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STP25NM60ND

STMicroelectronics

STP25NM60ND by STMicroelectronics

STP25NM60ND by STMicroelectronics is a powerful N-channel FET designed for switching applications. It features a 600V breakdown voltage, 21A max drain current, and 160W power dissipation. Ideal for high-efficiency power management in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,738 parts In-Stock

1+ parts

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8,738

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Digiode

USA . 3,119 parts In-Stock

1+ parts

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3,119

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Anansix

USA . 1,673 parts In-Stock

1+ parts

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1,673

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,307 parts In-Stock

1+ parts

$0.345

100+ parts

-

1k+ parts

$0.310

10k+ parts

-

1,307

$0.345

-

$0.310

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MKK Technologies

India . 15 parts In-Stock

1+ parts

$0.649

100+ parts

-

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15

$0.649

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DigiPath Technology Company

USA . 15 parts In-Stock

1+ parts

$0.649

100+ parts

-

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15

$0.649

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

1+ parts

$2.331

100+ parts

$2.121

1k+ parts

$1.911

10k+ parts

-

2,500

$2.331

$2.121

$1.911

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AZTECH Wire

Italy . 301 parts In-Stock

1+ parts

$19.090

100+ parts

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301

$19.090

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Kepictronics

USA . 6,500 parts In-Stock

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6,500

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Alle Elektronik GmbH

Germany . 4,961 parts In-Stock

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4,961

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A-Z Elektronik GmbH

Germany . 1,710 parts In-Stock

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1,710

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Perfect Parts

USA . 1,496 parts In-Stock

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1,496

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Corphita

USA . 1,202 parts In-Stock

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1,202

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Benley Electronics

USA . 350 parts In-Stock

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350

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Parana Technologies

USA . 155 parts In-Stock

1+ parts

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$0.412

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155

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$0.412

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Overview

Elevate your power management solutions with the STP25NM60ND from STMicroelectronics, a leader in innovative semiconductor technology. This N-channel FET delivers exceptional efficiency and reliability for demanding applications like industrial automation and renewable energy systems. With robust performance at high voltages and temperatures, you can trust this transistor to enhance your designs, ensuring long-lasting durability and optimized energy consumption. Choose STMicroelectronics for quality you can count on!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures a lightweight design while providing good insulation properties.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally offer higher efficiency and faster switching speeds compared to P-channel devices.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for safer operation and improved performance in applications requiring fast switching.

Transistor Application: SWITCHING

Ideal for switching applications, providing efficient control over electronic loads.

Minimum DS Breakdown Voltage: 600 V

A high breakdown voltage makes this FET suitable for high-voltage applications.

Package Shape: RECTANGULAR

The rectangular shape enables efficient use of PCB space and aligns well with standard mounting practices.

Terminal Form: THROUGH-HOLE

Through-hole mounting provides durability and stability for heavy-duty applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode allows for efficient operation with less power required to switch devices on or off.

Maximum Pulsed Drain Current (IDM): 84 A

High pulsed current capacity enables this FET to handle demanding operational spikes.

Avalanche Energy Rating (EAS): 850 mJ

A robust avalanche energy rating provides reliability in conditions where voltage spikes occur.

Maximum Drain Current (Abs) (ID): 21 A

Capable of handling significant continuous current, making it ideal for power applications.

No. of Terminals: 3

A compact design with three terminals allows for versatile circuit configurations and compact layouts.

Maximum Power Dissipation (Abs): 160 W

High power dissipation capabilities improve thermal performance in demanding applications.

Package Style (Meter): FLANGE MOUNT

Flange mounting provides enhanced mechanical stability and heat dissipation while ensuring secure connection to the PCB.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology offers low power consumption and high speed, making it suitable for modern applications.

Maximum Operating Temperature: 150 °C

A high operating temperature rating increases the FET's versatility and reliability in harsh environments.

Transistor Element Material: SILICON

Silicon provides optimal electrical properties and thermal conductivity for efficient power handling.

Terminal Finish: TIN

Tin finish enhances solderability and ensures reliable connections in electronic assemblies.

Maximum Drain Current (ID): 21 A

This rating indicates high performance capabilities for robust power management.

Maximum Drain-Source On Resistance: 0.16 ohm

Low on-resistance minimizes power losses during operation, enhancing overall efficiency.

Terminal Position: SINGLE

A single terminal position simplifies layout design and integration in various electronic circuits.

Technical Specifications

Power Field Effect Transistors (FET) STP25NM60ND attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

850 mJ

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (Abs) (ID):

21 A

Maximum Drain Current (ID):

21 A

Maximum Drain-Source On Resistance:

.16 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

84 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STP25NM60ND Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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