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STP65N150M9

STMicroelectronics

STP65N150M9 by STMicroelectronics

STP65N150M9 from STMicroelectronics is a powerful N-channel FET designed for switching applications. It features a 650V breakdown voltage, 50A pulsed drain current, and operates at up to 150 °C. Ideal for high-efficiency power management in various electronic devices.

Median Price

$3.330

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 136 parts In-Stock

1+ parts

$3.330

100+ parts

$1.590

1k+ parts

-

10k+ parts

-

136

$3.330

$1.590

-

-

Mouser Electronics

USA . 101 parts In-Stock

1+ parts

$4.650

100+ parts

$2.210

1k+ parts

$1.790

10k+ parts

$1.740

101

$4.650

$2.210

$1.790

$1.740

DigiKey

USA . 413 parts In-Stock

1+ parts

$4.960

100+ parts

$2.345

1k+ parts

$1.813

10k+ parts

-

413

$4.960

$2.345

$1.813

-

Newark

USA . 136 parts In-Stock

1+ parts

$5.020

100+ parts

$2.720

1k+ parts

$2.430

10k+ parts

-

136

$5.020

$2.720

$2.430

-

Element14

Singapore . 156 parts In-Stock

1+ parts

$5.550

100+ parts

$3.560

1k+ parts

$2.850

10k+ parts

-

156

$5.550

$3.560

$2.850

-

Avnet

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

-

-

-

-

Arrow

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.943

10k+ parts

$1.787

1,000

-

-

$1.943

$1.787

Future Electronics

Canada . 950 parts In-Stock

1+ parts

-

100+ parts

$1.660

1k+ parts

$1.600

10k+ parts

$1.580

950

-

$1.660

$1.600

$1.580

Verical

USA . 200 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.538

10k+ parts

$2.388

200

-

-

$2.538

$2.388

Rochester

USA . 200 parts In-Stock

1+ parts

-

100+ parts

$2.270

1k+ parts

$2.030

10k+ parts

$1.910

200

-

$2.270

$2.030

$1.910

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 981 parts In-Stock

1+ parts

$2.318

100+ parts

-

1k+ parts

-

10k+ parts

-

981

$2.318

-

-

-

Vyrian

USA . 4,998 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,998

-

-

-

-

Anansix

USA . 1,494 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,494

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 141 parts In-Stock

1+ parts

$0.634

100+ parts

-

1k+ parts

$0.570

10k+ parts

-

141

$0.634

-

$0.570

-

MKK Technologies

India . 1,828 parts In-Stock

1+ parts

$1.192

100+ parts

-

1k+ parts

-

10k+ parts

-

1,828

$1.192

-

-

-

DigiPath Technology Company

USA . 1,828 parts In-Stock

1+ parts

$1.192

100+ parts

-

1k+ parts

-

10k+ parts

-

1,828

$1.192

-

-

-

Corphita

USA . 4,644 parts In-Stock

1+ parts

$2.196

100+ parts

-

1k+ parts

-

10k+ parts

-

4,644

$2.196

-

-

-

Continental Prestige Electronics

USA . 178 parts In-Stock

1+ parts

$3.750

100+ parts

$2.470

1k+ parts

$1.770

10k+ parts

-

178

$3.750

$2.470

$1.770

-

Microchip USA

USA . 6,492 parts In-Stock

1+ parts

$26.195

100+ parts

-

1k+ parts

-

10k+ parts

-

6,492

$26.195

-

-

-

Parana Technologies

USA . 1,104 parts In-Stock

1+ parts

-

100+ parts

$0.758

1k+ parts

-

10k+ parts

-

1,104

-

$0.758

-

-

Eastek

USA . 200 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

200

-

-

-

-

Authorized Procurement Solutions

USA . 100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

100

-

-

-

-

Overview

Unlock unparalleled performance with the STP65N150M9 from STMicroelectronics, a trusted leader in semiconductor innovation. This N-channel power FET excels in high-voltage applications, delivering efficient switching that enhances system reliability and longevity. Designed for rugged environments, its robust construction ensures optimal thermal management, making it ideal for industrial, automotive, and energy applications. Experience superior quality and performance that drive your projects to success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures lightweight, cost-effective, and durable packaging, suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs offer higher electron mobility, resulting in better performance and efficiency in switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode provides integrated protection against reverse voltage, enhancing reliability in circuits.

Transistor Application: SWITCHING

Designed specifically for switching applications, allowing for rapid on/off control of electrical power.

Minimum DS Breakdown Voltage: 650 V

A high breakdown voltage allows this FET to be used in high-voltage applications, making it versatile.

Package Shape: RECTANGULAR

The rectangular shape facilitates efficient space utilization on PCBs, contributing to compact designs.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide robust mechanical connections, enhancing stability in demanding environments.

Operating Mode: ENHANCEMENT MODE

Enhancement mode allows for reduced leakage current and better control of the transistor's on/off states, improving energy efficiency.

Maximum Pulsed Drain Current (IDM): 50 A

A high pulsed current rating supports applications requiring short bursts of high power, adding flexibility.

Avalanche Energy Rating (EAS): 200 mJ

A significant avalanche energy rating provides reliability in transient conditions, reducing the risk of failure.

No. of Terminals: 3

A three-terminal design simplifies connections and reduces potential complications in circuit design.

Maximum Power Dissipation (Abs): 140 W

High power dissipation capabilities ensure that the FET can handle substantial amounts of heat, improving performance.

Package Style (Meter): FLANGE MOUNT

Flange mount style enhances ease of installation and thermal performance, making it suitable for various mounting methods.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology provides higher efficiency and greater scalability for modern electronic devices.

Maximum Operating Temperature: 150 °C

High operating temperature tolerance allows for reliable performance in harsh environments.

Transistor Element Material: SILICON

Silicon is a widely used semiconductor material known for its excellent electronic properties.

Maximum Drain Current (ID): 20 A

The ability to handle 20 A of drain current makes this FET suitable for a wide range of power applications.

Maximum Drain-Source On Resistance: 0.15 ohm

Low on-resistance minimizes power losses, improving efficiency in power management applications.

Terminal Position: SINGLE

A single terminal position simplifies design and circuit layout, making integration easier.

Case Connection: DRAIN

DRAIN case connection ensures effective heat dissipation and facilitates better performance in power applications.

Technical Specifications

Power Field Effect Transistors (FET) STP65N150M9 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

200 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

650 V

Maximum Drain Current (ID):

20 A

Maximum Drain-Source On Resistance:

.15 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

50 A

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STP65N150M9 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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