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STP6NK70Z

STMicroelectronics

STP6NK70Z by STMicroelectronics

STP6NK70Z by STMicroelectronics is a powerful N-channel FET designed for switching applications. It features a 700V breakdown voltage, 20A pulsed drain current, and operates at up to 150 °C. Ideal for high-efficiency power management in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,841 parts In-Stock

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6,841

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Anansix

USA . 2,865 parts In-Stock

1+ parts

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2,865

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Digiode

USA . 439 parts In-Stock

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439

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 234 parts In-Stock

1+ parts

$1.087

100+ parts

-

1k+ parts

$0.978

10k+ parts

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234

$1.087

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$0.978

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MKK Technologies

India . 733 parts In-Stock

1+ parts

$2.043

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733

$2.043

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DigiPath Technology Company

USA . 733 parts In-Stock

1+ parts

$2.043

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733

$2.043

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AZTECH Wire

Italy . 358 parts In-Stock

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$9.760

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358

$9.760

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Alle Elektronik GmbH

Germany . 3,213 parts In-Stock

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3,213

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Corphita

USA . 2,519 parts In-Stock

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2,519

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Parana Technologies

USA . 1,880 parts In-Stock

1+ parts

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$1.299

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1,880

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$1.299

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Overview

Unlock the power of efficiency with the STP6NK70Z from STMicroelectronics, a leader in innovative semiconductor solutions. This N-channel power FET excels in switching applications, ensuring reliability and robustness under demanding conditions. With its high breakdown voltage and exceptional thermal performance, it delivers remarkable value for your projects, from industrial automation to renewable energy systems. Trust in ST’s quality for superior performance and long-lasting benefits.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This lightweight and durable material ensures effective protection and insulation, making the product suitable for varied applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs provide lower on-resistance and higher efficiency, making them ideal for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Having a built-in diode simplifies circuit design and improves the efficiency of power management.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers quick response times, increasing overall circuit performance.

Minimum DS Breakdown Voltage: 700 V

A high breakdown voltage enhances reliability, allowing for use in high-voltage applications without risk of failure.

Package Shape: RECTANGULAR

The rectangular package shape optimizes space on PCBs, allowing for more efficient layout designs.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide a robust mechanical connection, ensuring longevity and stability in various operational settings.

Operating Mode: ENHANCEMENT MODE

Enhancement mode improves power efficiency by allowing the device to conduct only when sufficient gate voltage is applied.

Maximum Pulsed Drain Current (IDM): 20 A

This high pulsed current rating supports demanding applications, providing the flexibility needed for power-intensive operations.

Avalanche Energy Rating (EAS): 200 mJ

This rating indicates robustness against transient energy events, enhancing the FET's reliability in real-world circuits.

Maximum Drain Current (Abs) (ID): 5 A

The maximum drain current rating ensures the FET can handle a substantial load, making it suitable for various applications.

No. of Terminals: 3

Having three terminals simplifies connection and integration into circuits, streamlining design processes.

Maximum Power Dissipation (Abs): 110 W

This high power dissipation capability allows for efficient thermal management, essential for maintaining performance during operation.

Package Style (Meter): FLANGE MOUNT

Flange mount style provides easy installation and reliable mounting options, improving assembly efficiency.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology enhances the switching speed and overall efficiency, making it suitable for high-speed applications.

Maximum Operating Temperature: 150 °C

A high operating temperature threshold ensures functionality in demanding environments, improving reliability.

Transistor Element Material: SILICON

Silicon as a semiconductor material offers excellent thermal stability and performance, ensuring lasting effectiveness.

Terminal Finish: MATTE TIN

The matte tin finish provides good solderability and corrosion resistance, beneficial for long-term performance.

Maximum Drain Current (ID): 5 A

This ensures that the device can perform effectively without overheating or failing under typical load conditions.

Maximum Drain-Source On Resistance: 1.8 ohm

Low on-resistance results in lower power losses and increased efficiency during operation, crucial for power-sensitive applications.

Terminal Position: SINGLE

Single terminal position simplifies layout and connection in compact designs, enhancing circuit board efficiency.

Technical Specifications

Power Field Effect Transistors (FET) STP6NK70Z attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

AVALANCHE RATED

Avalanche Energy Rating (EAS):

200 mJ

Minimum DS Breakdown Voltage:

700 V

Maximum Drain Current (Abs) (ID):

5 A

Maximum Drain Current (ID):

5 A

Maximum Drain-Source On Resistance:

1.8 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

20 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STP6NK70Z Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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