

Width: 11 mm

A width of 11 mm contributes to compact form factors, promoting efficient use of space in audio systems.

Minimum Supply Voltage (Vsup): 6 V

The wide range for minimum supply voltage allows flexibility in power supply options.

Length: 15.9 mm

A length of 15.9 mm makes it suitable for compact designs where space is at a premium.

No. of Channels: 4

With 4 channels, this amplifier can support multi-channel sound systems, enhancing the audio experience.

Nominal Bandwidth: 0.02 kHz

A nominal bandwidth of 0.02 kHz allows for reproduction of a broad range of audio frequencies, improving sound quality.

Terminal Form: GULL WING

The gull wing terminal form provides excellent soldering characteristics and ensures reliable connections.

Maximum Supply Current: 280 mA

The maximum supply current of 280 mA supports high-power applications while maintaining efficient operations.

Terminal Pitch: 0.65 mm

A 0.65 mm terminal pitch facilitates high density in PCB layout, enabling more features in compact spaces.

Maximum Supply Voltage (Vsup): 18 V

With a maximum supply voltage of 18 V, this product supports a range of power supply configurations, enhancing versatility.

Technical Specifications

Audio & Video Amplifiers STPA008-ZST attributes and parameters. Explore more Audio & Video Amplifiers devices from STMicroelectronics

Specs

Nominal Bandwidth:

.02 kHz

General IC Type:

Harmonic Distortion:

.01 %

JESD-30 Code:

R-PDSO-G36

Length:

15.9 mm

No. of Channels:

4

No. of Functions:

1

No. of Terminals:

36

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Power:

50 W

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP36,.4,32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG

Screening Level:

AEC-Q100

Maximum Seated Height:

3.41 mm

Maximum Supply Current:

280 mA

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

6 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

11 mm

Trade Compliance

STPA008-ZST General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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