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STP5N62K3

STMicroelectronics

STP5N62K3 by STMicroelectronics

STP5N62K3 by STMicroelectronics is a N-CHANNEL FET with 620V DS Breakdown Voltage, 16.8A IDM, and 1.6Ω RDS(on). Ideal for SWITCHING applications due to its 70W Pdiss and ENHANCEMENT MODE operation at up to 150 °C.

Median Price

$0.443

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 995 parts In-Stock

1+ parts

$0.443

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$0.443

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$0.443

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$0.443

995

$0.443

$0.443

$0.443

$0.443

Chip1Stop

Japan . 995 parts In-Stock

1+ parts

$0.864

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$0.864

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Verical

USA . 995 parts In-Stock

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$0.443

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$0.443

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$0.443

995

-

$0.443

$0.443

$0.443

Distributors (In-Stock)

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Digiode

USA . 3,197 parts In-Stock

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$0.421

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Vyrian

USA . 13,169 parts In-Stock

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Cyclops Electronics Ltd

UK . 950 parts In-Stock

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Anansix

USA . 779 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 497 parts In-Stock

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Bristol Electronics

USA . 497 parts In-Stock

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Dan-Mar Components

USA . 497 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 1,976 parts In-Stock

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$0.399

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IDEA Electronic Components Group

UK . 950 parts In-Stock

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$1.731

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$1.558

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$1.731

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$1.558

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MKK Technologies

India . 1,868 parts In-Stock

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$3.256

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$3.256

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DigiPath Technology Company

USA . 1,868 parts In-Stock

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$3.256

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$3.256

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AZTECH Wire

Italy . 307 parts In-Stock

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$12.830

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Kepictronics

USA . 5,000 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,812 parts In-Stock

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Perfect Parts

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Parana Technologies

USA . 1,798 parts In-Stock

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$2.070

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Epart123

USA . 950 parts In-Stock

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$0.280

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GreenTree Electronics

Israel . 950 parts In-Stock

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Overview

Discover the STP5N62K3 by STMicroelectronics, a high-quality Power Field Effect Transistor designed for switching applications. With a maximum breakdown voltage of 620V and a pulsing current of 16.8A, this N-CHANNEL transistor offers exceptional performance and reliability. Its single configuration with built-in diode makes it versatile for various electronic projects. Trust in STMicroelectronics' reputation for excellence in semiconductor technology and elevate your designs with the STP5N62K3 for efficient power management solutions. Unlock the potential of your projects with this reliable and powerful component.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used in FETs for its high thermal conductivity and electrical insulation properties, ensuring reliable performance.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have higher mobility and faster switching speeds compared to P-channel FETs, making them suitable for high-performance applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET can efficiently control the flow of current, making it ideal for power management and motor control systems.

Minimum DS Breakdown Voltage: 620 V

The high breakdown voltage ensures that the FET can handle high voltage applications without breakdown, enhancing its reliability and durability.

Maximum Drain Current (ID): 4.2 A

With a high maximum drain current rating, this FET can handle large currents without overheating, ensuring stable operation in demanding conditions.

Maximum Power Dissipation (Abs): 70 W

The high power dissipation capability allows this FET to handle high power levels without damage, making it suitable for applications with heavy loads.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150 °C, this FET can operate in high-temperature environments without performance degradation, ensuring long-term reliability.

Technical Specifications

Power Field Effect Transistors (FET) STP5N62K3 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

ULTRA LOW-ON RESISTANCE

Avalanche Energy Rating (EAS):

120 mJ

Minimum DS Breakdown Voltage:

620 V

Maximum Drain Current (Abs) (ID):

4.2 A

Maximum Drain Current (ID):

4.2 A

Maximum Drain-Source On Resistance:

1.6 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

16.8 A

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STP5N62K3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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