Loading...

STP300NH02L

STMicroelectronics

STP300NH02L by STMicroelectronics

STP300NH02L by STMicroelectronics is a powerful N-channel FET designed for switching applications. It features a max drain current of 120 A, breakdown voltage of 24 V, and power dissipation up to 300 W. Ideal for high-efficiency power management in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,547 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,547

-

-

-

-

Digiode

USA . 2,853 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,853

-

-

-

-

Anansix

USA . 120 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

120

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 187 parts In-Stock

1+ parts

$0.909

100+ parts

-

1k+ parts

$0.818

10k+ parts

-

187

$0.909

-

$0.818

-

MKK Technologies

India . 760 parts In-Stock

1+ parts

$1.709

100+ parts

-

1k+ parts

-

10k+ parts

-

760

$1.709

-

-

-

DigiPath Technology Company

USA . 760 parts In-Stock

1+ parts

$1.709

100+ parts

-

1k+ parts

-

10k+ parts

-

760

$1.709

-

-

-

AZTECH Wire

Italy . 42 parts In-Stock

1+ parts

$8.380

100+ parts

-

1k+ parts

-

10k+ parts

-

42

$8.380

-

-

-

Metaverse IC Inc.

Canada . 56,986 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

56,986

-

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 18,933 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

18,933

-

-

-

-

Alle Elektronik GmbH

Germany . 4,095 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,095

-

-

-

-

Authorized Procurement Solutions

USA . 2,700 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,700

-

-

-

-

Corphita

USA . 2,522 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,522

-

-

-

-

Perfect Parts

USA . 693 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

693

-

-

-

-

Parana Technologies

USA . 672 parts In-Stock

1+ parts

-

100+ parts

$1.087

1k+ parts

-

10k+ parts

-

672

-

$1.087

-

-

Overview

Unlock unparalleled performance with the STP300NH02L from STMicroelectronics, a leader in cutting-edge semiconductor technology. This N-channel power FET excels in switching applications, boasting a robust design that ensures reliability and efficiency. Ideal for demanding environments, it delivers exceptional current handling and thermal management, enhancing your system's longevity. Trust in STMicroelectronics for quality that drives innovation and maximizes your project's potential.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body provides robust protection and durability, making it suitable for various environments.

Polarity or Channel Type: N-CHANNEL

N-channel configurations are known for their efficiency and are widely preferred in switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for better protection against reverse polarity, enhancing the reliability of the circuit.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET can handle rapid on-off cycles efficiently.

Minimum DS Breakdown Voltage: 24 V

A minimum breakdown voltage of 24V ensures safe operation in a variety of applications without risk of failure.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of space on PCBs and improves thermal management.

Terminal Form: THROUGH-HOLE

Through-hole terminals facilitate easy soldering and provide a robust connection on the PCB.

Operating Mode: ENHANCEMENT MODE

The enhancement mode allows for low on-resistance characteristics, improving overall performance and efficiency.

Maximum Pulsed Drain Current (IDM): 480 A

A high pulsed drain current capability allows this FET to handle significant power surges, making it suitable for demanding applications.

Avalanche Energy Rating (EAS): 1600 mJ

A high avalanche energy rating protects against voltage spikes, contributing to the durability and longevity of the device.

Maximum Drain Current (Abs) (ID): 120 A

The ability to handle up to 120A ensures this FET can support high-current applications effectively.

No. of Terminals: 3

Three terminals allow for versatile configurations and easier integration into various circuits.

Maximum Power Dissipation (Abs): 300 W

A high power dissipation rating allows this FET to operate safely in high-power environments without thermal issues.

Package Style (Meter): FLANGE MOUNT

Flange mount packaging offers robust mechanical support and simplifies heat dissipation.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology provides better efficiency, speed, and thermal performance, making it ideal for modern applications.

Maximum Operating Temperature: 175 °C

A high operating temperature rating ensures functionality in extreme conditions, enhancing reliability.

Transistor Element Material: SILICON

Silicon is a reliable semiconductor material that ensures stable performance across a variety of applications.

Maximum Drain Current (ID): 120 A

The maximum drain current reinforces this FET’s capability to handle heavy loads efficiently.

Maximum Drain-Source On Resistance: 0.0022 ohm

A low on-resistance minimizes power losses and increases efficiency in switching applications.

Terminal Position: SINGLE

A single terminal position simplifies layout and assembly in circuit designs.

Technical Specifications

Power Field Effect Transistors (FET) STP300NH02L attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

1600 mJ

Minimum DS Breakdown Voltage:

24 V

Maximum Drain Current (Abs) (ID):

120 A

Maximum Drain Current (ID):

120 A

Maximum Drain-Source On Resistance:

.0022 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

480 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STP300NH02L Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20