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STP30NM30N

STMicroelectronics

STP30NM30N by STMicroelectronics

STP30NM30N from STMicroelectronics is a powerful N-channel FET designed for switching applications. It features a max drain current of 30 A, breakdown voltage of 300 V, and power dissipation up to 160 W. Ideal for high-efficiency circuits in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,206 parts In-Stock

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8,206

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Digiode

USA . 2,960 parts In-Stock

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2,960

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Anansix

USA . 967 parts In-Stock

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967

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 2,352 parts In-Stock

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$0.787

100+ parts

-

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$0.708

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2,352

$0.787

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$0.708

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MKK Technologies

India . 1,864 parts In-Stock

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$1.479

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1,864

$1.479

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DigiPath Technology Company

USA . 1,864 parts In-Stock

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$1.479

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1,864

$1.479

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AZTECH Wire

Italy . 951 parts In-Stock

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$8.460

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951

$8.460

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A-Z Elektronik GmbH

Germany . 5,552 parts In-Stock

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5,552

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Alle Elektronik GmbH

Germany . 3,013 parts In-Stock

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3,013

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Parana Technologies

USA . 1,280 parts In-Stock

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$0.940

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1,280

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$0.940

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Corphita

USA . 410 parts In-Stock

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410

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Perfect Parts

USA . 274 parts In-Stock

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Overview

Elevate your projects with the STP30NM30N from STMicroelectronics, a top-tier N-channel power FET known for its reliability and efficiency. With a robust design for switching applications, it delivers outstanding performance in demanding environments. Backed by a leading manufacturer, this transistor ensures durability and precision, making it ideal for automotive, industrial, and consumer electronics. Experience exceptional value and peace of mind while driving innovation forward!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures lightweight and cost-effective packaging while providing adequate protection and reliability.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically offer lower on-resistance and better performance, making them ideal for high-efficiency applications.

Configuration: SINGLE WITH BUILT-IN DIODE

This configuration allows for easy integration into circuits, providing essential protection against back EMF and simplifying design.

Transistor Application: SWITCHING

This transistor is optimized for switching applications, making it suitable for various power management and control tasks.

Minimum DS Breakdown Voltage: 300 V

A high breakdown voltage enhances reliability and suits applications with high voltage requirements, making it a robust choice.

Package Shape: RECTANGULAR

The rectangular package shape is beneficial for efficient space utilization on PCBs, facilitating compact designs.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide robust mechanical support, suited for applications where environmental resilience is critical.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for higher efficiency and reduced power loss in applications by enabling the transistor only when needed.

Maximum Pulsed Drain Current (IDM): 120 A

The high pulsed drain current rating enables the FET to handle brief surges, making it suitable for dynamic switching applications.

Avalanche Energy Rating (EAS): 900 mJ

A high avalanche energy rating provides assurance that the device can withstand energy spikes, enhancing durability and reliability.

Maximum Drain Current (Abs) (ID): 30 A

The maximum absolute drain current ensures that the FET can effectively manage significant current loads, suitable for heavy-duty applications.

No. of Terminals: 3

A three-terminal design simplifies circuit connections and reduces complexity in the layout, improving overall design efficiency.

Maximum Power Dissipation (Abs): 160 W

A high power dissipation capability allows this FET to manage significant power levels, suitable for demanding applications.

Package Style (Meter): FLANGE MOUNT

Flange mount style provides enhanced stability and thermal performance, making it ideal for industrial and high-power settings.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology contributes to low gate drive power requirements and fast switching speeds, making it efficient for a wide range of applications.

Maximum Operating Temperature: 150 °C

A high operating temperature rating allows the FET to function in harsh environments, ensuring reliability in diverse applications.

Transistor Element Material: SILICON

Silicon as a material ensures robustness and excellent electrical properties, making it a popular choice in power electronics.

Terminal Finish: TIN

A tin terminal finish enhances solderability and corrosion resistance, contributing to better assembly and longevity of the device.

Maximum Drain Current (ID): 30 A

The specified maximum drain current ensures that the FET can efficiently handle substantial loads without risk of damage.

Maximum Drain-Source On Resistance: 0.09 ohm

A low on-resistance value minimizes power loss during operation, enhancing efficiency and thermal management.

Terminal Position: SINGLE

Single terminal positioning simplifies integration into circuits, ensuring ease of use in design and layout.

Technical Specifications

Power Field Effect Transistors (FET) STP30NM30N attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

900 mJ

Minimum DS Breakdown Voltage:

300 V

Maximum Drain Current (Abs) (ID):

30 A

Maximum Drain Current (ID):

30 A

Maximum Drain-Source On Resistance:

.09 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

120 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STP30NM30N Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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