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STP35NF10

STMicroelectronics

STP35NF10 by STMicroelectronics

STP35NF10 by STMicroelectronics is a N-CHANNEL FET with 100V DS Breakdown Voltage, 160A IDM, and 0.035 ohm RDS(on). It is used for SWITCHING applications in ENHANCEMENT MODE with a max power dissipation of 100W.

Median Price

$1.000

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DF Sales Co.

USA . 50 parts In-Stock

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$1.000

100+ parts

-

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50

$1.000

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DF Sales Co.

USA . 50 parts In-Stock

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$1.000

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50

$1.000

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Vyrian

USA . 7,325 parts In-Stock

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7,325

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Chip Stock

USA . 5,855 parts In-Stock

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5,855

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Pegasus Components GmbH

Germany . 3,975 parts In-Stock

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3,975

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Goldney Electronics S.L.

Spain . 3,700 parts In-Stock

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3,700

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Semtec, LLC

USA . 3,550 parts In-Stock

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3,550

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Digiode

USA . 3,307 parts In-Stock

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3,307

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Anansix

USA . 2,156 parts In-Stock

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2,156

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ComSIT Distribution GmbH

Germany . 1,100 parts In-Stock

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1,100

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R&J Components

USA . 500 parts In-Stock

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500

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ACDS - Activité Composants Distribution Service

France . 100 parts In-Stock

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100

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Jameco Electronics

USA . 6 parts In-Stock

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6

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Bisco

USA . 3 parts In-Stock

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,376 parts In-Stock

1+ parts

$0.934

100+ parts

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1k+ parts

$0.840

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1,376

$0.934

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$0.840

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MKK Technologies

India . 1,892 parts In-Stock

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$1.756

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1,892

$1.756

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DigiPath Technology Company

USA . 1,892 parts In-Stock

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$1.756

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1,892

$1.756

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AZTECH Wire

Italy . 762 parts In-Stock

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$22.230

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762

$22.230

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Perfect Parts

USA . 38,479 parts In-Stock

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38,479

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Kepictronics

USA . 12,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,297 parts In-Stock

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5,297

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Corphita

USA . 4,147 parts In-Stock

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4,147

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Alle Elektronik GmbH

Germany . 3,223 parts In-Stock

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3,223

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Parana Technologies

USA . 970 parts In-Stock

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$1.116

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970

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$1.116

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iodParts Technologies Inc.

India . 600 parts In-Stock

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600

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GreenTree Electronics

Israel . 100 parts In-Stock

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100

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Cyclops Electronics Ltd (Excess)

UK . 100 parts In-Stock

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100

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Overview

Unleash the power of innovation with the STP35NF10 by STMicroelectronics. Crafted with precision and expertise, this N-channel Power Field Effect Transistor is engineered for excellence in switching applications. With a single configuration and built-in diode, this transistor offers unrivaled performance and reliability. From its high DS breakdown voltage to its low on-resistance, the STP35NF10 delivers superior efficiency and durability. Elevate your projects with this cutting-edge technology and experience the quality and value that STMicroelectronics brings to every application.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides good insulation and protection for the transistor, ensuring durability and reliability in various operating conditions.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically offer lower on-resistance and higher efficiency compared to P-channel FETs, making them suitable for many switching applications.

Minimum DS Breakdown Voltage: 100 V

With a minimum breakdown voltage of 100V, this FET can handle higher voltage loads, making it suitable for high-power applications.

Maximum Pulsed Drain Current (IDM): 160 A

The high pulsed drain current rating of 160A allows the FET to handle short-term high current surges, making it reliable in demanding conditions.

Maximum Power Dissipation (Abs): 100 W

The high power dissipation rating of 100W indicates the FET's ability to handle heat generated during operation, ensuring long-term reliability.

Maximum Operating Temperature: 175 °C

With a maximum operating temperature of 175 °C, this FET can operate in high-temperature environments without compromising performance.

Technical Specifications

Power Field Effect Transistors (FET) STP35NF10 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

300 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (Abs) (ID):

35 A

Maximum Drain Current (ID):

40 A

Maximum Drain-Source On Resistance:

.035 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

160 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STP35NF10 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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