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STP35N65M5

STMicroelectronics

STP35N65M5 by STMicroelectronics

STP35N65M5 from STMicroelectronics is a powerful N-channel FET designed for switching applications. It features a 650V breakdown voltage, 27A max drain current, and 160W power dissipation. Ideal for high-efficiency power management in various electronic devices.

Median Price

$8.664

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 850 parts In-Stock

1+ parts

$8.664

100+ parts

$4.072

1k+ parts

$3.725

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850

$8.664

$4.072

$3.725

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Vyrian

USA . 8,144 parts In-Stock

1+ parts

-

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8,144

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Digiode

USA . 3,400 parts In-Stock

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3,400

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Anansix

USA . 2,535 parts In-Stock

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2,535

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Microfarads

USA . 819 parts In-Stock

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819

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Sunrise Surplus Inc.

USA . 100 parts In-Stock

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100

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IDEA Electronic Components Group

UK . 1,342 parts In-Stock

1+ parts

$1.702

100+ parts

-

1k+ parts

$1.532

10k+ parts

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1,342

$1.702

-

$1.532

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Ampacity Inc.

Singapore . 276 parts In-Stock

1+ parts

$3.050

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-

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276

$3.050

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MKK Technologies

India . 411 parts In-Stock

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$3.200

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411

$3.200

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DigiPath Technology Company

USA . 411 parts In-Stock

1+ parts

$3.200

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411

$3.200

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AZTECH Wire

Italy . 1,004 parts In-Stock

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$9.640

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1,004

$9.640

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Metaverse IC Inc.

Canada . 56,986 parts In-Stock

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56,986

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QUARKTWIN TECHNOLOGY LTD

USA . 23,211 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,468 parts In-Stock

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5,468

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Alle Elektronik GmbH

Germany . 3,368 parts In-Stock

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3,368

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Parana Technologies

USA . 1,116 parts In-Stock

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$2.035

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1,116

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$2.035

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Perfect Parts

USA . 581 parts In-Stock

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581

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Corphita

USA . 502 parts In-Stock

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502

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Kepictronics

USA . 75 parts In-Stock

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75

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Overview

Unlock superior performance with the STP35N65M5 Power Field Effect Transistor from STMicroelectronics, a leader in innovative semiconductor solutions. Designed for switching applications, this robust N-channel FET ensures reliability and efficiency, handling high voltages with ease. Experience enhanced power management in industrial, automotive, and consumer electronics, all while benefiting from ST's commitment to quality and cutting-edge technology that drives your projects forward.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and efficient thermal management, making the product suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs offer superior performance in terms of efficiency and switching speed, making them ideal for power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode enhances reliability by providing protection against flyback voltage in inductive loads.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET provides fast operation and efficiency for power control.

Minimum DS Breakdown Voltage: 650 V

With a high breakdown voltage, this FET can handle demanding conditions, ensuring robustness in high voltage applications.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient use of space in circuit board layouts, contributing to compact designs.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide strong mechanical support and ensure reliable connections in various assembly techniques.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for greater control and efficiency in switching applications.

Maximum Pulsed Drain Current (IDM): 108 A

A high pulsed drain current rating allows this FET to handle transient loads, making it suitable for demanding applications.

Avalanche Energy Rating (EAS): 800 mJ

The significant avalanche energy rating allows this FET to safely handle energy spikes, enhancing reliability in dynamic conditions.

Maximum Drain Current (Abs) (ID): 27 A

This maximum current rating indicates that the FET can handle substantial loads, making it versatile for various power applications.

No. of Terminals: 3

The three-terminal configuration simplifies circuit design while ensuring efficient performance.

Maximum Power Dissipation (Abs): 160 W

A high power dissipation capability allows for effective thermal management and endurance during operation.

Package Style (Meter): FLANGE MOUNT

Flange mount design provides added stability and ease of installation in high-power applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology offers high efficiency and fast switching, making it an excellent choice for modern electronic circuits.

Maximum Operating Temperature: 150 °C

A high operating temperature rating ensures reliability and performance even in demanding environments.

Transistor Element Material: SILICON

Silicon is a standard material for FETs, providing excellent conductivity and thermal stability.

Terminal Finish: MATTE TIN

The matte tin terminal finish enhances solderability and improves longevity in PCB applications.

Maximum Drain Current (ID): 27 A

The maximum drain current rating indicates robust performance in a variety of power application scenarios.

Maximum Drain-Source On Resistance: 0.098 ohm

Low on-resistance improves efficiency and reduces heat generation during operation, enhancing overall system performance.

Terminal Position: SINGLE

Single terminal position simplifies layout design and minimizes the footprint in applications.

Case Connection: ISOLATED

Isolated case connection improves safety and reduces risk of unwanted feedback in power circuits.

Technical Specifications

Power Field Effect Transistors (FET) STP35N65M5 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

800 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

650 V

Maximum Drain Current (Abs) (ID):

27 A

Maximum Drain Current (ID):

27 A

Maximum Drain-Source On Resistance:

.098 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

108 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STP35N65M5 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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